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    Surface mounted micro-scale springs for separable interconnection of package substrate and high-speed flex-circuit
    11.
    发明授权
    Surface mounted micro-scale springs for separable interconnection of package substrate and high-speed flex-circuit 有权
    表面安装微型弹簧，用于封装基板和高速柔性电路的可分离互连

    公开(公告)号：US07517228B2

    公开(公告)日：2009-04-14

    申请号：US11315981

    申请日：2005-12-22

    Applicant: Rajashree Baskaran ,  Henning Braunisch

    Inventor： Rajashree Baskaran ,  Henning Braunisch

    IPC: H01R12/00

    CPC classification number: H05K3/365 ,  H01R12/79 ,  H05K1/147 ,  H05K3/222 ,  H05K3/326 ,  H05K7/1092 ,  H05K2201/0311 ,  H05K2201/10977 ,  H05K2203/049

    Abstract: An integrated circuit may be coupled to a printed circuit board through a split socket. The integrated circuit may be packaged with a package substrate electrically coupled to a socket which, in turn, is electrically coupled to a printed circuit board. Between the printed circuit board and the package substrate, on the same side as the package substrate as the socket, may be positioned a flexible substrate. The flexible substrate may include a flexible sheet-like member made of a polymer, in one embodiment, and a plurality of microscale springs which electrically couple said flexible substrate to the package substrate.

    Abstract translation: 集成电路可以通过分离插座耦合到印刷电路板。 集成电路可以与电连接到插座的封装基板封装，该插座又电连接到印刷电路板。 在印刷电路板和封装基板之间，与作为插座的封装基板相同的一侧可以设置为柔性基板。 柔性基板可以包括在一个实施例中由聚合物制成的柔性片状构件和将所述柔性基板电耦合到封装基板的多个微型弹簧。

    Semiconductor substrate with islands of diamond and resulting devices
    12.
    发明申请
    Semiconductor substrate with islands of diamond and resulting devices 有权
    具有金刚石岛和结晶器件的半导体衬底

    公开(公告)号：US20090065788A1

    公开(公告)日：2009-03-12

    申请号：US12291233

    申请日：2008-11-07

    Applicant: Rajashree Baskaran ,  Kramadhati V. Ravi

    Inventor： Rajashree Baskaran ,  Kramadhati V. Ravi

    IPC: H01L31/0312

    CPC classification number: H01L21/0405 ,  H01L21/4871 ,  H01L23/3732 ,  H01L23/433 ,  H01L2924/0002 ,  H01L2924/15311 ,  H01L2924/00

    Abstract: Disclosed is a method of forming a substrate having islands of diamond (or other material, such as diamond-like carbon), as well as integrated circuit devices formed from such a substrate. A diamond island can form part of the thermal solution for an integrated circuit formed on the substrate, and the diamond island can also provide part of a stress engineering solution to improve performance of the integrated circuit. Other embodiments are described and claimed.

    Abstract translation: 公开了一种形成具有金刚石（或其他材料，例如类金刚石碳）岛的衬底的方法以及由这种衬底形成的集成电路器件。 金刚石岛可以形成在基板上形成的集成电路的热解解的一部分，并且金刚石岛还可以提供部分应力工程解决方案以改善集成电路的性能。 描述和要求保护其他实施例。

    Surface mounted micro-scale springs for separable interconnection of package substrate and high-speed flex-circuit
    13.
    发明申请
    Surface mounted micro-scale springs for separable interconnection of package substrate and high-speed flex-circuit 有权
    表面安装微型弹簧，用于封装基板和高速柔性电路的可分离互连

    公开(公告)号：US20070149000A1

    公开(公告)日：2007-06-28

    申请号：US11315981

    申请日：2005-12-22

    Applicant: Rajashree Baskaran ,  Henning Braunisch

    Inventor： Rajashree Baskaran ,  Henning Braunisch

    IPC: H05K1/00

    CPC classification number: H05K3/365 ,  H01R12/79 ,  H05K1/147 ,  H05K3/222 ,  H05K3/326 ,  H05K7/1092 ,  H05K2201/0311 ,  H05K2201/10977 ,  H05K2203/049

    Abstract: An integrated circuit may be coupled to a printed circuit board through a split socket. The integrated circuit may be packaged with a package substrate electrically coupled to a socket which, in turn, is electrically coupled to a printed circuit board. Between the printed circuit board and the package substrate, on the same side as the package substrate as the socket, may be positioned a flexible substrate. The flexible substrate may include a flexible sheet-like member made of a polymer, in one embodiment, and a plurality of microscale springs which electrically couple said flexible substrate to the package substrate.

    Abstract translation: 集成电路可以通过分离插座耦合到印刷电路板。 集成电路可以与电连接到插座的封装基板封装，该插座又电连接到印刷电路板。 在印刷电路板和封装基板之间，与作为插座的封装基板相同的一侧可以设置为柔性基板。 柔性基板可以包括在一个实施例中由聚合物制成的柔性片状构件和将所述柔性基板电耦合到封装基板的多个微型弹簧。

    MULTIMODAL HAPTIC EFFECT SYSTEM
    15.
    发明申请
    MULTIMODAL HAPTIC EFFECT SYSTEM 有权
    多模式生理效应系统

    公开(公告)号：US20150378434A1

    公开(公告)日：2015-12-31

    申请号：US14314806

    申请日：2014-06-25

    Applicant: Rajashree Baskaran

    Inventor： Rajashree Baskaran

    IPC: G06F3/01

    CPC classification number: G06F3/016

    Abstract: A device to output a haptic effect includes a haptic effect generator comprising one or more microdroplets of a fluid configured to output a haptic effect, and a substrate configured to control movement of the one or more microdroplets of fluid. The device further includes an actuator coupled to the haptic effect generator configured to exert one or more forces on the substrate to cause the one or more microdroplets of fluid to output the haptic effect.

    Abstract translation: 用于输出触觉效果的装置包括触觉效果发生器，其包括被配置为输出触觉效果的流体的一个或多个微滴，以及被配置为控制流体的一个或多个微滴的运动的基板。 该装置还包括耦合到触觉效应发生器的致动器，其构造成在衬底上施加一个或多个力，以使流体的一个或多个微滴输出触觉效果。

    MULTIGATE RESONANT CHANNEL TRANSISTOR
    16.
    发明申请
    MULTIGATE RESONANT CHANNEL TRANSISTOR 有权
    多通道谐振通道晶体管

    公开(公告)号：US20140292429A1

    公开(公告)日：2014-10-02

    申请号：US13994714

    申请日：2013-03-28

    Applicant: Sasikanth Manipatruni ,  Raseong Kim ,  Rajashree Baskaran ,  Rajeev K. Dokania ,  Ian A. Young

    Inventor： Sasikanth Manipatruni ,  Raseong Kim ,  Rajashree Baskaran ,  Rajeev K. Dokania ,  Ian A. Young

    IPC: B81B3/00 ,  H03B5/30 ,  B81C1/00

    CPC classification number: H03B5/30 ,  H01L29/66795 ,  H01L29/7831 ,  H01L2924/13067 ,  H01L2924/13084

    Abstract: An embodiment includes an oscillator comprising an amplifier formed on a substrate; a multiple gate resonant channel array, formed on the substrate, including: (a) transistors including fins, each of the fins having a channel between source and drain nodes, coupled to common source and drain contacts; and (b) common first and second tri-gates coupled to each of the fins and located between the source and drain contacts; wherein the fins mechanically resonate at a first frequency when one of the first and second tri-gates is periodically activated to produce periodic downward forces on the fins. Other embodiments include a non planar transistor with a channel between the source and drain nodes and a tri-gate on the fin; wherein the fin mechanically resonates when the first tri-gate is periodically activated to produce periodic downward forces on the fin. Other embodiments are described herein.

    Abstract translation: 实施例包括：振荡器，包括形成在基板上的放大器; 形成在所述衬底上的多栅极共振沟道阵列包括：（a）包括鳍片的晶体管，每个鳍片在源极和漏极节点之间具有耦合到共源极和漏极触点的沟道; 和（b）共同的第一和第二三栅极，其耦合到每个散热片并且位于源极和漏极接触之间; 其中当第一和第二三门中的一个被周期性地激活以在翅片上产生周期性向下的力时，翅片以第一频率机械共振。 其他实施例包括在源极和漏极节点之间具有沟道的非平面晶体管和鳍上的三栅极; 其中当所述第一三栅极被周期性地激活以在所述散热片上产生周期性向下的力时，所述翅片机械谐振。 本文描述了其它实施例。

    Forming a thin film electric cooler and structures formed thereby
    19.
    发明授权
    Forming a thin film electric cooler and structures formed thereby 有权
    形成薄膜电冷却器和由此形成的结构

    公开(公告)号：US07902617B2

    公开(公告)日：2011-03-08

    申请号：US12148316

    申请日：2008-04-18

    Applicant: Rajashree Baskaran

    Inventor： Rajashree Baskaran

    IPC: H01L43/06

    CPC classification number: H01L27/16 ,  H01L21/4882 ,  H01L23/38 ,  H01L27/12 ,  H01L2924/0002 ,  Y10S257/93 ,  H01L2924/00

    Abstract: Methods of forming a microelectronic structure are described. Embodiments of those methods include forming a first plurality of openings through a first surface of a substrate, forming a p-type TFTEC material within the first plurality of openings, forming a second plurality of openings substantially adjacent to the first plurality of openings through the first surface of the substrate, and then forming an n-type TFTEC material within the second plurality of openings.

    Abstract translation: 描述形成微电子结构的方法。 这些方法的实施例包括通过基板的第一表面形成第一多个开口，在第一多个开口内形成p型TFTEC材料，形成基本上邻近第一多个开口的第二多个开口，穿过第一 然后在第二多个开口内形成n型TFTEC材料。

    Semiconductor substrate with islands of diamond and resulting devices
    20.
    发明授权
    Semiconductor substrate with islands of diamond and resulting devices 有权
    具有金刚石岛和结晶器件的半导体衬底

    公开(公告)号：US07875934B2

    公开(公告)日：2011-01-25

    申请号：US12291233

    申请日：2008-11-07

    Applicant: Rajashree Baskaran ,  Kramadhati V. Ravi

    Inventor： Rajashree Baskaran ,  Kramadhati V. Ravi

    IPC: H01L21/00

    CPC classification number: H01L21/0405 ,  H01L21/4871 ,  H01L23/3732 ,  H01L23/433 ,  H01L2924/0002 ,  H01L2924/15311 ,  H01L2924/00

    Abstract: Disclosed is a method of forming a substrate having islands of diamond (or other material, such as diamond-like carbon), as well as integrated circuit devices formed from such a substrate. A diamond island can form part of the thermal solution for an integrated circuit formed on the substrate, and the diamond island can also provide part of a stress engineering solution to improve performance of the integrated circuit. Other embodiments are described and claimed.

    Abstract translation: 公开了一种形成具有金刚石（或其他材料，例如类金刚石碳）岛的衬底的方法以及由这种衬底形成的集成电路器件。 金刚石岛可以形成在基板上形成的集成电路的热解解的一部分，并且金刚石岛还可以提供部分应力工程解决方案以改善集成电路的性能。 描述和要求保护其他实施例。

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