公开(公告)号：US20210225815A1

公开(公告)日：2021-07-22

申请号：US17203314

申请日：2021-03-16

Applicant: X Display Company Technology Limited

Inventor： Christopher Bower ,  Matthew Meitl ,  David Gomez ,  Salvatore Bonafede ,  David Kneeburg ,  Alin Fecioru ,  Carl Prevatte

IPC: H01L25/075 ,  G09G3/32 ,  H01L33/38 ,  H01L23/482 ,  H01L23/538 ,  H05B45/50 ,  G02F1/167 ,  H01L33/62 ,  H01L33/50 ,  H01L33/60 ,  G02B26/04 ,  H01L25/16 ,  H01L33/36 ,  H01L33/48 ,  H05K1/03 ,  H05K1/09 ,  H05K1/18 ,  H05K5/00 ,  G09G3/22 ,  H01L27/15 ,  F21V9/08 ,  H01L33/58

Abstract: The disclosed technology provides micro-assembled micro-LED displays and lighting elements using arrays of micro-LEDs that are too small (e.g., micro-LEDs with a width or diameter of 10 μm to 50 μm), numerous, or fragile to assemble by conventional means. The disclosed technology provides for micro-LED displays and lighting elements assembled using micro-transfer printing technology. The micro-LEDs can be prepared on a native substrate and printed to a display substrate (e.g., plastic, metal, glass, or other materials), thereby obviating the manufacture of the micro-LEDs on the display substrate. In certain embodiments, the display substrate is transparent and/or flexible.

公开(公告)号：US11950375B2

公开(公告)日：2024-04-02

申请号：US17245986

申请日：2021-04-30

Applicant: X Display Company Technology Limited

Inventor： David Gomez ,  Christopher Andrew Bower ,  Raja Fazan Gul ,  António José Marques Trindade ,  Ronald S. Cok

IPC: H05K3/30 ,  B41F16/00 ,  B65G47/90 ,  H03H3/02 ,  H03H3/08 ,  H05K3/40 ,  H10N30/06 ,  H01L21/67 ,  H10N30/073

CPC classification number: H05K3/305 ,  B41F16/006 ,  B65G47/90 ,  H03H3/02 ,  H03H3/08 ,  H05K3/30 ,  H05K3/301 ,  H05K3/303 ,  H05K3/40 ,  H05K3/4007 ,  H05K3/4092 ,  H10N30/06 ,  H01L21/67144 ,  H01L2933/0066 ,  H10N30/073

Abstract: A method of printing comprises providing a component source wafer comprising components, a transfer device, and a patterned substrate. The patterned substrate comprises substrate posts that extend from a surface of the patterned substrate. Components are picked up from the component source wafer by adhering the components to the transfer device. One or more of the picked-up components are printed to the patterned substrate by disposing each of the one or more picked-up components onto one of the substrate posts, thereby providing one or more printed components in a printed structure.

公开(公告)号：US11854788B2

公开(公告)日：2023-12-26

申请号：US17203314

申请日：2021-03-16

Applicant: X Display Company Technology Limited

Inventor： Christopher Bower ,  Matthew Meitl ,  David Gomez ,  Salvatore Bonafede ,  David Kneeburg ,  Alin Fecioru ,  Carl Prevatte

IPC: H01L25/075 ,  G09G3/32 ,  H01L33/38 ,  H01L23/482 ,  H01L23/538 ,  G02F1/167 ,  H01L33/62 ,  H01L33/50 ,  H01L33/60 ,  G02B26/04 ,  H01L25/16 ,  H01L33/36 ,  H01L33/48 ,  H05K1/03 ,  H05K1/09 ,  H05K1/18 ,  H05K5/00 ,  G09G3/22 ,  H01L27/15 ,  F21V9/08 ,  H01L33/58 ,  F21Y105/10 ,  F21Y115/10 ,  F21Y113/13 ,  H01L33/20 ,  H01L33/40

CPC classification number: H01L25/0753 ,  F21V9/08 ,  G02B26/04 ,  G02F1/167 ,  G09G3/22 ,  G09G3/32 ,  H01L23/4821 ,  H01L23/5381 ,  H01L25/167 ,  H01L27/156 ,  H01L33/36 ,  H01L33/38 ,  H01L33/385 ,  H01L33/48 ,  H01L33/50 ,  H01L33/502 ,  H01L33/508 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H05K1/0306 ,  H05K1/09 ,  H05K1/181 ,  H05K1/182 ,  H05K5/0017 ,  F21Y2105/10 ,  F21Y2113/13 ,  F21Y2115/10 ,  G09G2300/0452 ,  G09G2300/0842 ,  G09G2310/0264 ,  H01L33/20 ,  H01L33/405 ,  H01L2224/18 ,  H01L2224/73267 ,  H01L2224/92244 ,  H05K2201/0329 ,  H05K2201/10106 ,  H05K2201/10128 ,  H05K2201/10166

Abstract: The disclosed technology provides micro-assembled micro-LED displays and lighting elements using arrays of micro-LEDs that are too small (e.g., micro-LEDs with a width or diameter of 10 μm to 50 μm), numerous, or fragile to assemble by conventional means. The disclosed technology provides for micro-LED displays and lighting elements assembled using micro-transfer printing technology. The micro-LEDs can be prepared on a native substrate and printed to a display substrate (e.g., plastic, metal, glass, or other materials), thereby obviating the manufacture of the micro-LEDs on the display substrate. In certain embodiments, the display substrate is transparent and/or flexible.

公开(公告)号：US11528808B2

公开(公告)日：2022-12-13

申请号：US16207665

申请日：2018-12-03

Applicant: X Display Company Technology Limited

Inventor： David Gomez ,  Christopher Andrew Bower ,  Raja Fazan Gul ,  António José Marques Trindade ,  Ronald S. Cok

IPC: H05K3/30 ,  B41F16/00 ,  B65G47/90 ,  H03H3/08 ,  H01L41/29 ,  H03H3/02 ,  H05K3/40 ,  H01L41/313 ,  H01L21/67

Abstract: A method of printing comprises providing a component source wafer comprising components, a transfer device, and a patterned substrate. The patterned substrate comprises substrate posts that extend from a surface of the patterned substrate. Components are picked up from the component source wafer by adhering the components to the transfer device. One or more of the picked-up components are printed to the patterned substrate by disposing each of the one or more picked-up components onto one of the substrate posts, thereby providing one or more printed components in a printed structure.

公开(公告)号：US11472171B2

公开(公告)日：2022-10-18

申请号：US14804077

申请日：2015-07-20

Applicant: X Display Company Technology Limited

Inventor： Christopher Bower ,  Matthew Meitl ,  David Gomez ,  Salvatore Bonafede ,  David Kneeburg

IPC: H01L21/683 ,  B41K3/12 ,  B41F16/00 ,  H01L23/00 ,  H01L21/3065 ,  H01L21/52 ,  H01L21/56 ,  H01L23/29 ,  H01L21/67 ,  B25J15/00 ,  H01L23/31 ,  H01L25/00 ,  H01L31/18 ,  B41K3/04

Abstract: In an aspect, a system and method for assembling a semiconductor device on a receiving surface of a destination substrate is disclosed. In another aspect, a system and method for assembling a semiconductor device on a destination substrate with topographic features is disclosed. In another aspect, a gravity-assisted separation system and method for printing semiconductor device is disclosed. In another aspect, various features of a transfer device for printing semiconductor devices are disclosed.

公开(公告)号：US20210101329A1

公开(公告)日：2021-04-08

申请号：US17125037

申请日：2020-12-17

Applicant: X Display Company Technology Limited

Inventor： Tanya Yvette Moore ,  Ronald S. Cok ,  David Gomez

IPC: B29C59/02 ,  H01L23/00 ,  H01L21/683 ,  B41F17/00 ,  B29C59/00

Abstract: A stamp for micro-transfer printing includes a support having a support stiffness and a support coefficient of thermal expansion (CTE). A pedestal layer is formed on the support, the pedestal layer having a pedestal layer stiffness that is less than the support stiffness and a pedestal layer coefficient of thermal expansion (CTE) that is different from the support coefficient of thermal expansion (CTE). A stamp layer is formed on the pedestal layer, the stamp layer having a body and one or more protrusions extending from the body in a direction away from the pedestal layer. The stamp layer has a stamp layer stiffness that is less than the support stiffness and a stamp layer coefficient of thermal expansion that is different from the support coefficient of thermal expansion.

公开(公告)号：US10790173B2

公开(公告)日：2020-09-29

申请号：US16207690

申请日：2018-12-03

Applicant: X Display Company Technology Limited

Inventor： David Gomez ,  Christopher Andrew Bower ,  Raja Fazan Gul ,  António José Marques Trindade ,  Ronald S. Cok

IPC: H01L41/047 ,  H01L41/053 ,  H01L33/62 ,  H01L21/67 ,  H01L23/498 ,  H01L23/00 ,  H01L23/538 ,  H01L23/053 ,  H01L23/10 ,  H01L41/25 ,  H01L21/683 ,  H01L23/13 ,  H03H9/05 ,  H03H3/02 ,  H03H3/08 ,  H01L41/113

Abstract: A device structure comprises a patterned substrate comprising a substrate surface and a substrate post protruding from the substrate surface. The substrate post comprises a substrate post material. A component has a component top side and a component bottom side opposite the component top side. The component bottom side is disposed on the substrate post and extends over at least one edge of the substrate post. The component comprises a component material different from the substrate post material and the component comprises a broken (e.g., fractured) or separated component tether.

公开(公告)号：US20240349431A1

公开(公告)日：2024-10-17

申请号：US18584089

申请日：2024-02-22

Applicant: X Display Company Technology Limited

Inventor： David Gomez ,  Christopher Andrew Bower ,  Raja Fazan Gul ,  António José Marques Trindade ,  Ronald S. Cok

IPC: H05K3/30 ,  B41F16/00 ,  B65G47/90 ,  H01L21/67 ,  H03H3/02 ,  H03H3/08 ,  H05K3/40 ,  H10N30/06 ,  H10N30/073

CPC classification number: H05K3/305 ,  B41F16/006 ,  B65G47/90 ,  H03H3/02 ,  H03H3/08 ,  H05K3/30 ,  H05K3/301 ,  H05K3/303 ,  H05K3/40 ,  H05K3/4007 ,  H05K3/4092 ,  H10N30/06 ,  H01L21/67144 ,  H01L2933/0066 ,  H10N30/073

Abstract: A method of printing comprises providing a component source wafer comprising components, a transfer device, and a patterned substrate. The patterned substrate comprises substrate posts that extend from a surface of the patterned substrate. Components are picked up from the component source wafer by adhering the components to the transfer device. One or more of the picked-up components are printed to the patterned substrate by disposing each of the one or more picked-up components onto one of the substrate posts, thereby providing one or more printed components in a printed structure.

公开(公告)号：US20240153927A1

公开(公告)日：2024-05-09

申请号：US18507597

申请日：2023-11-13

Applicant: X Display Company Technology Limited

Inventor： Christopher Bower ,  Matthew Meitl ,  David Gomez ,  Salvatore Bonafede ,  David Kneeburg ,  Alin Fecioru ,  Carl Prevatte

IPC: H01L25/075 ,  F21V9/08 ,  G02B26/04 ,  G02F1/167 ,  G09G3/22 ,  G09G3/32 ,  H01L23/482 ,  H01L23/538 ,  H01L25/16 ,  H01L27/15 ,  H01L33/36 ,  H01L33/38 ,  H01L33/48 ,  H01L33/50 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H05K1/03 ,  H05K1/09 ,  H05K1/18 ,  H05K5/00

CPC classification number: H01L25/0753 ,  F21V9/08 ,  G02B26/04 ,  G02F1/167 ,  G09G3/22 ,  G09G3/32 ,  H01L23/4821 ,  H01L23/5381 ,  H01L25/167 ,  H01L27/156 ,  H01L33/36 ,  H01L33/38 ,  H01L33/385 ,  H01L33/48 ,  H01L33/50 ,  H01L33/502 ,  H01L33/508 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H05K1/0306 ,  H05K1/09 ,  H05K1/181 ,  H05K1/182 ,  H05K5/0017 ,  F21Y2105/10 ,  G09G2300/0452 ,  G09G2300/0842

Abstract: The disclosed technology provides micro-assembled micro-LED displays and lighting elements using arrays of micro-LEDs that are too small (e.g., micro-LEDs with a width or diameter of 10 μm to 50 μm), numerous, or fragile to assemble by conventional means. The disclosed technology provides for micro-LED displays and lighting elements assembled using micro-transfer printing technology. The micro-LEDs can be prepared on a native substrate and printed to a display substrate (e.g., plastic, metal, glass, or other materials), thereby obviating the manufacture of the micro-LEDs on the display substrate. In certain embodiments, the display substrate is transparent and/or flexible.

公开(公告)号：US11482979B2

公开(公告)日：2022-10-25

申请号：US16207774

申请日：2018-12-03

Applicant: X Display Company Technology Limited

Inventor： António José Marques Trindade ,  Raja Fazan Gul ,  Robert R. Rotzoll ,  Alexandre Chikhaoui ,  David Gomez ,  Ronald S. Cok

IPC: H03H3/08 ,  H03H3/02 ,  H03H9/54 ,  H03H9/05 ,  H03H9/64

Abstract: A method of making a micro-module structure comprises providing a substrate, the substrate having a substrate surface and comprising a substrate post protruding from the substrate surface. A component is disposed on the substrate post, the component having a component top side and a component bottom side opposite the component top side, the component bottom side disposed on the substrate post. The component extends over at least one edge of the substrate post. One or more component electrodes are disposed on the component.