公开(公告)号：US07736952B2

公开(公告)日：2010-06-15

申请号：US12010544

申请日：2008-01-25

Applicant: Soon-Jin Cho ,  Jin-Won Choi ,  Seung-Hyun Cho ,  Chung-Woo Cho ,  Dong-Gyu Lee ,  Seok-Hwan Ahn

Inventor： Soon-Jin Cho ,  Jin-Won Choi ,  Seung-Hyun Cho ,  Chung-Woo Cho ,  Dong-Gyu Lee ,  Seok-Hwan Ahn

IPC: H01L21/00 ,  H01L21/58

CPC classification number: H01L24/11 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05022 ,  H01L2224/05024 ,  H01L2224/05147 ,  H01L2224/05571 ,  H01L2224/05572 ,  H01L2224/056 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/00014

Abstract: A wafer packaging method is disclosed.An aspect of the invention is to provide a wafer packaging method comprising; attaching tape onto one side of a carrier, the carrier having a through-hole formed therein; attaching a wafer onto the tape exposed inside the through-hole such that at least one electrode of the wafer is exposed; and performing a packaging process on the carrier such that the wafer is packaged.

Abstract translation: 公开了一种晶片封装方法。 本发明的一个方面是提供一种晶片封装方法，包括： 将带附着到载体的一侧上，所述载体具有形成在其中的通孔; 将晶片附接到暴露在通孔内的带上，使得晶片的至少一个电极露出; 以及在所述载体上执行封装处理以使所述晶片被封装。

公开(公告)号：US20090133253A1

公开(公告)日：2009-05-28

申请号：US12213365

申请日：2008-06-18

Applicant: Dong-Jin Park ,  Seung-Hyun Jung ,  Seung-Chul Kim ,  Soon-Jin Cho

Inventor： Dong-Jin Park ,  Seung-Hyun Jung ,  Seung-Chul Kim ,  Soon-Jin Cho

IPC: H05K3/12 ,  H01B13/00

CPC classification number: H05K3/107 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/045 ,  H05K3/421 ,  H05K3/427 ,  H05K2201/0394 ,  H05K2201/09563 ,  H05K2203/0577 ,  H05K2203/0723 ,  H05K2203/1152 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: A method of manufacturing a printed circuit board is disclosed. The method may include: sequentially stacking an acid-resistant first cover layer and an alkali-resistant second cover layer over a copper foil, for a copper clad laminate that includes the copper foil stacked over one side of an insulation layer; forming an intaglio groove by removing portions of the second cover layer, the first cover layer, and the copper clad laminate; stacking a seed layer over the intaglio groove and the second cover layer; removing a portion of the seed layer stacked over the second cover layer, by stripping the second cover layer; forming a plating layer, by plating an inside of the intaglio groove; stripping the first cover layer; and removing the copper foil exposed by the stripping of the first cover layer.

Abstract translation: 公开了一种制造印刷电路板的方法。 该方法可以包括：在铜箔上顺序层叠耐酸性第一覆盖层和耐碱性第二覆盖层，对于包含层叠在绝缘层一侧的铜箔的覆铜层压板， 通过去除第二覆盖层，第一覆盖层和覆铜层压板的部分来形成凹版凹槽; 将种子层堆叠在凹版凹槽和第二覆盖层上; 通过剥离所述第二覆盖层去除层叠在所述第二覆盖层上的所述种子层的一部分; 通过电镀凹版凹槽的内部形成镀层; 剥离第一覆盖层; 以及去除通过剥离第一覆盖层而暴露的铜箔。

公开(公告)号：US07517730B2

公开(公告)日：2009-04-14

申请号：US11542175

申请日：2006-10-04

Applicant: Soon-Jin Cho

Inventor： Soon-Jin Cho

IPC: H01L21/00

CPC classification number: H05K3/4007 ,  H01L2224/16225 ,  H05K1/0206 ,  H05K3/06 ,  H05K3/4644 ,  H05K2201/0355 ,  H05K2201/0367 ,  H05K2201/09481 ,  H05K2201/09563 ,  H05K2201/09781 ,  H05K2203/1536 ,  Y10T29/49124 ,  Y10T29/49147 ,  Y10T29/49165

Abstract: The present invention discloses a method for manufacturing a coreless substrate. The method comprises the steps of (a) forming an insulating layer on one side of a metal sheet; (b) forming a via hole on the insulating layer for electrical connection between the metal sheet and the other side; and (c) forming a plurality of protruded function pads by etching the metal sheet. The coreless substrate and manufacturing method thereof in accordance with the present invention have the signal delivery characteristic that is improved by eliminating the inner via hole.

Abstract translation: 本发明公开了一种无芯基板的制造方法。 该方法包括以下步骤：（a）在金属片的一侧上形成绝缘层; （b）在绝缘层上形成用于金属片和另一侧之间的电连接的通孔; 和（c）通过蚀刻金属板形成多个突出的功能垫。 根据本发明的无芯基板及其制造方法具有通过消除内通孔而提高的信号传递特性。

公开(公告)号：US20090027864A1

公开(公告)日：2009-01-29

申请号：US12007687

申请日：2008-01-14

Applicant: Chung-Woo Cho ,  Jong-Jin Lee ,  Soon-Jin Cho ,  Yong-Duk Lee ,  Ki-Young Yoo ,  Woo-Young Lee ,  Chin-Kwan Kim ,  Jong-Yong Kim ,  Dong-Ju Jeon

Inventor： Chung-Woo Cho ,  Jong-Jin Lee ,  Soon-Jin Cho ,  Yong-Duk Lee ,  Ki-Young Yoo ,  Woo-Young Lee ,  Chin-Kwan Kim ,  Jong-Yong Kim ,  Dong-Ju Jeon

IPC: H05K1/00 ,  H05K3/00

CPC classification number: H05K3/3452 ,  H05K3/0032 ,  H05K2201/09845 ,  H05K2203/0594 ,  Y10T29/49165

Abstract: A printed circuit board and a method of manufacturing the printed circuit board are disclosed. A printed circuit board, which includes an insulation layer, a circuit pattern formed on a surface of the insulation layer that includes at least one pad, and a solder resist which covers the circuit pattern, and in which an opening is formed that exposes a portion of a side and a surface of the pad, can ensure a sufficient amount of attachment area for the pads and the solder resist, to strengthen the adhesion of the pads. Also, the adhesion can be increased between the electronic components and the printed circuit board, and heat release characteristics can be improved.

Abstract translation: 公开了印刷电路板和印刷电路板的制造方法。 一种印刷电路板，其包括绝缘层，形成在绝缘层的包括至少一个焊盘的表面上的电路图案和覆盖电路图案的阻焊剂，并且其中形成有露出部分的开口 的焊盘的侧面和表面，可以确保焊盘和阻焊剂的足够的附着面积，以增强焊盘的附着力。 此外，可以在电子部件和印刷电路板之间增加粘附性，并且可以提高散热特性。

公开(公告)号：US20080225501A1

公开(公告)日：2008-09-18

申请号：US12076274

申请日：2008-03-14

Applicant: Chung-Woo Cho ,  Chang-Sup Ryu ,  Soon-Jin Cho ,  Seung-Chul Kim

Inventor： Chung-Woo Cho ,  Chang-Sup Ryu ,  Soon-Jin Cho ,  Seung-Chul Kim

IPC: H05K7/10 ,  H01K3/10

CPC classification number: H05K3/421 ,  H05K3/108 ,  H05K3/423 ,  H05K2201/09545 ,  H05K2201/09563 ,  H05K2201/096 ,  Y10T29/49165

Abstract: A printed circuit board and a manufacturing method thereof are disclosed. The printed circuit board, which includes a first insulation layer, a first via that penetrates the first insulation layer, and a first pad formed on one surface of the first insulation layer, where a whole of or a portion of the first pad is buried in the first via, has a portion of or the whole of the pad buried in the via, so that the contact area between the pad and the via may be increased, and the printed circuit board can be given greater reliability.

Abstract translation: 公开了印刷电路板及其制造方法。 印刷电路板包括第一绝缘层，穿过第一绝缘层的第一通孔和形成在第一绝缘层的一个表面上的第一焊盘，其中第一焊盘的整体或一部分被埋在 第一通孔具有埋在通孔中的焊盘的一部分或全部，从而可以增加焊盘和通孔之间的接触面积，并且可以赋予印刷电路板更高的可靠性。