公开(公告)号：US11122678B2

公开(公告)日：2021-09-14

申请号：US16735573

申请日：2020-01-06

Applicant: Tesla, Inc.

Inventor： Vijaykumar Krithivasan ,  Jin Zhao ,  Mengzhi Pang ,  Steven Wayne Butler ,  Ganesh Venkataramanan ,  Yang Sun

IPC: H05K1/02 ,  H01L23/00 ,  H05K3/30

Abstract: A structure having imbedded array of components is described. An example structure includes an imbedded component array layer having an array of imbedded passive devices contained therein. The structure further includes an Integrated Fan-Out (InFO) layer residing adjacent a first surface of the imbedded component array layer having traces and vias formed therein. The structure further includes an insulator layer residing adjacent a second surface of the imbedded component array layer and electrically coupled to at least the InFO layer and vias passing through the imbedded component array layer and electrically coupled to some of vias of the InFO layer.

公开(公告)号：US20200221568A1

公开(公告)日：2020-07-09

申请号：US16735573

申请日：2020-01-06

Applicant: Tesla, Inc.

Inventor： Jin Zhao ,  Vijaykumar Krithivasan ,  Mengzhi Pang ,  Steven Wayne Butler ,  Ganesh Venkataramanan ,  Yang Sun

IPC: H05K1/02 ,  H05K3/30 ,  H01L23/00

Abstract: A structure having embedded array of components is described. An example structure includes an imbedded component array layer having an array of imbedded passive devices contained therein. The structure further includes an Integrated Fan-Out (InFO) layer residing adjacent a first surface of the imbedded component array layer having traces and vias formed therein. The structure further includes an insulator layer residing adjacent a second surf ace of the imbedded component array layer and electrically coupled to at least the InFO layer and vias passing through the imbedded component array layer and electrically coupled to some of vias of the InFO layer.