公开(公告)号：US20240295692A1

公开(公告)日：2024-09-05

申请号：US18593039

申请日：2024-03-01

Applicant: X-Celeprint Limited

Inventor： Ronald S. Cok ,  David Gomez

IPC: G02B6/122 ,  G02B6/12 ,  G02B6/136

CPC classification number: G02B6/122 ,  G02B6/12004 ,  G02B6/136

Abstract: A micro-optical structure includes a structure substrate comprising a cavity and a micro-optical component disposed entirely and directly over or in the cavity. The micro-optical component includes a micro-optical element and a component tether physically attached to an anchor portion of the structure substrate and in contact with the micro-optical element. The structure substrate and the micro-optical component can be monolithic, for example unitary and comprise a same material or are the same material. The micro-optical component can be disposed on a sacrificial portion disposed on a micro-optical component source wafer differentially etchable form the sacrificial portion. The micro-optical component can be disposed on a micro-optical component source wafer patterned with an encapsulation layer where the micro-optical component is differentially etchable from the encapsulation layer and the micro-optical component.

公开(公告)号：US20230131998A1

公开(公告)日：2023-04-27

申请号：US17968418

申请日：2022-10-18

Applicant: X-Celeprint Limited

Inventor： David Gomez ,  Ronald S. Cok

IPC: H01L21/027 ,  H01L21/768 ,  H01L21/311

Abstract: A printed structure includes a substrate comprising a substrate surface, a substrate circuit disposed in or on in a circuit area of the substrate surface, a substrate post protruding from the substrate surface exterior to the circuit area, and a component having a component top side and a component bottom side opposite the component top side. The component bottom side can be disposed on the substrate post and adhered to the substrate surface forming an air gap between the component bottom side and the substrate circuit. The substrate post can comprise a substrate post material that is a cured adhesive. Some embodiments comprise a substrate electrode and the component comprises an electrically conductive connection post extending from the component bottom side toward the substrate in electrical contact with the substrate electrode.

公开(公告)号：US20200176286A1

公开(公告)日：2020-06-04

申请号：US16207738

申请日：2018-12-03

Applicant: X-Celeprint Limited

Inventor： Robert R. Rotzoll ,  António José Marques Trindade ,  Raja Fazan Gul ,  Alexandre Chikhaoui ,  David Gomez ,  Ronald S. Cok

IPC: H01L21/67 ,  H01L21/683 ,  H01L23/00 ,  H01L25/04 ,  H01L41/313 ,  H01L41/311 ,  H01L41/047 ,  H01L41/053 ,  H03H9/05 ,  B41F16/00 ,  B65G47/90

Abstract: A module structure comprises a patterned substrate having a substrate surface and comprising a substrate post protruding from the substrate surface. A component is disposed on the substrate post. The component has a component top side and a component bottom side opposite the component top side. The component bottom side is disposed on the substrate post. The component extends over at least one edge of the substrate post. One or more component electrodes are disposed on the component.

公开(公告)号：US20200176285A1

公开(公告)日：2020-06-04

申请号：US16207690

申请日：2018-12-03

Applicant: X-Celeprint Limited

Inventor： David Gomez ,  Christopher Andrew Bower ,  Raja Fazan Gul ,  António José Marques Trindade ,  Ronald S. Cok

IPC: H01L21/67 ,  H01L23/13 ,  H01L23/498 ,  H01L23/00 ,  H01L23/538 ,  H01L23/053 ,  H01L23/10 ,  H01L41/053 ,  H01L41/047 ,  H01L41/25 ,  H01L21/683

Abstract: A device structure comprises a patterned substrate comprising a substrate surface and a substrate post protruding from the substrate surface. The substrate post comprises a substrate post material. A component has a component top side and a component bottom side opposite the component top side. The component bottom side is disposed on the substrate post and extends over at least one edge of the substrate post. The component comprises a component material different from the substrate post material and the component comprises a broken (e.g., fractured) or separated component tether.

公开(公告)号：US10446719B2

公开(公告)日：2019-10-15

申请号：US14743915

申请日：2015-06-18

Applicant: X-Celeprint Limited

Inventor： Christopher Bower ,  Matthew Meitl ,  David Gomez ,  Salvatore Bonafede ,  David Kneeburg ,  Alin Fecioru ,  Carl Prevatte

IPC: G09G3/32 ,  H01L27/15 ,  H01L33/38 ,  H01L23/482 ,  H01L23/538 ,  H01L25/075 ,  H01L33/62 ,  H01L33/50 ,  H01L33/60 ,  H05B33/08 ,  G02B26/04 ,  G02F1/167 ,  H01L25/16 ,  H01L33/36 ,  H01L33/48 ,  H05K1/03 ,  H05K1/09 ,  H05K1/18 ,  H05K5/00 ,  G09G3/22 ,  F21V9/08 ,  H01L33/58 ,  F21K9/60 ,  H01L33/20 ,  H01L33/40 ,  F21Y105/10 ,  F21Y115/10 ,  F21Y113/13 ,  F21Y101/00 ,  F21Y105/00

Abstract: The disclosed technology provides micro-assembled micro-LED displays and lighting elements using arrays of micro-LEDs that are too small (e.g., micro-LEDs with a width or diameter of 10 μm to 50 μm), numerous, or fragile to assemble by conventional means. The disclosed technology provides for micro-LED displays and lighting elements assembled using micro-transfer printing technology. The micro-LEDs can be prepared on a native substrate and printed to a display substrate (e.g., plastic, metal, glass, or other materials), thereby obviating the manufacture of the micro-LEDs on the display substrate. In certain embodiments, the display substrate is transparent and/or flexible.

公开(公告)号：US10396238B2

公开(公告)日：2019-08-27

申请号：US16137809

申请日：2018-09-21

Applicant: X-Celeprint Limited

Inventor： Christopher Bower ,  Matthew Meitl ,  David Gomez ,  Carl Prevatte ,  Salvatore Bonafede

IPC: H01L21/30 ,  H01L21/46 ,  H01L21/00 ,  H01L33/00 ,  H01L33/20 ,  H01L33/40 ,  H01L33/26 ,  H01L29/78 ,  H01L21/683 ,  H01L33/32 ,  H01L33/62 ,  H01L33/38 ,  H01L33/36 ,  H01L33/44

Abstract: The present invention provides structures and methods that enable the construction of micro-LED chiplets formed on a sapphire substrate that can be micro-transfer printed. Such printed structures enable low-cost, high-performance arrays of electrically connected micro-LEDs useful, for example, in display systems. Furthermore, in an embodiment, the electrical contacts for printed LEDs are electrically interconnected in a single set of process steps. In certain embodiments, formation of the printable micro devices begins while the semiconductor structure remains on a substrate. After partially forming the printable micro devices, a handle substrate is attached to the system opposite the substrate such that the system is secured to the handle substrate. The substrate may then be removed and formation of the semiconductor structures is completed. Upon completion, the printable micro devices may be micro transfer printed to a destination substrate.

公开(公告)号：US10224460B2

公开(公告)日：2019-03-05

申请号：US14743788

申请日：2015-06-18

Applicant: X-Celeprint Limited

Inventor： Christopher Bower ,  Matthew Meitl ,  David Gomez ,  Salvatore Bonafede ,  David Kneeburg ,  Alin Fecioru ,  Carl Prevatte

IPC: H01L33/00 ,  H01L29/18 ,  H01L33/38 ,  G09G3/32 ,  H01L23/482 ,  H01L23/538 ,  H01L25/075 ,  H01L33/62 ,  H01L33/50 ,  H01L33/60 ,  H05B33/08 ,  G02B26/04 ,  G02F1/167 ,  H01L25/16 ,  H01L33/36 ,  H01L33/48 ,  H05K1/03 ,  H05K1/09 ,  H05K1/18 ,  H05K5/00 ,  G09G3/22 ,  H01L27/15 ,  F21K99/00 ,  F21V9/08 ,  H01L33/58 ,  H01L33/20 ,  H01L33/40 ,  F21Y105/10 ,  F21Y115/10 ,  F21Y113/13 ,  F21Y101/02 ,  F21Y105/00

Abstract: The disclosed technology provides micro-assembled micro-LED displays and lighting elements using arrays of micro-LEDs that are too small (e.g., micro-LEDs with a width or diameter of 10 μm to 50 μm), numerous, or fragile to assemble by conventional means. The disclosed technology provides for micro-LED displays and lighting elements assembled using micro-transfer printing technology. The micro-LEDs can be prepared on a native substrate and printed to a display substrate (e.g., plastic, metal, glass, or other materials), thereby obviating the manufacture of the micro-LEDs on the display substrate. In certain embodiments, the display substrate is transparent and/or flexible.

公开(公告)号：US20180001614A1

公开(公告)日：2018-01-04

申请号：US15705755

申请日：2017-09-15

Applicant: X-Celeprint Limited

Inventor： Christopher Bower ,  Matthew Meitl ,  David Gomez ,  Salvatore Bonafede ,  David Kneeburg

IPC: B41F16/00 ,  B25J15/00 ,  H01L21/52 ,  H01L21/56 ,  H01L21/67 ,  H01L21/3065 ,  H01L23/29 ,  H01L23/31 ,  H01L23/00 ,  H01L25/00 ,  H01L31/18 ,  B41K3/12 ,  H01L21/683

Abstract: In an aspect, a system and method for assembling a semiconductor device on a receiving surface of a destination substrate is disclosed. In another aspect, a system and method for assembling a semiconductor device on a destination substrate with topographic features is disclosed. In another aspect, a gravity-assisted separation system and method for printing semiconductor device is disclosed. In another aspect, various features of a transfer device for printing semiconductor devices are disclosed.

公开(公告)号：US09698308B2

公开(公告)日：2017-07-04

申请号：US14743919

申请日：2015-06-18

Applicant: X-Celeprint Limited

Inventor： Christopher Bower ,  Matthew Meitl ,  David Gomez ,  Salvatore Bonafede ,  David Kneeburg ,  Alin Fecioru ,  Carl Prevatte

IPC: H01L33/38 ,  G09G3/32 ,  H01L25/075 ,  H01L33/62 ,  H01L33/50 ,  H01L33/60 ,  H05B33/08 ,  G02B26/04 ,  G02F1/167 ,  H01L25/16 ,  H01L33/36 ,  H01L33/48 ,  H05K1/03 ,  H05K1/09 ,  H05K1/18 ,  H05K5/00 ,  G09G3/22 ,  H01L27/15 ,  H01L33/20 ,  H01L33/40 ,  F21Y105/10 ,  F21Y115/10 ,  F21Y113/13

CPC classification number: H01L33/385 ,  F21K9/50 ,  F21V9/08 ,  F21Y2101/025 ,  F21Y2105/003 ,  F21Y2105/10 ,  F21Y2113/13 ,  F21Y2115/10 ,  G02B26/04 ,  G02F1/167 ,  G09G3/22 ,  G09G3/32 ,  G09G2300/0452 ,  G09G2300/0842 ,  G09G2310/0264 ,  H01L23/4821 ,  H01L23/5381 ,  H01L25/0753 ,  H01L25/167 ,  H01L27/156 ,  H01L33/20 ,  H01L33/36 ,  H01L33/38 ,  H01L33/405 ,  H01L33/48 ,  H01L33/50 ,  H01L33/502 ,  H01L33/508 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/18 ,  H01L2224/73267 ,  H01L2224/92244 ,  H05B33/089 ,  H05K1/0306 ,  H05K1/09 ,  H05K1/181 ,  H05K1/182 ,  H05K5/0017 ,  H05K2201/0329 ,  H05K2201/10106 ,  H05K2201/10128 ,  H05K2201/10166

Abstract: The disclosed technology provides micro-assembled micro-LED displays and lighting elements using arrays of micro-LEDs that are too small (e.g., micro-LEDs with a width or diameter of 10 μm to 50 μm), numerous, or fragile to assemble by conventional means. The disclosed technology provides for micro-LED displays and lighting elements assembled using micro-transfer printing technology. The micro-LEDs can be prepared on a native substrate and printed to a display substrate (e.g., plastic, metal, glass, or other materials), thereby obviating the manufacture of the micro-LEDs on the display substrate. In certain embodiments, the display substrate is transparent and/or flexible.

公开(公告)号：US09550353B2

公开(公告)日：2017-01-24

申请号：US14804047

申请日：2015-07-20

Applicant: X-Celeprint Limited

Inventor： Christopher Bower ,  Matthew Meitl ,  David Gomez ,  Salvatore Bonafede ,  David Kneeburg

IPC: B41F16/00 ,  H01L21/3065 ,  H01L21/52 ,  H01L21/56 ,  H01L23/29 ,  B41K3/12 ,  H01L21/683 ,  H01L21/67 ,  H01L23/00 ,  B25J15/00 ,  H01L23/31 ,  H01L25/00 ,  H01L31/18

CPC classification number: B41F16/00 ,  B25J15/00 ,  B41F16/0046 ,  B41F16/006 ,  B41F16/0073 ,  B41K3/04 ,  B41K3/12 ,  H01L21/3065 ,  H01L21/52 ,  H01L21/565 ,  H01L21/568 ,  H01L21/67103 ,  H01L21/683 ,  H01L21/6835 ,  H01L23/293 ,  H01L23/3171 ,  H01L24/75 ,  H01L24/83 ,  H01L24/97 ,  H01L25/50 ,  H01L31/1892 ,  H01L2221/68318 ,  H01L2221/68354 ,  H01L2221/68368 ,  H01L2221/68377 ,  H01L2221/68381 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/75315 ,  H01L2224/7598 ,  H01L2224/83001 ,  H01L2224/83011 ,  H01L2224/83013 ,  H01L2224/83024 ,  H01L2224/832 ,  H01L2224/83894 ,  H01L2224/83895 ,  H01L2924/10253 ,  H01L2924/1032 ,  H01L2924/10328 ,  H01L2924/10329 ,  H01L2924/10332 ,  H01L2924/10335 ,  H01L2924/10336 ,  H01L2924/10337 ,  H01L2924/10338 ,  H01L2924/1034

Abstract: In an aspect, a system and method for assembling a semiconductor device on a receiving surface of a destination substrate is disclosed. In another aspect, a system and method for assembling a semiconductor device on a destination substrate with topographic features is disclosed. In another aspect, a gravity-assisted separation system and method for printing semiconductor device is disclosed. In another aspect, various features of a transfer device for printing semiconductor devices are disclosed.

Abstract translation: 在一方面，公开了一种用于在目的基板的接收表面上组装半导体器件的系统和方法。 另一方面，公开了一种用于在具有地形特征的目的地基板上组装半导体器件的系统和方法。 另一方面，公开了一种用于印刷半导体器件的重力辅助分离系统和方法。 另一方面，公开了用于印刷半导体器件的转印装置的各种特征。