公开(公告)号：US20170233247A1

公开(公告)日：2017-08-17

申请号：US15432880

申请日：2017-02-14

Applicant: The Regents of the University of California

Inventor： Andrei A. Shkel ,  Alexandra Efimovskaya ,  Doruk Senkal

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81B7/0074 ,  B81B7/007 ,  B81B2207/097 ,  B81C1/00269 ,  B81C1/00634 ,  B81C3/001 ,  B81C2203/0109 ,  B81C2203/0118 ,  B81C2203/0172 ,  B81C2203/019 ,  C03B23/0352

Abstract: An apparatus and method for wafer-level hermetic packaging of MicroElectroMechanical Systems (MEMS) devices of different shapes and form factors is presented in this disclosure. The method is based on bonding a glass cap wafer with fabricated micro-glassblown “bubble-shaped” structures to the substrate glass/Si wafer. Metal traces fabricated on the substrate wafer serve to transfer signals from the sealed cavity of the bubble to the outside world. Furthermore, the method provides for chip-level packaging of MEMS three dimensional structures. The packaging method utilizes a micro glass-blowing process to create “bubbleshaped” glass lids. This new type of lids is used for vacuum packaging of three dimensional MEMS devices, using a standard commercially available type of package.

公开(公告)号：US20140021561A1

公开(公告)日：2014-01-23

申请号：US13838132

申请日：2013-03-15

Applicant: THE REGENTS OF THE UNIVERSITY OF CALIFORNIA

Inventor： Alexander A. Trusov ,  Doruk Senkal ,  Andrei M. Shkel

IPC: B81B3/00 ,  B81C1/00

CPC classification number: B81B3/0018 ,  B81B2201/0271 ,  B81C1/00134 ,  B81C1/00634 ,  G01C19/5691

Abstract: A high temperature micro-glassblowing process and a novel inverted-wineglass architecture that provides self-aligned stem structures. The fabrication process involves the etching of a fused quartz substrate wafer. A TSG or fused quartz device layer is then bonded onto the fused quartz substrate, creating a trapped air pocket or cavity between the substrate and the TSG device layer. The substrate and TSG device layer 14 are then heated at an extremely high temperature of approximately 1700° C., forming an inverted wineglass structure. Finally, the glassblown structure is cut or etched from the substrate to create a three dimensional wineglass resonator micro-device. The inverted wineglass structure may be used as a high performance resonator for use as a key element in precision clock resonators, dynamic MEMS sensors, and MEMS inertial sensors.

Abstract translation: 高温微玻璃吹制工艺和提供自对准茎结构的新型倒酒杯结构。 制造工艺涉及对熔融石英衬底晶片的蚀刻。 然后将TSG或熔融石英器件层接合到熔融石英衬底上，在衬底和TSG器件层之间产生截留的气穴或腔。 然后将衬底和TSG器件层14在大约1700℃的极高温度下加热，形成倒置的酒杯结构。 最后，从衬底切割或蚀刻玻璃泡结构，以形成三维酒杯谐振器微器件。 反向酒杯结构可用作高性能谐振器，用作精密时钟谐振器，动态MEMS传感器和MEMS惯性传感器中的关键元件。