Thin film transistor, array substrate and manufacturing method thereof, and display device

    公开(公告)号:US10204922B2

    公开(公告)日:2019-02-12

    申请号:US15303357

    申请日:2016-01-13

    Abstract: A metal oxide thin film transistor and a manufacturing method thereof, an array substrate and a manufacturing method thereof, and a display device are provided. The manufacturing method of the metal oxide thin film transistor includes forming a gate electrode (141), a gate insulating layer (130), an active layer (113) and source and drain electrodes (121, 122) of a thin film transistor on a base substrate. The active layer is prepared by using a metal oxide thin film, and an electrochemical oxidation process is performed on the metal oxide thin film during preparing the active layer, and the metal oxide thin film after the electrochemical oxidation process is patterned to form the active layer of the thin film transistor. By using the manufacturing method of the embodiment, oxygen vacancies of the metal oxide thin film can be reduced, a concentration of free carriers thereof can be controlled, the prepared thin film transistor has good stability, and it is not necessary to add additional photolithography process, slightly affecting the cost.

    Stretchable strain sensor based on vertical graphene and its application

    公开(公告)号:US12025437B2

    公开(公告)日:2024-07-02

    申请号:US17422693

    申请日:2019-09-23

    CPC classification number: G01B7/18 G01B1/00

    Abstract: A stretchable strain sensor based on vertical graphene having a stretch ratio of more than 50% and is capable of recognizing timbre with frequency greater than f hertz, f being 100, 800 or 2500, and having a sensitivity factor greater than 100 at 50% stretch, wherein the vertical graphene comprises a bottom plane layer and a vertical layer and contains high-density reticular cracks, wherein the directions of the cracks can be transverse, vertical and oblique directions, wherein the reticular cracks divide the vertical graphene into a plurality of small blocks, and adjacent small blocks are electrically connected through the vertical layer in stretched state, the cracks widen, but still can be bridged by the vertical layer, the two sides of the cracks still remain electrically connected, the sensor remains effective, wherein average diameter range of the plane of each small block is between 5 and 20 microns.

    TRANSPARENT CONDUCTIVE OXIDE THIN FILM AND APPLICATION THEREOF

    公开(公告)号:US20230377767A1

    公开(公告)日:2023-11-23

    申请号:US18229669

    申请日:2023-08-02

    CPC classification number: H01B1/08 H01B5/14

    Abstract: Disclosed is a transparent conductive oxide thin film. The metal oxide is a transparent conductive material of (In2O3)x(MO)y(ReO)z formed by doping a small amount of a rare earth oxide ReO into an indium-containing metal oxide MO—In2O3 as a photon-generated carrier conversion center. According to the present application, in an indium-based metal oxide, a rare earth oxide material is introduced, such that the carrier concentration is controlled, and the mobility is improved; rare earth ions in the rare earth oxide have the lower electronegativity, and an ionic bond Ln-O formed by the rare earth ions and oxygen ions has the higher bond breaking energy, such that the oxygen vacancy concentration in the In2O3 thin film may be effectively controlled. The rare earth ions have the ionic radius equivalent to that of indium ions, defect scattering caused by structure mismatch may be reduced, the high mobility characteristics thereof may be kept better.

    DISPLAY PANEL AND DISPLAY DEVICE
    18.
    发明申请

    公开(公告)号:US20230075372A1

    公开(公告)日:2023-03-09

    申请号:US17799519

    申请日:2021-02-08

    Abstract: Provided are a display panel and a display device. The display panel includes at least two display units. Each display unit includes a substrate, a flexible substrate, a light-emitting unit circuit layer and at least one driver chip. The rigid substrate includes a display bearing region and a splicing region located on at least one side of the display bearing region. The flexible substrate is located on a first surface of the rigid substrate and located in the display bearing region, and the flexible substrate at least partially extends out of the display bearing region of the rigid substrate. The light-emitting unit circuit layer is located on a surface of one side of the flexible substrate away from the rigid substrate and includes at least one bonding pad.

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