公开(公告)号：US12261110B2

公开(公告)日：2025-03-25

申请号：US17807475

申请日：2022-06-17

Applicant: Tesla, Inc.

Inventor： Mengzhi Pang ,  Shishuang Sun ,  Ganesh Venkataramanan

IPC: H01L23/522 ,  H01L21/48 ,  H01L23/36 ,  H01L23/498 ,  H01L23/538 ,  H01L25/065

Abstract: An electronic assembly includes a mechanical carrier, a plurality of integrated circuits disposed on the mechanical carrier, a fan out package disposed on the plurality of integrated circuits, a plurality of singulated substrates disposed on the fan out package, a plurality of electronic components disposed on the plurality of singulated substrates, and at least one stiffness ring disposed on the plurality of singulated substrates. A method for constructing an electronic assembly includes identifying a group of known good singulated substrates, joining the group of known good singulated substrates into a substrate panel, attaching at least one bridge to the substrate panel that electrically couples at least two of the known good singulated substrates, and mounting a plurality of electronic components onto the substrate panel, each electronic component of the plurality of electronic components corresponding to a respective known good singulated substrate.

公开(公告)号：US11901310B2

公开(公告)日：2024-02-13

申请号：US17276071

申请日：2019-09-19

Applicant: Tesla, Inc.

Inventor： Mengzhi Pang ,  Shishuang Sun ,  Ganesh Venkataramanan ,  William Arthur McGee ,  Steven Butler

IPC: H01L23/34 ,  H01L23/00 ,  H01L25/065 ,  H01L25/18 ,  H01L23/32 ,  H01L23/538

CPC classification number: H01L23/562 ,  H01L25/0652 ,  H01L25/18 ,  H01L23/32 ,  H01L23/5386

Abstract: An electronic assembly includes a substrate having a first surface and a second surface opposite to the first surface and a plurality of stiffening members coupled to the substrate. The substrate further includes a plurality of substrate interconnects. The electronic assembly further includes a plurality of semiconductor dies mounted on the first surface of the substrate. The plurality of semiconductor dies are electrically connected to each other via the plurality of substrate interconnects. The electronic assembly further includes a plurality of power supply modules mounted on the second surface of the substrate. Each power supply module is disposed opposite to a respective semiconductor die.

公开(公告)号：US20210351104A1

公开(公告)日：2021-11-11

申请号：US17277893

申请日：2019-09-19

Applicant: Tesla, Inc.

Inventor： Robert Yinan Cao ,  Mitchell Heschke ,  Mengzhi Pang ,  Shishuang Sun ,  Vijaykumar Krithivasan

IPC: H01L23/40 ,  H01L25/065 ,  H01L23/498 ,  H01L25/00

Abstract: Described is a multi-chip module that may include a Redistribution Layer (RDL) substrate having Integrated Circuit (IC) dies mounted to a first surface of the RDL substrate. A second plurality of IC dies may be mounted to an opposite second surface. A plurality of sockets can be mounted upon the second plurality of IC dies and a cold plate then mounted to the first plurality of IC dies. The mounting structure may include socket frames coupled to the plurality of sockets.