公开(公告)号：US20180240599A1

公开(公告)日：2018-08-23

申请号：US15899403

申请日：2018-02-20

Applicant: TDK CORPORATION

Inventor： Koichi TSUNODA ,  Mitsuhiro TOMIKAWA ,  Kazuhiro YOSHIKAWA ,  Kenichi YOSHIDA

IPC: H01G4/33 ,  H01G9/04 ,  H01G9/012 ,  H01G9/07

CPC classification number: H01G4/33 ,  H01G2/02 ,  H01G4/224 ,  H01G4/228 ,  H01G9/012 ,  H01G9/04 ,  H01G9/07 ,  H05K2201/0179 ,  H05K2201/0195

Abstract: In a thin-film capacitor, an electrode terminal layer is divided into a plurality of parts by a penetration portion, and includes a frame portion as one divided part. The frame portion is disposed along an outer edge of the electrode terminal layer when viewed from the bottom surface side of the electrode terminal layer, and the frame portion can hinder deformation of the electrode terminal layer stretching or warping in a thickness direction or an in-plane direction, whereby such deformation can be prevented. Accordingly, in the thin-film capacitor, the electrode terminal layer is not likely to be deformed and an improvement in strength thereof is achieved.

公开(公告)号：US20180235086A1

公开(公告)日：2018-08-16

申请号：US15892722

申请日：2018-02-09

Applicant: TDK CORPORATION

Inventor： Mitsuhiro TOMIKAWA ,  Koichi TSUNODA ,  Kazuhiro YOSHIKAWA ,  Kenichi YOSHIDA

IPC: H05K1/18 ,  H05K3/30 ,  H05K3/38

Abstract: An electronic component embedded substrate includes: a substrate that includes an insulating layer and has a first principal surface and a second principal surface; an electronic component that is embedded in the substrate and has at least one first terminal, at least one second terminal, and a capacity part; at least one via conductor that are formed in the insulating layer and electrically connected to the second terminal; and an adhesion layer that is in contact with the second terminal on an end face of the second terminal which are close to the second principal surface. The electronic component is laminated with the insulating layer, and adhesion strength between the adhesion layer and the insulating layer is higher than that between the second terminal and the insulating layer.

公开(公告)号：US20180233553A1

公开(公告)日：2018-08-16

申请号：US15891637

申请日：2018-02-08

Applicant: TDK CORPORATION

Inventor： Mitsuhiro TOMIKAWA ,  Koichi TSUNODA ,  Kazuhiro YOSHIKAWA ,  Kenichi YOSHIDA

IPC: H01L49/02 ,  H01G4/30 ,  H01G4/33 ,  H01G4/228

Abstract: An electronic component embedded substrate includes: a substrate that includes an insulating layer and has a first principal surface and a second principal surface on the opposite side of the first principal surface; and an electronic component that is embedded in the substrate and has a plurality of first terminals provided close to the first principal surface, a plurality of second terminals provided close to the second principal surface, and a capacity part provided between the plurality of first terminals and the plurality of second terminals. The electronic component is configured such that at least a part of the second terminals is embedded in the insulating layer. An insulating member is provided between the neighboring second terminals to be in contact with both of the neighboring second terminals. The insulating member and the insulating layer are formed of materials whose thermal expansion coefficients are different from each other.

公开(公告)号：US20180102218A1

公开(公告)日：2018-04-12

申请号：US15725654

申请日：2017-10-05

Applicant: TDK CORPORATION

Inventor： Kenichi YOSHIDA ,  Kazuhiro YOSHIKAWA ,  Michihiro KUMAGAE ,  Norihiko MATSUZAKA ,  Junki NAKAMOTO

IPC: H01G4/30 ,  H01G4/232 ,  H01L23/522 ,  H01L27/01 ,  H01L49/02 ,  H01G4/33

CPC classification number: H01G4/30 ,  H01G4/232 ,  H01G4/306 ,  H01G4/33 ,  H01L23/5223 ,  H01L27/016 ,  H01L28/40 ,  H01L28/91 ,  H01L2224/05001 ,  H01L2224/05027

Abstract: A thin-film capacitor includes electrode layers stacked in a stacking direction; dielectric layers stacked between the electrode layers; an opening portion that includes a side surface penetrating at least a part of the electrode layers and at least a part of the dielectric layers in the stacking direction from a top side and a bottom surface exposing one of the electrode layers; and a wiring portion disposed in the opening portion to be separated from the side surface of the opening portion, and electrically connected to the electrode layer exposed from the bottom surface of the opening portion. The dielectric layer that is stacked immediately on the electrode layer exposed from the bottom surface of the opening portion among the dielectric layers includes an extension portion extending in the opening portion from the side surface of the opening portion to the wiring portion side.

公开(公告)号：US20230060995A1

公开(公告)日：2023-03-02

申请号：US17896744

申请日：2022-08-26

Applicant: TDK Corporation

Inventor： Kazuhiro YOSHIKAWA ,  Takeshi OOHASHI ,  Mitsuhiro TOMIKAWA ,  Koichi TSUNODA

IPC: H01F27/29 ,  H01F17/00 ,  H01G4/38

Abstract: Disclosed herein is an electronic component that includes an element body having a structure in which a plurality of conductor layers are stacked in a first direction on a surface of a substrate with insulating layers interposed therebetween, and a plurality of terminal electrodes provided on a mounting surface of the element body. The mounting surface extends in the first direction and in a second direction perpendicular to the first direction. The element body includes an inductor constituted by the plurality of conductor layers and has a coil axis extending in a third direction perpendicular to both the first and second directions.

公开(公告)号：US20190304701A1

公开(公告)日：2019-10-03

申请号：US16360405

申请日：2019-03-21

Applicant: TDK CORPORATION

Inventor： Daiki ISHII ,  Kazuhiro YOSHIKAWA ,  Koichi TSUNODA ,  Mitsuhiro TOMIKAWA ,  Junki NAKAMOTO ,  Kenichi YOSHIDA

IPC: H01G4/33 ,  H01G4/12 ,  H01G4/008

Abstract: A thin-film capacitor satisfies a relationship of CTE1>CTE2>CTE3 regarding a linear expansion coefficient CTE1 of a base, a linear expansion coefficient CTE2 of a capacitance unit, and a linear expansion coefficient CTE3 of a barrier layer. The inventors have newly found that in a case in which such a relationship is satisfied, when a temperature falls from a deposition temperature, cracking occurring in the capacitance unit of the thin-film capacitor is prevented, and cracking occurring in the barrier layer is also prevented.

公开(公告)号：US20230005667A1

公开(公告)日：2023-01-05

申请号：US17784857

申请日：2020-12-04

Applicant: TDK Corporation

Inventor： Kazuhiro YOSHIKAWA ,  Kenichi YOSHIDA ,  Takashi OHTSUKA

IPC: H01G4/224 ,  H01G4/40 ,  H01G4/30 ,  H01G4/08

Abstract: An electronic component includes: a conductive pattern provided on the main surface of a substrate and constituting a lower electrode; a dielectric film that covers top and side surfaces of the conductive pattern; and a conductive pattern stacked on the top surface of the conductive pattern through the dielectric film and constituting an upper electrode. A part of the dielectric film that is parallel to the main surface of the substrate is removed at least partly. Partially removing a part of the dielectric film that is parallel to the main surface of the substrate allows stress relaxation. This prevents peeling at the interface between the lower electrode and the dielectric film.

公开(公告)号：US20210272757A1

公开(公告)日：2021-09-02

申请号：US17165339

申请日：2021-02-02

Applicant: TDK CORPORATION

Inventor： Yuuki ABURAKAWA ,  Tatsuo NAMIKAWA ,  Akiyasu IIOKA ,  Hitoshi SAITA ,  Kazuhiro YOSHIKAWA

IPC: H01G4/33 ,  H01G4/008 ,  H01L23/64 ,  H01L23/498 ,  H01G4/30

Abstract: Disclosed herein a thin film capacitor that includes a lower electrode layer, an upper electrode layer, and a dielectric layer disposed between the lower electrode layer and the upper electrode layer. The dielectric layer has a through hole. An inner wall surface of the through hole has a first tapered surface and a second tapered surface surrounded by the first tapered surface. The first and second tapered surfaces are not covered with the upper electrode layer and have respective first and second taper angles with respect to a surface of the lower electrode layer. The second taper angle is smaller than the first taper angle.

公开(公告)号：US20200258690A1

公开(公告)日：2020-08-13

申请号：US16617106

申请日：2018-05-16

Applicant: TDK Corporation

Inventor： Koichi TSUNODA ,  Kazuhiro YOSHIKAWA ,  Mitsuhiro TOMIKAWA ,  Kenichi YOSHIDA

IPC: H01G4/33 ,  H01G4/01 ,  H01G4/232

Abstract: A thin-film capacitor includes an insulating base member, and a capacitance portion that is laminated on the insulating base member has a plurality of internal electrode layers which are laminated on the insulating base member and are provided in a lamination direction and dielectric layers which are sandwiched between the internal electrode layers. A relative dielectric constant of the dielectric layers is 100 or higher.

公开(公告)号：US20200043751A1

公开(公告)日：2020-02-06

申请号：US16499501

申请日：2018-03-16

Applicant: TDK CORPORATION

Inventor： Mitsuhiro TOMIKAWA ,  Kazuhiro YOSHIKAWA ,  Koichi TSUNODA ,  Kenichi YOSHIDA

IPC: H01L21/48 ,  H05K1/16 ,  H05K3/40 ,  H05K3/46

Abstract: A first insulating layer, a conductor layer included on a first main surface, an electronic component included on the first main surface and a second insulating layer stacked on the first insulating layer are included, a stacking direction of the first insulating layer and the second insulating layer is the same as a stacking direction of a first electrode layer, a second electrode layer, and the dielectric layer in the electronic component, and a height position of a main surface of the electronic component on an opposite side from a side of the first main surface is different from a height position of a main surface of the conductor layer adjacent to the electronic component on an opposite side from a side of the first main surface in the stacking direction.