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公开(公告)号：US09790609B2
公开(公告)日：2017-10-17
申请号：US14719329
申请日：2015-05-22
Applicant: Wistron NeWeb Corp.
Inventor： Tzu-Wen Chuang , Babak Radi , Shih-Hong Chen , Chun-Lin Chen
CPC classification number: C25D5/34 , C23C18/1603 , C23C18/1605 , C23C18/32 , C23C18/38 , C23C18/42 , C23C18/48 , C23C22/02 , H05K3/384 , H05K3/387 , H05K3/389
Abstract: A manufacturing method of a substrate structure including the following steps is provided. A chemical surface treatment is performed on a metal base such that a passivation layer is formed on a surface of the metal base. The metal base is assembled to a substrate. A metal pattern is formed on the substrate, wherein the metal pattern is separated from the metal base. A substrate structure and a metal component are also provided.
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公开(公告)号：US09595754B2
公开(公告)日：2017-03-14
申请号：US14583446
申请日：2014-12-26
Applicant: Wistron NeWeb Corp.
Inventor： Babak Radi , Yong-Jyun Lu , Ming-Chi Chiu , Chien-Min Hsu , Shih-Hong Chen
CPC classification number: H01Q1/38 , H01Q1/22 , H05K1/0326 , H05K1/0346 , H05K1/0353 , H05K3/048 , H05K3/146 , H05K3/16 , H05K3/381 , H05K2201/0129 , H05K2203/0769 , H05K2203/0783 , H05K2203/107 , H05K2203/1184 , H05K2203/308
Abstract: A method for forming a patterned conductive structure is provided. The method includes forming a soluble layer on a surface of a substrate, wherein the soluble layer has an opening exposing a rough portion of the surface. A first conductive layer is formed on the soluble layer, wherein the first conductive layer extends onto the rough portion in the opening. The soluble layer and the first conductive layer on the soluble layer are removed, wherein a portion of the first conductive layer corresponding to the rough portion is remained on the substrate. A patterned conductive structure formed by the method is also provided.
Abstract translation: 提供了一种用于形成图案化导电结构的方法。 该方法包括在基底表面上形成可溶层，其中可溶层具有露出表面粗糙部分的开口。 第一导电层形成在可溶层上，其中第一导电层延伸到开口中的粗糙部分上。 可溶层和可溶层上的第一导电层被去除，其中对应于粗糙部分的第一导电层的一部分残留在基底上。 还提供了通过该方法形成的图案化导电结构。
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公开(公告)号：US09385084B2
公开(公告)日：2016-07-05
申请号：US14825184
申请日：2015-08-13
Applicant: Wistron NeWeb Corp.
Inventor： Babak Radi , Tzu-Wen Chuang , Shih-Hong Chen
IPC: H01L23/52 , H01L23/528 , H01L23/522 , H01L23/532
CPC classification number: H01L23/528 , H01L23/49838 , H01L23/5223 , H01L23/5227 , H01L23/5228 , H01L23/53204 , H01L23/53228 , H01L23/53233 , H01L23/53242 , H01L2924/0002 , H01L2924/00
Abstract: A metal pattern structure having a positioning layer thereon is provided. The positioning layer is located within a predetermined region of the metal pattern structure and located directly on the surface of a metal layer of the metal pattern structure.
Abstract translation: 提供其上具有定位层的金属图案结构。 定位层位于金属图案结构的预定区域内，并且直接位于金属图案结构的金属层的表面上。
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14.发明授权Three-dimensional antenna and a wireless communication apparatus provided with the same 有权三维天线及具备该三维天线的无线通信装置公开(公告)号：US09209515B2
公开(公告)日：2015-12-08
申请号：US13677356
申请日：2012-11-15
Applicant: C/O WISTRON NeWEB CORP
Inventor： Chia-Hong Lin , Jui-Hsiang Chou , Chang-Hsiu Huang , Shih-Hong Chen , Yi-Cheng Wu
Abstract: A three-dimensional antenna includes an L-shaped grounding element and an L-shaped radiating element. The grounding and radiating elements are arranged in a U shape. The grounding element includes a first grounding segment, a second grounding segment extending from the first grounding segment, and a short-circuit point disposed at the second grounding segment. The radiating element includes a first radiating segment opposite to the first grounding segment, a second radiating segment extending from the first radiating segment and adjacent to the second grounding segment, a feeding point disposed at the second radiating segment, and two radiator arms being able to generate respective resonant frequencies.
Abstract translation: 三维天线包括L形接地元件和L形辐射元件。 接地和辐射元件布置成U形。 接地元件包括第一接地段，从第一接地段延伸的第二接地段和设置在第二接地段处的短路点。 所述辐射元件包括与所述第一接地段相对的第一辐射段，从所述第一辐射段延伸并邻近所述第二接地段的第二辐射段，设置在所述第二辐射段处的馈电点，以及两个辐射臂， 产生相应的谐振频率。
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