公开(公告)号：US20150021081A1

公开(公告)日：2015-01-22

申请号：US14327389

申请日：2014-07-09

Applicant: Sony Corporation

Inventor： Shun Mitarai ,  Shusaku Yanagawa ,  Shinji Rokuhara ,  Shuichi Oka

IPC: H05K3/10 ,  H05K1/18 ,  H05K3/30 ,  H05K1/11

CPC classification number: H01L21/486 ,  G02F1/136286 ,  H01L23/15 ,  H01L23/373 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/5384 ,  H01L23/5385 ,  H01L23/5389 ,  H01L27/1218 ,  H01L27/124 ,  H01L27/3276 ,  H01L2224/16225 ,  H01L2224/73253 ,  H05K1/115 ,  H05K1/185 ,  H05K1/186 ,  H05K3/10 ,  H05K3/30 ,  H05K3/42 ,  H05K3/4605 ,  H05K3/4697 ,  Y10T29/4913 ,  Y10T29/49155

Abstract: A method of manufacturing a wiring substrate that has a wiring including a through glass via and is formed of a glass substrate includes forming an alteration layer that penetrates the wiring substrate and is patterned, forming the wiring on a front surface of the wiring substrate in which the alteration layer has been formed, and filling an electrode material in a hole formed by removing the alteration layer, thereby forming the through glass via that connects the wiring on the front surface of the wiring substrate and the wiring on a back surface side thereof.

Abstract translation: 一种制造布线基板的方法，该布线基板具有由玻璃基板形成的玻璃基板的布线，其特征在于，形成穿过所述布线基板并进行图案化的改质层，在布线基板的正面形成布线， 已经形成了改变层，并且通过去除改变层而形成的孔中填充电极材料，从而形成将布线基板的前表面上的布线和其背面侧的布线连接的贯通玻璃。

公开(公告)号：US20140235102A1

公开(公告)日：2014-08-21

申请号：US14161914

申请日：2014-01-23

Applicant: Sony Corporation

Inventor： Akira Akiba ,  Mitsuo Hashimoto ,  Shinya Morita ,  Shun Mitarai ,  Mikihiro Taketomo ,  Kazunao Oniki ,  Koichi Ikeda

IPC: H01R13/6599

CPC classification number: H01R13/6691 ,  H01P3/08 ,  H01P3/085 ,  H01P3/121 ,  H01R13/6599 ,  H01R24/64 ,  H01R2107/00 ,  H05K1/0219 ,  H05K2201/0715 ,  H05K2201/09336 ,  H05K2201/09618

Abstract: A signal transmission cable comprises a cable including a dielectric layer and a metallic layer; and a connector having a chip with a terminal. The connector includes a substrate having an organic layer, and a portion of the organic layer extends from the substrate so as to form the dielectric layer of the cable. The metallic layer is located on the dielectric layer and is directly connected to the terminal.

Abstract translation: 信号传输电缆包括包括电介质层和金属层的电缆; 以及具有带端子的芯片的连接器。 连接器包括具有有机层的衬底，并且有机层的一部分从衬底延伸以形成电缆的电介质层。 金属层位于电介质层上，直接连接到端子。