公开(公告)号：US20240379580A1

公开(公告)日：2024-11-14

申请号：US18314571

申请日：2023-05-09

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： JinHee Jung ,  ChangOh Kim

IPC: H01L23/552 ,  H01L21/56 ,  H01L23/31

Abstract: A semiconductor device has a substrate and an electrical component disposed over the substrate. An encapsulant is deposited over the electrical component and substrate. A shielding material, containing a plurality of spheres embedded in a matrix, is formed on the encapsulant. The shielding material 144 can be formed by spray coating, printing, liquid flow, or droplets. The spheres can have a curved or angled shape, e.g., circular, oval, or many flat or curved surfaces joining as a globe. The spheres each have a shell formed over a core. The shell can be a conductive material, while the core is an insulating material. Alternatively, the shell can be an insulating material, while the core is a conductive material. The shielding material scatters electromagnetic interference noise waves by reflection off the shell of the spheres. The shielding material can absorb electromagnetic interference noise waves into the core of the spheres.

公开(公告)号：US20240162103A1

公开(公告)日：2024-05-16

申请号：US18422759

申请日：2024-01-25

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： JinHee Jung ,  ChangOh Kim

IPC: H01L23/31 ,  H01L21/56 ,  H01L23/60 ,  H01L23/66

CPC classification number: H01L23/31 ,  H01L21/565 ,  H01L23/60 ,  H01L23/66

Abstract: A semiconductor device has an electronic component assembly with a substrate and a plurality of electrical components disposed over the substrate. A conductive post is formed over the substrate. A molding compound sheet is disposed over the electrical component assembly. A carrier including a first electrical circuit pattern is disposed over the molding compound sheet. The carrier is pressed against the molding compound sheet to dispose a first encapsulant over and around the electrical component assembly and embed the first electrical circuit pattern in the first encapsulant. A shielding layer can be formed over the electrical components assembly. The carrier is removed to expose the first electrical circuit pattern. A second encapsulant is deposited over the first encapsulant and the first electrical circuit pattern. A second electrical circuit pattern is formed over the second encapsulant. A semiconductor package is disposed over the first electrical circuit pattern.

公开(公告)号：US11862478B2

公开(公告)日：2024-01-02

申请号：US17806924

申请日：2022-06-14

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： ChangOh Kim ,  KyoungHee Park ,  JinHee Jung ,  OMin Kwon ,  JiWon Lee ,  YuJeong Jang

IPC: H01L21/683 ,  H01L21/48 ,  H01L23/31 ,  H01L23/498 ,  H01L23/552 ,  H01L23/544

CPC classification number: H01L21/4814 ,  H01L21/6835 ,  H01L23/3121 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/544 ,  H01L23/552 ,  H01L2221/6835 ,  H01L2221/68322 ,  H01L2223/54413

Abstract: A semiconductor device has a semiconductor package including a substrate with a land grid array. A component is disposed over the substrate. An encapsulant is deposited over the component. The land grid array remains outside the encapsulant. A metal mask having a fiducial marker is disposed over the land grid array. A shielding layer is formed over the semiconductor package. The metal mask is removed after forming the shielding layer.

公开(公告)号：US11756897B2

公开(公告)日：2023-09-12

申请号：US17308410

申请日：2021-05-05

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： ChangOh Kim ,  JinHee Jung ,  JiWon Lee ,  YuJeong Jang

IPC: H01L23/552 ,  H01L21/3213 ,  H01L25/065 ,  H01L23/31

CPC classification number: H01L23/552 ,  H01L21/32131 ,  H01L23/3107 ,  H01L25/0655

Abstract: A semiconductor device is formed by providing a semiconductor package including a shielding layer and forming a slot in the shielding layer using a laser. The laser is turned on and exposed to the shielding layer with a center of the laser disposed over a first point of the shielding layer. The laser is moved in a loop while the laser remains on and exposed to the shielding layer. Exposure of the laser to the shielding layer is stopped when the center of the laser is disposed over a second point of the shielding layer. A distance between the first point and the second point is approximately equal to a radius of the laser.

公开(公告)号：US11749668B2

公开(公告)日：2023-09-05

申请号：US17343402

申请日：2021-06-09

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： ChangOh Kim ,  JinHee Jung

IPC: H01L25/00 ,  H01L21/78 ,  H01L21/56 ,  H01L25/065 ,  H01L23/552

CPC classification number: H01L25/50 ,  H01L21/56 ,  H01L21/78 ,  H01L23/552 ,  H01L25/0652 ,  H01L2225/06524

Abstract: A semiconductor device is formed by providing a semiconductor package including a shielding layer and forming a slot in the shielding layer using a laser. The laser is turned on and exposed to the shielding layer with a center of the laser disposed over a first point of the shielding layer. The laser is moved in a loop while the laser remains on and exposed to the shielding layer. Exposure of the laser to the shielding layer is stopped when the center of the laser is disposed over a second point of the shielding layer. A distance between the first point and the second point is approximately equal to a radius of the laser.

公开(公告)号：US11652065B2

公开(公告)日：2023-05-16

申请号：US17307727

申请日：2021-05-04

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： JinHee Jung ,  ChangOh Kim ,  HeeSoo Lee

IPC: H01L23/31 ,  H01L23/552 ,  H01L23/16 ,  H01L25/10 ,  H01L25/00 ,  H01L23/538

CPC classification number: H01L23/552 ,  H01L23/16 ,  H01L23/3107 ,  H01L23/5386 ,  H01L25/105 ,  H01L25/50 ,  H01L2225/1041

Abstract: An SIP module includes a plurality of electrical components mounted to an interconnect substrate. The electrical components and interconnect substrate are covered by an encapsulant. A conductive post is formed through the encapsulant. A plurality of openings is formed in the encapsulant by laser in a form of a circuit pattern. A conductive material is deposited over a surface of the encapsulant and into the openings to form an electrical circuit pattern. A portion of the conductive material is removed by a grinder to expose the electrical circuit pattern. The grinding operation planarizes the surface of the encapsulant and the electrical circuit pattern. The electrical circuit pattern can be a trace, contact pad, RDL, or other interconnect structure. The electrical circuit pattern can also be a shielding layer or antenna. An electrical component is disposed over the SIP module and electrical circuit pattern.

公开(公告)号：US11640944B2

公开(公告)日：2023-05-02

申请号：US17307437

申请日：2021-05-04

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： ChangOh Kim ,  JinHee Jung

IPC: H01L23/552 ,  H01L21/48

Abstract: A semiconductor device has a shielding layer over a semiconductor package. A plurality of slot lines define a location to form a slot in the shielding layer. The slot is formed in the shielding layer by cutting along the slot lines with a laser controlled by a scanner to read the slot lines. The slot lines include a left boundary slot line and right boundary slot line. The slot can be cut in the shielding layer by performing an edge cut along the slot lines, and performing a peel back to form the slot in the shielding layer. Alternatively, the slot can be cut in the shielding layer by performing a first cut in a first direction along the slot lines, and performing a second cut in a second direction opposite the first direction along the slot lines to form the slot in the shielding layer.

公开(公告)号：US20220399323A1

公开(公告)日：2022-12-15

申请号：US17343402

申请日：2021-06-09

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： ChangOh Kim ,  JinHee Jung

IPC: H01L25/00 ,  H01L21/78 ,  H01L23/552 ,  H01L21/56 ,  H01L25/065

Abstract: A semiconductor device is formed by providing a semiconductor package including a shielding layer and forming a slot in the shielding layer using a laser. The laser is turned on and exposed to the shielding layer with a center of the laser disposed over a first point of the shielding layer. The laser is moved in a loop while the laser remains on and exposed to the shielding layer. Exposure of the laser to the shielding layer is stopped when the center of the laser is disposed over a second point of the shielding layer. A distance between the first point and the second point is approximately equal to a radius of the laser.

公开(公告)号：US20220359419A1

公开(公告)日：2022-11-10

申请号：US17308410

申请日：2021-05-05

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： ChangOh Kim ,  JinHee Jung ,  JiWon Lee ,  YuJeong Jang

IPC: H01L23/552 ,  H01L23/31 ,  H01L25/065 ,  H01L21/3213

Abstract: A semiconductor device is formed by providing a semiconductor package including a shielding layer and forming a slot in the shielding layer using a laser. The laser is turned on and exposed to the shielding layer with a center of the laser disposed over a first point of the shielding layer. The laser is moved in a loop while the laser remains on and exposed to the shielding layer. Exposure of the laser to the shielding layer is stopped when the center of the laser is disposed over a second point of the shielding layer. A distance between the first point and the second point is approximately equal to a radius of the laser.

公开(公告)号：US20220359417A1

公开(公告)日：2022-11-10

申请号：US17307437

申请日：2021-05-04

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： ChangOh Kim ,  JinHee Jung

IPC: H01L23/552 ,  H01L21/48

Abstract: A semiconductor device has a shielding layer over a semiconductor package. A plurality of slot lines define a location to form a slot in the shielding layer. The slot is formed in the shielding layer by cutting along the slot lines with a laser controlled by a scanner to read the slot lines. The slot lines include a left boundary slot line and right boundary slot line. The slot can be cut in the shielding layer by performing an edge cut along the slot lines, and performing a peel back to form the slot in the shielding layer. Alternatively, the slot can be cut in the shielding layer by performing a first cut in a first direction along the slot lines, and performing a second cut in a second direction opposite the first direction along the slot lines to form the slot in the shielding layer.