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公开(公告)号：US20220149019A1
公开(公告)日：2022-05-12
申请号：US17541798
申请日：2021-12-03
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Michael Brandl , Andreas Dobner , Matthias Goldbach , Sebastian Wittmann , Uli Hiller , Markus Klein , Thomas Schwarz , Andreas Waldschik , Michael Wittmann , Matthias Bruckschloegl , Stefan Groetsch , Rainer Huber , Peter Brick , Ludwig Hofbauer
IPC: H01L25/075 , H01L33/46 , H01L33/62 , H01L33/64
Abstract: An optoelectronic device comprises a layer stack, which includes a carrier layer, a cover layer, and a first layer. The first layer is in particular an intermediate layer, arranged between the cover layer and the carrier layer. At least one electronic or optoelectronic element, in particular an optoelectronic light source, is arranged on the first layer and at least one layer of the layer stack and preferably all layers of the layer stack are at least partially transparent. The layer stack comprises at least one layer which comprises particles with a high thermal conductivity and/or at least one thermally conductive layer which is arranged between two adjacent layers of the layer stack.
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公开(公告)号：US20160308102A1
公开(公告)日：2016-10-20
申请号：US15102904
申请日：2014-12-10
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor： Michael Zitzlsperger , Matthias Goldbach
CPC classification number: H01L33/62 , H01L33/486 , H01L33/54 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48471 , H01L2224/48479 , H01L2924/00014 , H01L2933/0033 , H01L2933/005 , H01L2933/0066 , H01L2224/4554
Abstract: An optoelectronic component includes a leadframe, a molded body connected to the leadframe, and an optoelectronic semiconductor chip arranged on the leadframe, wherein the leadframe includes an alignment opening, and wherein the molded body includes a recess via which the leadframe is exposed in the area of the alignment opening.
Abstract translation: 光电子部件包括引线框架，连接到引线框架的成型体和布置在引线框架上的光电子半导体芯片，其中引线框架包括对准开口，并且其中模制主体包括凹部，引线框架经由该凹槽暴露在区域中 的对齐开口。
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