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    MULTILAYER CERAMIC CAPACITOR
    11.
    发明申请
    MULTILAYER CERAMIC CAPACITOR 有权
    多层陶瓷电容器

    公开(公告)号：US20150124370A1

    公开(公告)日：2015-05-07

    申请号：US14209420

    申请日：2014-03-13

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Young Ghyu AHN ,  Sang Soo PARK ,  Hwi Geun IM ,  Hyun Tae KIM ,  Soon Ju LEE ,  Heung Kil PARK ,  Byoung Hwa LEE ,  Min Cheol PARK

    IPC: H01G4/224 ,  H01G4/232

    CPC classification number: H01G4/224 ,  H01G4/12 ,  H01G4/228 ,  H01G4/232 ,  H01G4/30

    Abstract: A multilayer ceramic capacitor may include a ceramic body having a plurality of dielectric layers; first and second internal electrodes disposed in the ceramic body to be alternately exposed to the first and second end surfaces of the ceramic body, having the dielectric layers interposed therebetween; and first and second external electrodes electrically connected to the first and second internal electrodes, respectively. The first and second external electrodes may include: first and second internal conductive layers; first and second insulating layers; and first and second external conductive layers.

    Abstract translation: 多层陶瓷电容器可以包括具有多个电介质层的陶瓷体; 设置在陶瓷体中的第一和第二内部电极交替地暴露于陶瓷体的第一和第二端面，其间插入介电层; 以及分别与第一和第二内部电极电连接的第一和第二外部电极。 第一和第二外部电极可以包括：第一和第二内部导电层; 第一和第二绝缘层; 以及第一和第二外部导电层。

    LAMINATED ELECTRONIC COMPONENT AND CIRCUIT BOARD FOR MOUNTING THE SAME
    12.
    发明申请
    LAMINATED ELECTRONIC COMPONENT AND CIRCUIT BOARD FOR MOUNTING THE SAME 审中-公开
    层叠电子元件和电路板，用于安装它们

    公开(公告)号：US20170011854A1

    公开(公告)日：2017-01-12

    申请号：US15065521

    申请日：2016-03-09

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Soo Hwan SON ,  Seung Hyun RA ,  Kyoung Jin JUN ,  Sang Soo PARK ,  Young Key KIM ,  Soon Ju LEE

    IPC: H01G4/38 ,  H01G4/12 ,  H05K1/11 ,  H01G4/30 ,  H05K1/18 ,  H01G4/012 ,  H01G4/228

    CPC classification number: H01G4/38 ,  H01G2/065 ,  H01G4/012 ,  H01G4/12 ,  H01G4/232 ,  H01G4/30 ,  H05K1/117 ,  H05K1/181 ,  H05K2201/10015

    Abstract: A laminated electronic component includes a first capacitor including a first ceramic body, first external electrodes disposed on upper and lower surfaces of the first ceramic body, and second external electrodes disposed apart from the first external electrodes on the upper and lower surfaces of the first ceramic body, and a second capacitor including a second ceramic body, a third external electrode disposed on a lower surface of the second ceramic body, and a fourth external electrode disposed apart from the third external electrode on the lower surface of the second ceramic body, and disposed on the first capacitor and electrically connected to the first capacitor. A current loop passing through the upper surface of the first ceramic body and the lower surface of the second ceramic body is formed.

    Abstract translation: 层叠电子部件包括：第一电容器，包括第一陶瓷体，设置在第一陶瓷体的上表面和下表面上的第一外部电极;以及第一外部电极，设置在第一陶瓷的上表面和下表面上的第一外部电极 以及包括第二陶瓷体的第二电容器和设置在第二陶瓷体的下表面上的第三外部电极和在第二陶瓷体的下表面上与第三外部电极分离的第四外部电极，以及 设置在第一电容器上并电连接到第一电容器。 形成通过第一陶瓷体的上表面和第二陶瓷体的下表面的电流环。

    MULTILAYER CERAMIC COMPONENT AND BOARD HAVING THE SAME
    13.
    发明申请
    MULTILAYER CERAMIC COMPONENT AND BOARD HAVING THE SAME 有权
    多层陶瓷组件和板

    公开(公告)号：US20160217928A1

    公开(公告)日：2016-07-28

    申请号：US14940946

    申请日：2015-11-13

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Heung Kil PARK ,  Young Ghyu AHN ,  Sang Soo PARK ,  Soon Ju LEE ,  Kyoung Jin JUN ,  So Yeon SONG

    IPC: H01G4/30 ,  H05K1/18 ,  H05K1/11 ,  H01G4/005

    CPC classification number: H05K1/111 ,  H01G2/06 ,  H01G4/228

    Abstract: A multilayer ceramic component includes a multilayer ceramic capacitor including a ceramic body including a plurality of first and second internal electrodes having respective dielectric layers interposed therebetween, and first and second external electrodes respectively including first and second connection portions, and first and second band portions extended from the first and second connection portions, and first and second metal frames respectively including first and second upper horizontal portions, first and second lower horizontal portions, and first and second inclined support portions diagonally connecting the first and second upper horizontal portions and the first and second lower horizontal portions, respectively.

    Abstract translation: 多层陶瓷组件包括多层陶瓷电容器，其包括陶瓷体，陶瓷体包括介于其间的各介电层的多个第一和第二内部电极，以及分别包括第一和第二连接部分的第一和第二外部电极，以及第一和第二带状部分延伸 以及第一和第二金属框架，分别包括第一和第二上部水平部分，第一和第二下部水平部分，以及第一和第二倾斜支撑部分，其对角地连接第一和第二上部水平部分以及第一和第二上部水平部分， 分别为第二下部水平部分。

    MULTILAYER CERAMIC ELECTRONIC COMPONENT AND BOARD HAVING THE SAME
    14.
    发明申请
    MULTILAYER CERAMIC ELECTRONIC COMPONENT AND BOARD HAVING THE SAME 审中-公开
    多层陶瓷电子元件及其相应的板

    公开(公告)号：US20160126013A1

    公开(公告)日：2016-05-05

    申请号：US14880049

    申请日：2015-10-09

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Heung Kil PARK ,  Kyoung Jin JUN ,  Soon Ju LEE ,  So Yeon SONG

    IPC: H01G4/12 ,  H01G4/248 ,  H01G4/30 ,  H01G4/012 ,  H05K1/18 ,  H05K1/11

    CPC classification number: H01G4/012 ,  H01G4/232 ,  H01G4/30 ,  H05K3/3442 ,  H05K2201/10015 ,  H05K2201/2045

    Abstract: A multilayer ceramic electronic component includes: a plurality of active parts disposed to be distinguishable from each other in a stacking direction, wherein internal electrodes of an upper active part include protrusion portions which correspond to band portions of external electrodes and extend in a width direction, and internal electrodes of a lower active part positioned to be adjacent to a mounting surface include recess portions which correspond to the band portions of the external electrodes and are recessed in the width direction.

    Abstract translation: 多层陶瓷电子部件包括：多个有源部，其被布置为在层叠方向上彼此区分，其中，上部有源部的内部电极包括与外部电极的带状部分对应并在宽度方向上延伸的突出部， 位于与安装面相邻的下部有源部的内部电极具有与外部电极的带状部分对应且在宽度方向上凹陷的凹部。

    MULTILAYER CERAMIC CAPACITOR AND BOARD HAVING THE SAME MOUNTED THEREON
    17.
    发明申请
    MULTILAYER CERAMIC CAPACITOR AND BOARD HAVING THE SAME MOUNTED THEREON 有权
    多层陶瓷电容器及其安装板

    公开(公告)号：US20140367152A1

    公开(公告)日：2014-12-18

    申请号：US14259011

    申请日：2014-04-22

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Byoung Hwa LEE ,  Heung Kil PARK ,  Kyo Kwang LEE ,  Young Ghyu AHN ,  Sang Soo PARK ,  Soon Ju LEE

    IPC: H05K1/11 ,  H01G4/30

    CPC classification number: H05K1/111 ,  H01G4/12 ,  H01G4/1209 ,  H01G4/232 ,  H01G4/30 ,  H05K3/3442 ,  H05K2201/09709 ,  H05K2201/0979 ,  H05K2201/10015 ,  H05K2201/2045 ,  Y02P70/611

    Abstract: A multilayer ceramic capacitor may include: a ceramic body including dielectric layers and having first and second main surfaces opposing each other, first and second side surfaces opposing each other, and first and second end surfaces opposing each other; an active layer configured to form capacitance by including first and second internal electrodes facing each other with one dielectric layer therebetween and alternately exposed to the first or second side surface; upper and lower cover layers disposed on and below the active layer; and a first external electrode disposed on the first side surface and a second external electrode disposed on the second side surface. Thickness T and width W of the ceramic body satisfy 0.75W≦T≦1.25W, gap G between the first and second external electrodes satisfies 30 μm≦G≦0.9W, and an average number of dielectric grains in a single dielectric layer in a thickness direction thereof is 2 or greater.

    Abstract translation: 多层陶瓷电容器可以包括：陶瓷体，其包括电介质层，并且具有彼此相对的第一和第二主表面，彼此相对的第一和第二侧表面以及彼此相对的第一和第二端面; 有源层，被配置为通过包括彼此面对的第一和第二内部电极并且在其间具有一个介电层并交替地暴露于第一或第二侧表面而形成电容; 设置在有源层上和下面的上和下覆盖层; 以及设置在第一侧表面上的第一外部电极和设置在第二侧表面上的第二外部电极。 陶瓷体的厚度T和宽度W满足0.75W＆nlE; T＆nlE; 1.25W，第一和第二外部电极之间的间隙G满足30μm＆lt; NlE; G＆nlE; 0.9W，以及单个介电层中的平均电介质颗粒数 厚度方向为2以上。

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