Method of manufacturing printed circuit board
    1.
    发明申请
    Method of manufacturing printed circuit board 审中-公开
    制造印刷电路板的方法

    公开(公告)号:US20090136656A1

    公开(公告)日:2009-05-28

    申请号:US12213700

    申请日:2008-06-23

    Abstract: A method of manufacturing a printed circuit board is disclosed. The method may include: stacking an anti-plating layer over a copper foil, for a copper clad laminate that includes the copper foil stacked over one side of an insulation layer; forming an intaglio groove, by removing a portion of the anti-plating layer and a portion of the copper clad laminate; stacking a seed layer over a surface of the intaglio groove; forming a plating layer, by plating an inside of the intaglio groove; and removing the anti-plating layer and the copper foil.

    Abstract translation: 公开了一种制造印刷电路板的方法。 该方法可以包括:在铜箔上堆叠防镀层,对于包括层叠在绝缘层的一侧上的铜箔的覆铜层压板; 通过去除所述防镀层的一部分和所述覆铜层压板的一部分来形成凹版凹槽; 将种子层堆叠在凹版凹槽的表面上; 通过电镀凹版凹槽的内部形成镀层; 并且去除防镀层和铜箔。

    Coreless substrate
    2.
    发明授权
    Coreless substrate 有权
    无芯底物

    公开(公告)号:US07981728B2

    公开(公告)日:2011-07-19

    申请号:US12382293

    申请日:2009-03-12

    Applicant: Soon-Jin Cho

    Inventor: Soon-Jin Cho

    Abstract: A coreless substrate having a plurality of function pads, etched from a metal sheet and having a protruded shape; an insulating layer, the insulating layer being formed on one side of the function pads, a circuit corresponding to a pattern being formed on the insulating layer, a via hole being formed on the insulating layer to electrically connect the function pads and the circuit; and a solder resist, being formed on the insulating layer to protect the surface of the insulating layer. The coreless substrate has a signal delivery characteristic that is improved by eliminating the inner via hole.

    Abstract translation: 一种无芯基板,具有从金属板蚀刻并具有突出形状的多个功能垫; 绝缘层,所述绝缘层形成在所述功能焊盘的一侧上,对应于在所述绝缘层上形成的图案的电路,形成在所述绝缘层上以电连接所述功能焊盘和所述电路的通孔; 和阻焊层,形成在绝缘层上以保护绝缘层的表面。 无芯基板具有通过消除内通孔而改善的信号传递特性。

    Printed circuit board manufacturing system and manufacturing method thereof
    3.
    发明申请
    Printed circuit board manufacturing system and manufacturing method thereof 失效
    印刷电路板制造系统及其制造方法

    公开(公告)号:US20090026169A1

    公开(公告)日:2009-01-29

    申请号:US12010195

    申请日:2008-01-22

    Abstract: A printed circuit board manufacturing system and a manufacturing method thereof are disclosed. A method of manufacturing printed circuit board, comprising: providing a substrate that comprises a pad and an insulation layer covering the pad; acquiring an image of the substrate; acquiring location information of the pad by analyzing the image of the substrate; forming a via hole by removing a part of the insulation layer that corresponds the location information of the pad; and forming a via by filling the via hole with a conductive material, provides improved process conformity, even if the substrate has partial or nonlinear deformation, by considering the location information of the pad in the via hole forming. The improved conformity may allow more flexibility to substrate design and more integrity for circuitries on printed circuit board.

    Abstract translation: 公开了印刷电路板制造系统及其制造方法。 一种制造印刷电路板的方法,包括:提供包括衬垫和覆盖所述衬垫的绝缘层的衬底; 获取所述基板的图像; 通过分析衬底的图像来获取衬垫的位置信息; 通过去除与衬垫的位置信息相对应的绝缘层的一部分来形成通孔; 并且通过用导电材料填充通孔形成通孔,通过考虑通孔形成中的焊盘的位置信息,即使衬底具有部分或非线性变形也提供了改进的工艺一致性。 改进的一致性可以允许对印刷电路板上的电路板的基板设计和更完整性的更大的灵活性。

    Method of manufacturing printed circuit board
    8.
    发明授权
    Method of manufacturing printed circuit board 失效
    制造印刷电路板的方法

    公开(公告)号:US08074352B2

    公开(公告)日:2011-12-13

    申请号:US12213365

    申请日:2008-06-18

    Abstract: A method of manufacturing a printed circuit board is disclosed. The method may include: sequentially stacking an acid-resistant first cover layer and an alkali-resistant second cover layer over a copper foil, for a copper clad laminate that includes the copper foil stacked over one side of an insulation layer; forming an intaglio groove by removing portions of the second cover layer, the first cover layer, and the copper clad laminate; stacking a seed layer over the intaglio groove and the second cover layer; removing a portion of the seed layer stacked over the second cover layer, by stripping the second cover layer; forming a plating layer, by plating an inside of the intaglio groove; stripping the first cover layer; and removing the copper foil exposed by the stripping of the first cover layer.

    Abstract translation: 公开了一种制造印刷电路板的方法。 该方法可以包括:在铜箔上顺序层叠耐酸性第一覆盖层和耐碱性第二覆盖层,对于包含层叠在绝缘层一侧的铜箔的覆铜层压板, 通过去除第二覆盖层,第一覆盖层和覆铜层压板的部分来形成凹版凹槽; 将种子层堆叠在凹版凹槽和第二覆盖层上; 通过剥离所述第二覆盖层去除层叠在所述第二覆盖层上的所述种子层的一部分; 通过电镀凹版凹槽的内部形成镀层; 剥离第一覆盖层; 以及去除通过剥离第一覆盖层而暴露的铜箔。

    Coreless substrate and manufacturing method thereof
    10.
    发明申请
    Coreless substrate and manufacturing method thereof 失效
    无芯基板及其制造方法

    公开(公告)号:US20070084630A1

    公开(公告)日:2007-04-19

    申请号:US11542175

    申请日:2006-10-04

    Applicant: Soon-Jin Cho

    Inventor: Soon-Jin Cho

    Abstract: The present invention discloses a method for manufacturing a coreless substrate. The method comprises the steps of (a) forming an insulating layer on one side of a metal sheet; (b) forming a via hole on the insulating layer for electrical connection between the metal sheet and the other side; and (c) forming a plurality of protruded function pads by etching the metal sheet. The coreless substrate and manufacturing method thereof in accordance with the present invention have the signal delivery characteristic that is improved by eliminating the inner via hole.

    Abstract translation: 本发明公开了一种无芯基板的制造方法。 该方法包括以下步骤:(a)在金属片的一侧上形成绝缘层; (b)在绝缘层上形成用于金属片和另一侧之间的电连接的通孔; 和(c)通过蚀刻金属板形成多个突出的功能垫。 根据本发明的无芯基板及其制造方法具有通过消除内通孔而提高的信号传递特性。

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