公开(公告)号：US12014978B2

公开(公告)日：2024-06-18

申请号：US16917410

申请日：2020-06-30

Applicant: SK hynix Inc.

Inventor： Sang Yong Lee ,  Sae Jun Kwon ,  Sang Min Kim ,  Jin Taek Park ,  Sang Hyun Oh

IPC: H01L23/52 ,  H01L23/48 ,  H01L23/522 ,  H01L27/11582 ,  H10B41/10 ,  H10B41/27 ,  H10B41/35 ,  H10B43/10 ,  H10B43/27 ,  H10B43/35

CPC classification number: H01L23/5226 ,  H01L23/481 ,  H10B41/10 ,  H10B41/27 ,  H10B41/35 ,  H10B43/10 ,  H10B43/27 ,  H10B43/35

Abstract: A semiconductor device includes a line; a source structure on the line; a stack structure on the source structure; a first slit structure penetrating the stack structure; a second slit structure penetrating the stack structure; and a contact plug adjacent to the first slit structure in a first direction. The first slit structure and the second slit structure may be spaced apart from each other by a first distance in a second direction that is perpendicular to the first direction. The contact plug penetrates the source structure, the contact plug being electrically connected to the lower line. The first slit structure and the contact plug may be spaced apart from each other by a second distance in the first direction, and the second distance may be longer than the first distance.

公开(公告)号：US09153557B2

公开(公告)日：2015-10-06

申请号：US14452323

申请日：2014-08-05

Applicant: SK HYNIX INC.

Inventor： Ki Jun Sung ,  Seung Jee Kim ,  Jong Hyun Nam ,  Sang Yong Lee ,  Young Geun Yoo

IPC: H01L23/00 ,  H01L25/065

CPC classification number: H01L25/0652 ,  H01L23/13 ,  H01L23/24 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/73 ,  H01L24/92 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/04105 ,  H01L2224/13009 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16235 ,  H01L2224/17181 ,  H01L2224/32225 ,  H01L2224/73253 ,  H01L2224/73259 ,  H01L2224/92224 ,  H01L2224/92242 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06548 ,  H01L2225/06562 ,  H01L2225/06589 ,  H01L2924/0002 ,  H01L2924/15156 ,  H01L2924/3511

Abstract: A chip stack embedded package includes a first dielectric layer having a multistep cavity therein, a first plurality of semiconductor chips disposed in a first level of the multistep cavity, a second plurality of semiconductor chips disposed in a second level of the multistep cavity, and a second dielectric layer filling the multistep cavity to cover the first and second pluralities of semiconductor chips.

Abstract translation: 芯片堆叠嵌入式封装包括其中具有多级空腔的第一介电层，设置在多级腔的第一级中的第一多个半导体芯片，设置在多级腔的第二级中的第二多个半导体芯片，以及 填充多阶空腔以覆盖第一和第二多个半导体芯片的第二介电层。

公开(公告)号：US09349764B1

公开(公告)日：2016-05-24

申请号：US14690304

申请日：2015-04-17

Applicant: SK hynix Inc.

Inventor： Sang Yong Lee ,  Seung Hyun Lee

IPC: H01L27/146

CPC classification number: H01L27/14618 ,  H01L27/14636

Abstract: An embedded image sensor package includes a core layer having a cavity therein, an image sensor chip disposed in the cavity and having a top surface on which a light receiver and connection members are disposed, a first insulation layer disposed on a top surface of the core layer and the top surface of the image sensor chip and having an opening that defines a light receiving area including the light receiver, a protection layer disposed between the light receiver and the first insulation layer to surround the light receiver, and a light transmission layer disposed on the light receiver. The protection layer is disposed along edges of the light receiving area. Related methods are also provided.

Abstract translation: 嵌入式图像传感器封装包括其中具有空腔的芯层，设置在空腔中的图像传感器芯片，并且具有设置有光接收器和连接构件的顶表面，设置在芯的顶表面上的第一绝缘层 层和图像传感器芯片的顶表面，并且具有限定包括光接收器的光接收区域的开口，设置在光接收器和第一绝缘层之间以围绕光接收器的保护层，以及布置的光透射层 在光接收机上。 保护层沿着光接收区域的边缘设置。 还提供了相关方法。

公开(公告)号：US09209150B2

公开(公告)日：2015-12-08

申请号：US14085357

申请日：2013-11-20

Applicant: SK hynix Inc.

Inventor： Sang Yong Lee ,  Qwan Ho Chung ,  Seung Jee Kim ,  Jong Hyun Nam ,  Si Han Kim

IPC: H01L23/48 ,  H01L23/00

CPC classification number: H01L24/25 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/24226 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/8203 ,  H01L2224/92244 ,  H01L2924/12042 ,  H01L2924/00

Abstract: Embedded packages are provided. The embedded package includes a chip attached to a first surface of a core layer, a plurality of bumps on a surface of the chip opposite to the core layer, and a first insulation layer surrounding the core layer, the chip and the plurality of bumps. The first insulation layer has a trench disposed in a portion of the first insulation layer to expose the plurality of bumps.

Abstract translation: 提供嵌入式软件包。 嵌入式封装包括附着到芯层的第一表面的芯片，与芯层相对的芯片表面上的多个凸起，以及围绕芯层，芯片和多个凸块的第一绝缘层。 第一绝缘层具有设置在第一绝缘层的一部分中以暴露多个凸块的沟槽。