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公开(公告)号：US20110182684A1
公开(公告)日：2011-07-28
申请号：US13003293
申请日：2009-06-23
Applicant: Tae Sik Yoon , Soon Jin Cho , Seung Hyun Cho , Jae Joon Lee
Inventor： Tae Sik Yoon , Soon Jin Cho , Seung Hyun Cho , Jae Joon Lee
CPC classification number: B22F7/062 , B22F2005/001 , B22F2998/00 , B23B51/02 , B23B2251/426 , B23P15/32 , C22C38/08 , Y10T408/03 , Y10T408/78 , Y10T408/907 , Y10T408/9097 , B22F2207/20 , B22F5/06 , B22F5/10
Abstract: A method of fabricating a micro drill, which includes a drill part for machining a hole and a shank part fixed to a motor, the drill part and the shank part being made of different materials. The method includes the steps of forming a drill part-forming powder compact having a recess in one end thereof, and forming a shank part-forming powder compact having a protrusion, the protrusion intended to be fitted into the recess of the drill part-forming powder compact, forming an assembly of the drill part-forming powder compact and the shank part-forming powder compact, with the protrusion fitted into the recess, and simultaneously sintering the assembly of the drill part-forming powder compact and the shank part-forming powder compact.
Abstract translation: 一种微钻的制造方法，其特征在于，包括用于加工孔的钻头部和固定于马达的柄部，所述钻头部和所述柄部由不同的材料构成。 该方法包括以下步骤：在其一端形成具有凹部的钻头成形粉末压块，并且形成具有突出部的柄部形成用粉末压块，所述突起旨在嵌入到钻头成形用凹部 粉末压块，形成钻头成形粉末压块和柄部分成型粉末压块的组件，突起嵌入凹槽中，同时烧结钻头成形粉末压块和柄部分成型的组件 粉末紧凑。
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公开(公告)号：US07981728B2
公开(公告)日：2011-07-19
申请号：US12382293
申请日：2009-03-12
Applicant: Soon-Jin Cho
Inventor： Soon-Jin Cho
IPC: H01L21/00
CPC classification number: H05K3/4007 , H01L2224/16225 , H05K1/0206 , H05K3/06 , H05K3/4644 , H05K2201/0355 , H05K2201/0367 , H05K2201/09481 , H05K2201/09563 , H05K2201/09781 , H05K2203/1536 , Y10T29/49124 , Y10T29/49147 , Y10T29/49165
Abstract: A coreless substrate having a plurality of function pads, etched from a metal sheet and having a protruded shape; an insulating layer, the insulating layer being formed on one side of the function pads, a circuit corresponding to a pattern being formed on the insulating layer, a via hole being formed on the insulating layer to electrically connect the function pads and the circuit; and a solder resist, being formed on the insulating layer to protect the surface of the insulating layer. The coreless substrate has a signal delivery characteristic that is improved by eliminating the inner via hole.
Abstract translation: 一种无芯基板，具有从金属板蚀刻并具有突出形状的多个功能垫; 绝缘层，所述绝缘层形成在所述功能焊盘的一侧上，对应于在所述绝缘层上形成的图案的电路，形成在所述绝缘层上以电连接所述功能焊盘和所述电路的通孔; 和阻焊层，形成在绝缘层上以保护绝缘层的表面。 无芯基板具有通过消除内通孔而改善的信号传递特性。
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公开(公告)号：US20110095421A1
公开(公告)日：2011-04-28
申请号：US12926137
申请日：2010-10-27
Applicant: Ey Yong Kim , Young Hwan Shin , Soon Jin Cho , Jong Yong Kim , Jin Seok Lee
Inventor： Ey Yong Kim , Young Hwan Shin , Soon Jin Cho , Jong Yong Kim , Jin Seok Lee
IPC: H01L23/498 , H01L21/60
CPC classification number: H01L21/563 , H01L23/3128 , H01L23/49816 , H01L24/16 , H01L24/31 , H01L24/81 , H01L2224/16225 , H01L2224/26175 , H01L2224/27013 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/81192 , H01L2224/81801 , H01L2224/83051 , H01L2224/92125 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/15311 , H01L2924/19041 , H01L2924/00012 , H01L2924/00
Abstract: There is provided a flip chip package including an electronic device, a board including a conductive pad disposed inside a mounting region of the board on which the electronic device is mounted, and a connection pad disposed outside the mounting region, a resin layer formed on the board and including a trench formed by removing a part of the resin layer, and a dam member provided on the trench and preventing the leakage of an underfill between the mounting region and the connection pad. Since the dam member, formed on the processed resin layer, can prevent the leakage of the underfill, a package defect rate can be lowered, and connection reliability can be improved.
Abstract translation: 提供了一种倒装芯片封装，包括电子器件，包括设置在其上安装有电子器件的板的安装区域内的导电焊盘的基板和设置在安装区域外部的连接焊盘，形成在其上的树脂层 并且包括通过去除树脂层的一部分而形成的沟槽，以及设置在沟槽上的防止构件，并防止在安装区域和连接衬垫之间的底部填充物的泄漏。 由于形成在加工树脂层上的阻挡部件能够防止底部填充物的泄漏，因此能够降低包装缺陷率，可以提高连接可靠性。
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4.发明授权公开(公告)号：US07875340B2
公开(公告)日：2011-01-25
申请号：US12003490
申请日：2007-12-26
Applicant: Seung Hyun Cho , Byoung Youl Min , Soon Jin Cho , Jin Won Choi
Inventor： Seung Hyun Cho , Byoung Youl Min , Soon Jin Cho , Jin Won Choi
IPC: H05K1/00
CPC classification number: H05K1/056 , B82Y10/00 , H01L21/486 , H01L21/4871 , H01L23/3677 , H01L23/373 , H01L23/49822 , H01L23/49827 , H01L2224/16 , H01L2924/01078 , H01L2924/01079 , H01L2924/15311 , H05K7/20481 , H05K2201/026 , Y10T29/49155 , Y10T29/49158 , Y10T29/49165 , Y10T428/24917
Abstract: Disclosed herein is a method of manufacturing a heat radiation substrate, including injection-molding mixed powder of carbon nanotubes and metal in a die to fabricate a metal core having through holes; molding the entire metal core including the through holes with an insulating resin to fabricate a metal core substrate; processing the insulating resin provided in the through holes to form connection holes; and forming a circuit pattern on the metal core substrate in which the connection holes are formed.
Abstract translation: 本发明公开了一种制造散热基板的方法，包括：在模具中注入碳纳米管和金属的混合粉末以制造具有通孔的金属芯; 用绝缘树脂模制包括通孔的整个金属芯，以制造金属芯基板; 处理设置在通孔中的绝缘树脂以形成连接孔; 在形成有连接孔的金属芯基板上形成电路图案。
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5.发明申请公开(公告)号：US20090026169A1
公开(公告)日：2009-01-29
申请号：US12010195
申请日：2008-01-22
Applicant: Chung-Woo Cho , Soon-Jin Cho , Byung-Bae Seo , Ki-Young Yoo , Seok-Hwan Ahn
Inventor： Chung-Woo Cho , Soon-Jin Cho , Byung-Bae Seo , Ki-Young Yoo , Seok-Hwan Ahn
CPC classification number: H05K3/0008 , H05K1/0269 , H05K3/0035 , H05K3/4644 , H05K3/4679 , H05K2201/0108 , H05K2201/09918
Abstract: A printed circuit board manufacturing system and a manufacturing method thereof are disclosed. A method of manufacturing printed circuit board, comprising: providing a substrate that comprises a pad and an insulation layer covering the pad; acquiring an image of the substrate; acquiring location information of the pad by analyzing the image of the substrate; forming a via hole by removing a part of the insulation layer that corresponds the location information of the pad; and forming a via by filling the via hole with a conductive material, provides improved process conformity, even if the substrate has partial or nonlinear deformation, by considering the location information of the pad in the via hole forming. The improved conformity may allow more flexibility to substrate design and more integrity for circuitries on printed circuit board.
Abstract translation: 公开了印刷电路板制造系统及其制造方法。 一种制造印刷电路板的方法，包括：提供包括衬垫和覆盖所述衬垫的绝缘层的衬底; 获取所述基板的图像; 通过分析衬底的图像来获取衬垫的位置信息; 通过去除与衬垫的位置信息相对应的绝缘层的一部分来形成通孔; 并且通过用导电材料填充通孔形成通孔，通过考虑通孔形成中的焊盘的位置信息，即使衬底具有部分或非线性变形也提供了改进的工艺一致性。 改进的一致性可以允许对印刷电路板上的电路板的基板设计和更完整性的更大的灵活性。
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Patent Agency Ranking
公开(公告)号：US20090025581A1
公开(公告)日：2009-01-29
申请号：US12003491
申请日：2007-12-26
Applicant: Soon Jin Cho , Seon Jae Mun , Jin Won Choi
Inventor： Soon Jin Cho , Seon Jae Mun , Jin Won Choi
CPC classification number: H05K3/1225 , B41P2215/12
Abstract: This invention relates to a mask for screen printing, which includes a mask body composed of a plurality of pattern areas having holes for screen printing and a peripheral area surrounding the outside of the pattern areas; and a protrusion portion formed in the peripheral area of a back surface of the mask body, and to a screen printing method using the same.
Abstract translation: 本发明涉及一种丝网印刷用掩模，其包括由具有丝网印刷用孔的多个图案区域和围绕图案区域外部的周边区域构成的掩模体; 以及形成在面罩主体的后表面的周边区域中的突出部分，以及使用该突起部分的丝网印刷方法。
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公开(公告)号：US08061025B2
公开(公告)日：2011-11-22
申请号：US12926864
申请日：2010-12-14
Applicant: Seung Hyun Cho , Byoung Youl Min , Soon Jin Cho , Jin Won Choi
Inventor： Seung Hyun Cho , Byoung Youl Min , Soon Jin Cho , Jin Won Choi
CPC classification number: H05K1/056 , B82Y10/00 , H01L21/486 , H01L21/4871 , H01L23/3677 , H01L23/373 , H01L23/49822 , H01L23/49827 , H01L2224/16 , H01L2924/01078 , H01L2924/01079 , H01L2924/15311 , H05K7/20481 , H05K2201/026 , Y10T29/49155 , Y10T29/49158 , Y10T29/49165 , Y10T428/24917
Abstract: A method of manufacturing a heat radiation substrate having a metal core, including injection-molding mixed powder of carbon nanotubes and metal in a die to fabricate a metal core having through holes; molding the entire metal core including the through holes with an insulating resin to fabricate a metal core substrate; processing the insulating resin provided in the through holes to form connection holes; and forming a circuit pattern on the metal core substrate in which the connection holes are formed.
Abstract translation: 一种制造具有金属芯的散热基板的方法，包括在模具中注入成型的碳纳米管和金属的混合粉末以制造具有通孔的金属芯; 用绝缘树脂模制包括通孔的整个金属芯，以制造金属芯基板; 处理设置在通孔中的绝缘树脂以形成连接孔; 在形成有连接孔的金属芯基板上形成电路图案。
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公开(公告)号：US07736952B2
公开(公告)日：2010-06-15
申请号：US12010544
申请日：2008-01-25
Applicant: Soon-Jin Cho , Jin-Won Choi , Seung-Hyun Cho , Chung-Woo Cho , Dong-Gyu Lee , Seok-Hwan Ahn
Inventor： Soon-Jin Cho , Jin-Won Choi , Seung-Hyun Cho , Chung-Woo Cho , Dong-Gyu Lee , Seok-Hwan Ahn
CPC classification number: H01L24/11 , H01L2224/05001 , H01L2224/05008 , H01L2224/05022 , H01L2224/05024 , H01L2224/05147 , H01L2224/05571 , H01L2224/05572 , H01L2224/056 , H01L2224/13099 , H01L2224/16 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/09701 , H01L2924/00014
Abstract: A wafer packaging method is disclosed.An aspect of the invention is to provide a wafer packaging method comprising; attaching tape onto one side of a carrier, the carrier having a through-hole formed therein; attaching a wafer onto the tape exposed inside the through-hole such that at least one electrode of the wafer is exposed; and performing a packaging process on the carrier such that the wafer is packaged.
Abstract translation: 公开了一种晶片封装方法。 本发明的一个方面是提供一种晶片封装方法，包括： 将带附着到载体的一侧上，所述载体具有形成在其中的通孔; 将晶片附接到暴露在通孔内的带上，使得晶片的至少一个电极露出; 以及在所述载体上执行封装处理以使所述晶片被封装。
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9.发明申请公开(公告)号：US20100096177A1
公开(公告)日：2010-04-22
申请号：US12320284
申请日：2009-01-22
Applicant: Seok Kyu Lee , Soon OH Jung , Jong Kuk Hong , Soon Jin Cho
Inventor： Seok Kyu Lee , Soon OH Jung , Jong Kuk Hong , Soon Jin Cho
CPC classification number: H05K3/00 , H05K1/113 , H05K3/0052 , H05K3/007 , H05K3/4007 , H05K3/426 , H05K3/4682 , H05K2201/0367 , H05K2201/09563 , H05K2201/096 , H05K2203/0156 , H05K2203/054 , H05K2203/1572
Abstract: Disclosed herein is a coreless substrate having filled via pads and a method of manufacturing the same. Insulating layers are formed on both sides of a build-up layer, and via-pads are embedded in the insulating layers such that the via-pads are flush with the insulating layers. The via pads are not separated from a substrate, and thus reliability of the pads is increased. Flatness of bumps is increased, and thus bonding of flip chips becomes easy.
Abstract translation: 本文公开了具有填充通孔焊盘的无芯基板及其制造方法。 绝缘层形成在堆积层的两侧，并且通孔焊盘嵌入在绝缘层中，使得通孔焊盘与绝缘层齐平。 通孔焊盘不与衬底分离，因此焊盘的可靠性增加。 凸起的平坦度增加，因此倒装芯片的结合变得容易。
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10.发明申请公开(公告)号：US20090297801A1
公开(公告)日：2009-12-03
申请号：US12003490
申请日：2007-12-26
Applicant: Seung Hyun Cho , Byoung Youl Min , Soon Jin Cho , Jin Won Choi
Inventor： Seung Hyun Cho , Byoung Youl Min , Soon Jin Cho , Jin Won Choi
CPC classification number: H05K1/056 , B82Y10/00 , H01L21/486 , H01L21/4871 , H01L23/3677 , H01L23/373 , H01L23/49822 , H01L23/49827 , H01L2224/16 , H01L2924/01078 , H01L2924/01079 , H01L2924/15311 , H05K7/20481 , H05K2201/026 , Y10T29/49155 , Y10T29/49158 , Y10T29/49165 , Y10T428/24917
Abstract: Disclosed herein is a method of manufacturing a heat radiation substrate, including injection-molding mixed powder of carbon nanotubes and metal in a die to fabricate a metal core having through holes; molding the entire metal core including the through holes with an insulating resin to fabricate a metal core substrate; processing the insulating resin provided in the through holes to form connection holes; and forming a circuit pattern on the metal core substrate in which the connection holes are formed.
Abstract translation: 本发明公开了一种制造散热基板的方法，包括：在模具中注入碳纳米管和金属的混合粉末以制造具有通孔的金属芯; 用绝缘树脂模制包括通孔的整个金属芯，以制造金属芯基板; 处理设置在通孔中的绝缘树脂以形成连接孔; 在形成有连接孔的金属芯基板上形成电路图案。
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