公开(公告)号：US20240278645A1

公开(公告)日：2024-08-22

申请号：US18652629

申请日：2024-05-01

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Matthias GOLDBACH ,  Stefan Grötsch ,  Lugwig Hofbauer ,  Sebastian Wittmann ,  Robert Regensburger ,  Thomas Schwarz ,  Michael Brandl ,  Andreas Dobner ,  Sebastian Stigler

IPC: B60K35/00 ,  B60K35/60 ,  H01B3/30 ,  H01B7/00 ,  H01B13/10 ,  H01L33/62

CPC classification number: B60K35/00 ,  H01B3/30 ,  H01B7/0018 ,  H01B13/103 ,  H01L33/62 ,  B60K35/60 ,  B60K2360/332 ,  B60K2360/47 ,  B60K2360/48 ,  B60K2360/785 ,  H01L2933/0066

Abstract: It is provided a window of a vehicle, optoelectronic circuits, in particular optoelectronic circuits for a window of a vehicle and a method for manufacturing a window of a vehicle including at least one optoelectronic component. It is further provided a display comprising at least one display module each comprising at least one optoelectronic array with a plurality of optoelectronic components, each optoelectronic component forming a pixel comprising at least one subpixel, in particular a μLED. In addition, a method for manufacturing a display module comprising at least one optoelectronic array with a plurality of optoelectronic components, each optoelectronic component forming a pixel comprising at least one subpixel, in particular a μLED, is provided.

公开(公告)号：US20230335690A1

公开(公告)日：2023-10-19

申请号：US18326801

申请日：2023-05-31

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Siegfried HERRMANN ,  Hubert Halbritter ,  Peter Brick ,  Thomas Schwarz ,  Laura Kreiner ,  Petrus Sundgren ,  Jean-Jacques Drolet ,  Michael Brandl ,  Xue Wang ,  Andreas Biebersdorf ,  Christoph Klemp ,  Ines Pietzonka ,  Julia Stolz ,  Simon Schwalenberg ,  Andreas Leber ,  Christine Rafael ,  Eva-Maria Rummel ,  Nicole Heitzer ,  Marie Assmann ,  Erwin Lang ,  Andreas Rausch ,  Marc Philippens ,  Karsten Diekmann ,  Stefan Illek ,  Christian Berger ,  Felix Feix ,  Ana Kanevce ,  Georg Bogner ,  Karl Engl

IPC: H01L33/52 ,  H01L33/50 ,  H01L33/60 ,  H01L33/04 ,  H01L25/075

CPC classification number: H01L33/52 ,  H01L33/502 ,  H01L33/60 ,  H01L33/04 ,  H01L25/0753 ,  B60K2370/1523 ,  B60K35/00

Abstract: The invention relates to various aspects of a μ-LED or a μ-LED array for augmented reality or lighting applications, in particular in the automotive field. The μ-LED is characterized by particularly small dimensions in the range of a few μm.

公开(公告)号：US20220149019A1

公开(公告)日：2022-05-12

申请号：US17541798

申请日：2021-12-03

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Michael Brandl ,  Andreas Dobner ,  Matthias Goldbach ,  Sebastian Wittmann ,  Uli Hiller ,  Markus Klein ,  Thomas Schwarz ,  Andreas Waldschik ,  Michael Wittmann ,  Matthias Bruckschloegl ,  Stefan Groetsch ,  Rainer Huber ,  Peter Brick ,  Ludwig Hofbauer

IPC: H01L25/075 ,  H01L33/46 ,  H01L33/62 ,  H01L33/64

Abstract: An optoelectronic device comprises a layer stack, which includes a carrier layer, a cover layer, and a first layer. The first layer is in particular an intermediate layer, arranged between the cover layer and the carrier layer. At least one electronic or optoelectronic element, in particular an optoelectronic light source, is arranged on the first layer and at least one layer of the layer stack and preferably all layers of the layer stack are at least partially transparent. The layer stack comprises at least one layer which comprises particles with a high thermal conductivity and/or at least one thermally conductive layer which is arranged between two adjacent layers of the layer stack.

公开(公告)号：US20170307177A1

公开(公告)日：2017-10-26

申请号：US15518019

申请日：2015-10-15

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Stefan Groetsch ,  Uli Hiller ,  Michael Brandl

IPC: F21V11/14 ,  B60Q1/14 ,  F21S8/10

CPC classification number: F21S41/692 ,  B60Q1/14 ,  F21S41/683 ,  F21V11/14 ,  G02B26/023

Abstract: A light assembly includes a light source, and a micromechanical shutter arrangement having a two-dimensional arrangement of closable shutter openings, wherein at least one shutter opening has a rectangular shape with a length and a width, and the length is greater than the width. The light assembly may be configured as a headlamp for a motor vehicle.

公开(公告)号：US09739452B2

公开(公告)日：2017-08-22

申请号：US14782673

申请日：2014-04-01

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Stefan Grötsch ,  Michael Brandl

IPC: B32B3/00 ,  F21V13/08 ,  H01L33/60 ,  H01L33/50 ,  H01L33/64 ,  F21Y115/30 ,  F21Y115/10 ,  F21Y115/15

CPC classification number: F21V13/08 ,  F21Y2115/10 ,  F21Y2115/15 ,  F21Y2115/30 ,  H01L33/507 ,  H01L33/60 ,  H01L33/644 ,  H01L2924/0002 ,  H01L2933/0041 ,  H01L2933/0058 ,  H01L2924/00

Abstract: A method of producing a conversion element includes providing a conversion body that converts electromagnetic radiation with regard to the wavelength thereof; applying an inorganic material to at least one portion of the conversion body; and forming a reflective layer that reflects the electromagnetic radiation and/or converted electromagnetic radiation with the inorganic material such that the inorganic material of the reflective layer enters into an adhesive connection with the conversion body.

公开(公告)号：US20150049502A1

公开(公告)日：2015-02-19

申请号：US14385987

申请日：2013-03-08

Applicant: OSRAM Opto Semiconductors Gmbh

Inventor： Michael Brandl ,  Ulrich Frei

IPC: H01L33/50 ,  F21S8/10 ,  H01L33/58

CPC classification number: H01L33/507 ,  B60Q2400/20 ,  F21S41/141 ,  F21S41/24 ,  F21S43/14 ,  H01L27/15 ,  H01L33/504 ,  H01L33/58 ,  H01L2924/0002 ,  H01L2924/00

Abstract: In at least one embodiment, the optoelectronic semiconductor chip includes a semiconductor layer sequence having an active layer configured to generate a primary radiation having a main wavelength less than 500 nm. The semiconductor chip contains a first conversion element configured to generate a first secondary radiation and a second conversion element configured to generate a second secondary radiation. The semiconductor layer sequence is divided into segments that can be controlled electrically independently of each other and that are arranged laterally adjacent to each other. The conversion elements are attached to main radiation sides of the segments. The first secondary radiation is colored light and the second secondary radiation white light.

Abstract translation: 在至少一个实施例中，光电子半导体芯片包括半导体层序列，其具有被配置为产生主波长小于500nm的主辐射的有源层。 半导体芯片包含被配置为产生第一次级辐射的第一转换元件和被配置为产生第二次级辐射的第二转换元件。 半导体层序列被分成可彼此电独立地控制并且彼此横向相邻布置的段。 转换元件连接到段的主辐射侧。 第一次级辐射为彩色光，第二次辐射为白光。