公开(公告)号：US20160118187A1

公开(公告)日：2016-04-28

申请号：US14601179

申请日：2015-01-20

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Young Ghyu AHN ,  Young Key KIM ,  Byoung Hwa LEE ,  Min Cheol PARK

IPC: H01G2/16 ,  H01G4/30 ,  H01G4/228 ,  H01G4/232 ,  H01G4/12 ,  H01G4/012

CPC classification number: H01G2/16 ,  H01G4/1227 ,  H01G4/232 ,  H01G4/30 ,  H01G4/40

Abstract: A multilayer ceramic capacitor includes: a ceramic body; first and second internal electrodes disposed so as to be alternately exposed to both end surfaces of the ceramic body with each of dielectric layers; first and second external electrodes formed so as to be extended onto portions of one main surface of the ceramic body, respectively; third and fourth external electrodes formed on both side surfaces of the ceramic body, respectively, so as to be extended onto portions of both main surfaces of the ceramic body, respectively; an intermitting part connecting the third and fourth external electrodes to one another; first and second land patterns formed so as to be connected to the first and third external electrodes, respectively; and a third land pattern formed so as to be connected to both of the second and fourth external electrodes.

Abstract translation: 一种多层陶瓷电容器包括：陶瓷体; 第一和第二内部电极，被设置为与电介质层中的每一个交替地暴露于陶瓷体的两个端面; 形成为分别延伸到陶瓷体的一个主表面的部分上的第一和第二外部电极; 分别形成在陶瓷体的两个侧表面上的第三和第四外部电极，以分别延伸到陶瓷体的两个主表面的部分上; 将第三外部电极和第四外部电极彼此连接的间隔部分; 第一和第二焊盘图案分别形成为连接到第一和第三外部电极; 以及形成为连接到第二外部电极和第二外部电极的第三焊盘图案。

公开(公告)号：US20160099093A1

公开(公告)日：2016-04-07

申请号：US14672040

申请日：2015-03-27

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jae Hoon LEE ,  Jung Min NAM ,  Young Key KIM ,  Hae In KIM

IPC: H01C1/148 ,  H05K1/18 ,  H05K1/11

CPC classification number: H05K1/181 ,  H01C1/012 ,  H01C1/142 ,  H05K1/111 ,  H05K2201/10022 ,  H05K2201/10636 ,  Y02P70/611

Abstract: A multi-terminal electronic component includes: a base material; a resistance layer disposed on a surface of the base material; a first terminal and a second terminal disposed to be spaced apart from each other while covering portions of the resistance layer, respectively; and a third terminal disposed between the first terminal and the second terminal and covering a portion of the resistance layer, wherein first and second side surfaces of the base material opposing each other are exposed from the first through third terminals.

Abstract translation: 多端子电子部件包括：基材; 设置在所述基材的表面上的电阻层; 第一端子和第二端子，分别设置成彼此间隔开，同时覆盖电阻层的部分; 以及第三端子，其设置在所述第一端子和所述第二端子之间并且覆盖所述电阻层的一部分，其中所述基材相对的第一和第二侧表面从所述第一至第三端子露出。

公开(公告)号：US20160027582A1

公开(公告)日：2016-01-28

申请号：US14526473

申请日：2014-10-28

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Young Ghyu AHN ,  Young Key KIM ,  Byoung Hwa LEE ,  Min Cheol PARK

IPC: H01G4/30 ,  H01G4/012 ,  H01G2/06 ,  H01G4/12

CPC classification number: H01G4/30 ,  H01G2/065 ,  H01G4/012 ,  H01G4/12 ,  H01G4/232

Abstract: A multilayer ceramic capacitor may include: a ceramic body; first and second external electrodes disposed on a mounting surface of the ceramic body; third and fourth external electrodes disposed on a surface of the ceramic body opposing the mounting surface; a first active layer including first and second internal electrodes alternately exposed through the mounting surface of the ceramic body and the surface of the ceramic body opposing the mounting surface and connected to the first and third external electrodes, respectively; a second active layer including third and fourth internal electrodes alternately exposed through the mounting surface of the ceramic body and the surface of the ceramic body opposing the mounting surface and connected to the second and fourth external electrodes, respectively; and an intermittent part disposed on the surface of the ceramic body opposing the mounting surface and connecting the third and fourth external electrodes to each other.

Abstract translation: 多层陶瓷电容器可以包括：陶瓷体; 第一外部电极和第二外部电极，设置在陶瓷体的安装表面上; 设置在与安装表面相对的陶瓷体的表面上的第三和第四外部电极; 第一有源层，包括通过陶瓷体的安装表面交替暴露的第一和第二内部电极以及陶瓷体的与安装表面相对的表面，分别连接到第一和第三外部电极; 第二有源层，包括通过陶瓷体的安装表面交替地暴露的第三和第四内部电极以及陶瓷体的与安装表面相对的表面，分别连接到第二和第四外部电极; 以及设置在陶瓷体的与安装表面相对的表面上并将第三和第四外部电极彼此连接的间歇部分。

公开(公告)号：US20180315810A1

公开(公告)日：2018-11-01

申请号：US15896320

申请日：2018-02-14

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Doo Ho YOO ,  Jung Il KIM ,  Young Key KIM ,  Jung Min NAM

IPC: H01L49/02 ,  H05K1/16 ,  H01L23/10 ,  H01L23/31

CPC classification number: H01L28/20 ,  H01L23/10 ,  H01L23/3114 ,  H05K1/167

Abstract: A chip resistor includes a base substrate having a first surface and a second surface opposing each other, two side surfaces connecting the first surface and the second surface, and two end surfaces connecting the first surface and the second surface, a resistive layer disposed on the second surface of the base substrate, the resistive layer having a first surface in contact with the base substrate and a second surface opposing the first surface of the resistive layer, a first terminal and a second terminal spaced apart from each other and each being connected to the resistive layer on the second surface of the resistive layer, and a third terminal connected to the resistive layer on the second surface of the resistive layer, disposed between the first terminal and the second terminal, and extending to the first surface of the base substrate along the side surfaces.

公开(公告)号：US20170011854A1

公开(公告)日：2017-01-12

申请号：US15065521

申请日：2016-03-09

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Soo Hwan SON ,  Seung Hyun RA ,  Kyoung Jin JUN ,  Sang Soo PARK ,  Young Key KIM ,  Soon Ju LEE

IPC: H01G4/38 ,  H01G4/12 ,  H05K1/11 ,  H01G4/30 ,  H05K1/18 ,  H01G4/012 ,  H01G4/228

CPC classification number: H01G4/38 ,  H01G2/065 ,  H01G4/012 ,  H01G4/12 ,  H01G4/232 ,  H01G4/30 ,  H05K1/117 ,  H05K1/181 ,  H05K2201/10015

Abstract: A laminated electronic component includes a first capacitor including a first ceramic body, first external electrodes disposed on upper and lower surfaces of the first ceramic body, and second external electrodes disposed apart from the first external electrodes on the upper and lower surfaces of the first ceramic body, and a second capacitor including a second ceramic body, a third external electrode disposed on a lower surface of the second ceramic body, and a fourth external electrode disposed apart from the third external electrode on the lower surface of the second ceramic body, and disposed on the first capacitor and electrically connected to the first capacitor. A current loop passing through the upper surface of the first ceramic body and the lower surface of the second ceramic body is formed.

Abstract translation: 层叠电子部件包括：第一电容器，包括第一陶瓷体，设置在第一陶瓷体的上表面和下表面上的第一外部电极;以及第一外部电极，设置在第一陶瓷的上表面和下表面上的第一外部电极 以及包括第二陶瓷体的第二电容器和设置在第二陶瓷体的下表面上的第三外部电极和在第二陶瓷体的下表面上与第三外部电极分离的第四外部电极，以及 设置在第一电容器上并电连接到第一电容器。 形成通过第一陶瓷体的上表面和第二陶瓷体的下表面的电流环。

公开(公告)号：US20160125981A1

公开(公告)日：2016-05-05

申请号：US14931684

申请日：2015-11-03

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Hae In KIM ,  Jung Min NAM ,  Jea Hoon LEE ,  Young Key KIM

IPC: H01C1/14 ,  H01C17/065 ,  H01C17/28

CPC classification number: H01C1/14 ,  H01C1/01 ,  H01C7/003 ,  H01C17/281 ,  H05K1/181 ,  H05K3/3431 ,  H05K2201/10022 ,  H05K2201/10045 ,  Y02P70/611

Abstract: A resistor includes: a base substrate; a resistance layer disposed on one surface of the base substrate; first and second electrode layers disposed to be spaced apart from each other and covering portions of the resistance layer; and a third electrode layer disposed between the first and second electrode layers to be spaced apart from the first and second electrode layers and covering a portion of the resistance layer.

Abstract translation: 电阻器包括：基底; 电阻层，设置在所述基底基板的一个表面上; 第一和第二电极层设置成彼此间隔开并覆盖电阻层的部分; 以及第三电极层，设置在第一和第二电极层之间，与第一和第二电极层间隔开并覆盖电阻层的一部分。

公开(公告)号：US20140292474A1

公开(公告)日：2014-10-02

申请号：US14219798

申请日：2014-03-19

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Heung Bok RYU ,  Dong Hyun LEE ,  Ha Sung HWANG ,  Jung Il KIM ,  Young Key KIM

IPC: H01C1/012 ,  H01C1/14

CPC classification number: H01C1/012 ,  H01C1/14 ,  H01C1/16 ,  H01C7/003 ,  H01C13/02

Abstract: Disclosed herein is a chip resistor in which a plurality of resistor bodies are configured in a single chip in a limited space in an electronic product. The chip resistor includes: a substrate; electrodes formed on each side surface of the substrate; and resistor bodies connected to the electrodes and formed on upper and lower surfaces of the substrate, such that a production cost thereof may be significantly reduced.

Abstract translation: 这里公开了一种芯片电阻器，其中在电子产品的有限空间中将多个电阻体构造成单个芯片。 芯片电阻器包括：基板; 形成在基板的每个侧表面上的电极; 以及连接到电极并形成在基板的上表面和下表面上的电阻体，使得其生产成本可以显着降低。

公开(公告)号：US20240145174A1

公开(公告)日：2024-05-02

申请号：US18410196

申请日：2024-01-11

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Young Ghyu AHN ,  Soo Hwan SON ,  Young Key KIM

IPC: H01G4/30 ,  H01G2/06 ,  H01G4/012 ,  H01G4/12 ,  H01G4/232

CPC classification number: H01G4/30 ,  H01G2/065 ,  H01G4/012 ,  H01G4/12 ,  H01G4/232

Abstract: A multilayer electronic component includes a body including a dielectric layer and an internal electrode, an external electrode disposed outside the body, and an insulating layer disposed on the external electrode. The external electrode is disposed to cover an exposed surface of an outermost surface of the electrode layer, and is formed to have a thickness, equal to or less than a thickness of the body, and the insulating layer is disposed to cover an end of the external electrode, to improve moisture resistance reliability.

公开(公告)号：US20180315524A1

公开(公告)日：2018-11-01

申请号：US15835291

申请日：2017-12-07

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jung Min NAM ,  Doo Ho YOO ,  Young Key KIM

IPC: H01C1/148 ,  H01C1/01 ,  H01C1/142 ,  H05K1/16

CPC classification number: H01C1/148 ,  H01C1/01 ,  H01C1/142 ,  H01C7/00 ,  H05K1/167 ,  H05K3/3442 ,  H05K2201/10022

Abstract: A chip resistance element includes a base substrate having a first surface and a second surface opposing each other, two sides connecting the first surface and the second surface to each other, and two end surfaces connecting the first surface and the second surface to each other; a resistive layer disposed on the second surface; and a first terminal, a second terminal, and a third terminal disposed to be respectively connected to the resistive layer and to be separated from each other on the second surface. The third terminal having a second surface portion disposed between the first terminal and the second terminal on the second surface and a side portion connected to and disposed on one of the two sides of the base substrate.

公开(公告)号：US20150325370A1

公开(公告)日：2015-11-12

申请号：US14558717

申请日：2014-12-02

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Byoung Hwa LEE ,  Young Key KIM ,  Min Cheol PARK ,  Young Ghyu AHN

IPC: H01G2/14 ,  H01G4/12 ,  H01G4/008 ,  H01G4/248 ,  H01G4/012 ,  H01G2/16 ,  H01G4/30

CPC classification number: H01G2/14 ,  H01G2/16 ,  H01G4/008 ,  H01G4/012 ,  H01G4/1227 ,  H01G4/232 ,  H01G4/30

Abstract: A multilayer ceramic capacitor may include: a ceramic body; a plurality of first internal electrodes disposed in the ceramic body; a plurality of second internal electrodes stacked alternately with the first internal electrodes in the ceramic body; first and second external electrodes connected to the first internal electrodes, respectively; a third external electrode extended from one side surface of the ceramic body to a portion of a surface opposing a mounting surface of the ceramic body and connected to the second internal electrodes; a fourth external electrode extended from the other side surface of the ceramic body to a portion of the surface opposing the mounting surface of the ceramic body; and an intermitting part disposed on the surface opposing the mounting surface of the ceramic body and connecting the third and fourth external electrodes to each other.

Abstract translation: 多层陶瓷电容器可以包括：陶瓷体; 设置在所述陶瓷体中的多个第一内部电极; 与陶瓷体中的第一内部电极交替堆叠的多个第二内部电极; 分别连接到第一内部电极的第一和第二外部电极; 第三外部电极，从陶瓷体的一个侧表面延伸到与陶瓷体的安装表面相对的表面的与第二内部电极相连接的部分; 从陶瓷体的另一侧表面延伸到与陶瓷体的安装表面相对的表面的一部分的第四外部电极; 以及设置在与陶瓷体的安装面相对的表面上并将第三和第四外部电极彼此连接的间隔部分。