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    HIGH-CAPACITY MEMORY AIR COOLING DEVICE
    13.
    发明公开
    HIGH-CAPACITY MEMORY AIR COOLING DEVICE 审中-公开

    公开(公告)号：US20240077918A1

    公开(公告)日：2024-03-07

    申请号：US17903770

    申请日：2022-09-06

    Applicant: Lenovo Enterprise Solutions (Singapore) Pte. Ltd.

    Inventor： Jeffrey S Holland ,  Rachel Pollock ,  Bejoy J Kochuparambil

    IPC: G06F1/20 ,  H05K7/20

    CPC classification number: G06F1/20 ,  H05K7/20145 ,  H05K7/20154 ,  H05K7/20409 ,  H05K7/20509 ,  H05K7/20736 ,  G06F2200/201

    Abstract: A combination heat sink/air director apparatus includes conduction plates extending into gaps between dual in-line memory module (“DIMM”) installed in computing device. A plurality of thermal interface material (“TIM”) pads are coupled to each side of each of the plurality of conduction plates. A heat sink thermally is coupled to the conduction plates and mounted above the conduction plates. Air impedance of air flow through an interface includes air flow to the heat sink is selected to balance air flow between the interface and components adjacent to the interface. A chosen percentage of air flow passes through the interface for the balance of air flow. Each conduction plate and the TIM pads coupled to each side of the conduction plate are sized to contact and thermally couple to the DIMMs of the plurality of DIMMs on either side of the conduction plate and associated TIM pads.

    LAPTOP COOLING SYSTEM PAD WITH AC UNIT COOLER
    15.
    发明公开
    LAPTOP COOLING SYSTEM PAD WITH AC UNIT COOLER 审中-公开

    公开(公告)号：US20240045482A1

    公开(公告)日：2024-02-08

    申请号：US17883213

    申请日：2022-08-08

    Applicant: Ryan White

    Inventor： Ryan White

    IPC: G06F1/20 ,  F28D15/02

    CPC classification number: G06F1/203 ,  F28D15/0266 ,  G06F2200/201

    Abstract: A laptop cooling pad with an external AC Unit having one or more heat-dissipating fans adjustable in position is disclosed with a cooler circulating cool air to the pad in question. The laptop cooling pad is provided with a ventilation portion so that a heat-dissipating fan can be mounted on the ventilation portion through a fan support. The ventilation portion has a groove for receiving AC cooled liquid through the radiator so cool air can circular using fan support to move the heat-dissipating fan inside the laptop cooling pad and make the heat-dissipating fan close to a heat source, thereby ensuring the heat-dissipating effect of the laptop cooling pad. With an added function of a cooler air to be flown through specific pipes and ventilation systems. The utility model discloses a laptop cooler which comprises an upper cover plate, a bottom plate, a support, a fan, a refrigerating machine, a condenser pipe, aluminum sheets, an exhaust fan and a slide track, wherein the refrigerating machine is arranged on and attached to the bottom plate and is connected with the condenser pipe; the condenser pipe is located below the fan; the aluminum sheets parallel to a cross section of the condenser pipe are arranged outside the condenser pipe; the slide track is arranged on the upper cover plate matched with the bottom plate; the exhaust fan is arranged on the slide track; and the support is arranged below the bottom plate. The laptop cooler can blow out cold air, air movement in a laptop is accelerated, the cooling efficiency of the laptop is accelerated via the external AC cooling unit adjacent to it, and the service life of the laptop is prolonged.

    Contiguous plane infrastructure for computing systems
    16.
    发明授权
    Contiguous plane infrastructure for computing systems 有权

    公开(公告)号：US11803216B2

    公开(公告)日：2023-10-31

    申请号：US17166595

    申请日：2021-02-03

    Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

    Inventor： Kevin B. Leigh ,  Harvey J. Lunsman ,  John R. Grady

    IPC: H05K7/20 ,  G06F1/18 ,  G06F1/20

    CPC classification number: G06F1/20 ,  G06F1/181 ,  G06F1/183 ,  G06F1/189 ,  H05K7/20781 ,  G06F2200/201

    Abstract: A computing system includes an array of compute module racks, each compute module rack containing a plurality of compute modules and each compute module being accessible by extracting the compute module rack out of the array of compute module racks. A liquid distribution infrastructure comprising liquid coolant supply lines and return lines is arranged in a first plane adjacent to the array of compute module racks and coupled to each of the vertical racks to provide liquid cooling for the plurality of compute module racks. A power distribution infrastructure comprising power supply lines is arranged in a second plane adjacent to the array of compute module racks and coupled to each of the compute module racks. An optical interconnection infrastructure comprising optical fiber cables is arranged in a third plane adjacent to the array of compute module racks and coupled to each of the compute module racks.

    Modular Thermal Heat Sink Device
    17.
    发明公开
    Modular Thermal Heat Sink Device 审中-公开

    公开(公告)号：US20230328920A1

    公开(公告)日：2023-10-12

    申请号：US18037163

    申请日：2021-11-24

    Applicant: Nexalus Limited

    Inventor： Anthony Robinson ,  Cathal Wilson ,  Kenneth O'Mahony

    IPC: H05K7/20 ,  G06F1/20

    CPC classification number: H05K7/20254 ,  G06F1/20 ,  G06F2200/201

    Abstract: A modular liquid-cooled thermal heat sink device configured to thermally engage with a thermal substrate. The device comprises a housing assembly having a body defining a volume, the housing assembly comprising a thermal cooling plate configured to be in thermal contact with the thermal substrate, a fluid inlet and a fluid outlet, the housing assembly being configured to facilitate fluid circulation within the body to effect an operative cooling of the thermal substrate through the thermal cooling plate, the body comprising a plurality of first engaging features spaced about a perimeter of the body. The device further comprises a plurality of removable arms each comprising a first and second end, each of the plurality of arms being configured to mate with the body at a respective one of the plurality of first engaging features, wherein each of the first ends defines a second engaging feature dimensioned to cooperate and form an engagement with a respective first engaging feature, and wherein each of the second ends is configured to effect an operative fixing of the device to a supporting surface through application of a force on each of the second ends, the force being perpendicular to the supporting surface.

    Cooling Device For Cooling Components Of A Circuit Board
    20.
    发明公开
    Cooling Device For Cooling Components Of A Circuit Board 审中-公开

    公开(公告)号：US20230254995A1

    公开(公告)日：2023-08-10

    申请号：US18017727

    申请日：2021-07-07

    Applicant: Nexalus Limited

    Inventor： Anthony Robinson ,  Cathal Wilson ,  Kenneth O'Mahony

    IPC: H05K7/20 ,  G06F1/20

    CPC classification number: H05K7/20254 ,  H05K7/20436 ,  G06F1/20 ,  G06F2200/201

    Abstract: A cooling device for cooling electronic components comprising a primary electronic component, and one or more secondary electronic components of a circuit board is provided. The cooling device comprises a first cooling component. The first cooling component comprises a first cooling member configured to contact a surface of the primary electronic component. The first cooling member is configured to be in fluid communication with a fluid to effect an operative convection cooling of the surface of the primary electronic component. The cooling device further comprises a second cooling component. The second cooling component comprises a second cooling member configured to contact a respective thermal surface of the one or more secondary electronic components to effect an operative conduction cooling of the one or more secondary electronic components. The second cooling member is thermally coupled to the first cooling member.

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