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公开(公告)号：US09860982B1
公开(公告)日：2018-01-02
申请号：US15442699
申请日：2017-02-26
Applicant: XSENSOR Technology Corporation
Inventor： Ian Main , Timothy Carl Gorjanc
CPC classification number: H05K1/09 , H05K1/028 , H05K1/038 , H05K1/05 , H05K3/32 , H05K3/328 , H05K3/4644 , H05K2201/0129 , H05K2201/0137 , H05K2201/10227 , H05K2203/11
Abstract: A process makes electrical connections between electrical wires and flexible conductive elements, such as conductive fabrics. The process makes strong electrical connections that are mechanically flexible and can simultaneously create multiple electrical connections. The process involves creating an assembly that includes at least a TPE layer, an electrical wire, an insulating layer, and a flexible conductive element, and applying heat and pressure to the assembly. For example, a conductive fabric is disposed on an insulating layer, a wire is positioned onto a surface of the insulating layer, and a TPE layer is disposed over the wire and overlaps the conductive fabric element. When applying the heat and pressure, the wire melts through the insulating layer to make electrical contact with the conductive fabric element, and the TPE layer conforms to an exterior of the wire and bonds to the insulating layer.
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公开(公告)号：US09818682B2
公开(公告)日：2017-11-14
申请号：US14558864
申请日：2014-12-03
Applicant: International Business Machines Corporation
Inventor： Edmund Blackshear , Shidong Li
IPC: B32B3/24 , B32B5/16 , B32B7/02 , B32B15/092 , B32B27/04 , B32B27/38 , B32B37/02 , H01L23/48 , H01L23/498 , B32B3/26 , B32B38/00 , B32B37/18 , H05K1/02 , H05K1/03 , H05K3/00 , H05K13/00 , H01L21/48 , B32B15/20 , B32B27/20 , B32B3/08 , B32B3/10
CPC classification number: H01L23/49833 , B32B3/08 , B32B3/10 , B32B3/266 , B32B5/16 , B32B7/02 , B32B15/092 , B32B15/20 , B32B27/04 , B32B27/20 , B32B27/38 , B32B37/02 , B32B37/182 , B32B38/0004 , B32B2250/05 , B32B2250/40 , B32B2260/046 , B32B2262/101 , B32B2264/10 , B32B2264/101 , B32B2307/202 , B32B2307/204 , B32B2307/734 , B32B2363/00 , B32B2457/00 , B32B2457/14 , H01L21/4803 , H01L23/49822 , H01L23/49827 , H01L23/49838 , H01L23/49894 , H01L2924/0002 , H01L2924/3511 , H05K1/0271 , H05K2201/0137 , H05K2201/0191 , H05K2201/0206 , H05K2201/0209 , H05K2201/09136 , H05K2201/09209 , H05K2201/0929 , H05K2203/06 , H05K2203/061 , Y10T29/49126 , Y10T29/4913 , Y10T428/24298 , Y10T428/24314 , Y10T428/24322 , Y10T428/24331 , Y10T428/25 , H01L2924/00
Abstract: A laminate substrate for receiving a semiconductor chip. Included are laminate layers stacked to form the laminate substrate, each laminate layer includes a core that includes particle-filled epoxy and a metallic layer on the core. At least one laminate layer has a radial cut through the metallic layer, the radial cut extending from a periphery of the at least one laminate layer towards a center of the at least one laminate layer. The radial cut cuts only through the metallic layer and does not cut through the core.
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公开(公告)号：US09485861B2
公开(公告)日：2016-11-01
申请号：US14472221
申请日：2014-08-28
Applicant: ASAHI KASEI E-MATERIALS CORPORATION
Inventor： Masaaki Endo , Takamitsu Utsumi , Shoji Otani
CPC classification number: H05K1/0366 , B32B7/06 , B32B15/08 , B32B15/20 , B32B27/20 , B32B27/285 , B32B27/32 , B32B2264/0257 , B32B2307/306 , B32B2307/538 , B32B2457/08 , C08J5/24 , C08J2371/12 , H05K1/0373 , H05K2201/0137 , H05K2201/0212 , Y10T428/24355
Abstract: Provided is a prepreg suffering little resin particle fall-off and little resin peeling during prepreg production and during handling in order to have excellent dielectric properties for PPE and favorable adhesiveness. A PPE-containing prepreg constituted of a base material and a curable resin composition including PPE particles, wherein the prepreg is characterized in that (1) PPE extracted from the prepreg using a mixed solvent of toluene and methanol in a mass ratio of 95:5 includes PPE particles (A) insoluble in the mixed solvent, (2) the amount of PPE contained in the PPE particles (A) is 70 mass % or higher, and (3) the number-average molecular weight of the PPE contained in the PPE particles (A) is 8,000-40,000.
Abstract translation: 本发明提供一种在预浸料坯生产和处理过程中几乎没有树脂颗粒脱落和少量树脂剥离的预浸料，以具有优异的PPE介电性能和良好的粘着性。 一种由基材和包含PPE颗粒的可固化树脂组合物构成的含PPE的预浸料，其中所述预浸料的特征在于：（1）使用甲苯和甲醇的混合溶剂以95:5的质量比从预浸料中提取的PPE 包括不溶于混合溶剂的PPE颗粒（A），（2）PPE颗粒（A）中所含的PPE的量为70质量％以上，（3）包含在PPE颗粒（A）中的PPE的数均分子量 PPE颗粒（A）为8,000-40,000。
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公开(公告)号：US20160300644A1
公开(公告)日：2016-10-13
申请号：US14885759
申请日：2015-10-16
Applicant: International Business Machines Corporation
Inventor： Dylan J. Boday , Jeannette M. Garcia , James L. Hedrick , Rudy J. Wojtecki
IPC: H01B13/00
CPC classification number: C08G73/0644 , C08G12/06 , C08G73/0638 , C08J5/24 , C08J2379/04 , D06M15/37 , H01B1/128 , H01B13/0026 , H01L23/5226 , H05K1/0346 , H05K2201/0137
Abstract: Low dielectric constant (low-k) polyhemiaminal (PHA) and polyhexahydrotriazine (PHT) materials with cyclic aliphatic ring structures are described. The materials are formed by a method that includes heating a mixture comprising amines and paraformaldehyde. The reaction mixtures may be used to form low-k PHT prepregs, composites and dielectrics used in integrated circuits.
Abstract translation: 描述了具有环状脂肪族环结构的低介电常数（低k）聚合胺（PHA）和聚六氢三嗪（PHT）材料。 所述材料通过包括加热包含胺和多聚甲醛的混合物的方法形成。 反应混合物可用于形成集成电路中使用的低k PHT预浸料，复合材料和电介质。
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公开(公告)号：US20150057413A1
公开(公告)日：2015-02-26
申请号：US14472221
申请日：2014-08-28
Applicant: ASAHI KASEI E-MATERIALS CORPORATION
Inventor： Masaaki ENDO , Takamitsu UTSUMI , Shoji OTANI
IPC: H05K1/03
CPC classification number: H05K1/0366 , B32B7/06 , B32B15/08 , B32B15/20 , B32B27/20 , B32B27/285 , B32B27/32 , B32B2264/0257 , B32B2307/306 , B32B2307/538 , B32B2457/08 , C08J5/24 , C08J2371/12 , H05K1/0373 , H05K2201/0137 , H05K2201/0212 , Y10T428/24355
Abstract: Provided is a prepreg suffering little resin particle fall-off and little resin peeling during prepreg production and during handling in order to have excellent dielectric properties for PPE and favorable adhesiveness. A PPE-containing prepreg constituted of a base material and a curable resin composition including PPE particles, wherein the prepreg is characterized in that (1) PPE extracted from the prepreg using a mixed solvent of toluene and methanol in a mass ratio of 95:5 includes PPE particles (A) insoluble in the mixed solvent, (2) the amount of PPE contained in the PPE particles (A) is 70 mass % or higher, and (3) the number-average molecular weight of the PPE contained in the PPE particles (A) is 8,000-40,000.
Abstract translation: 本发明提供一种在预浸料坯生产和处理过程中几乎没有树脂颗粒脱落和少量树脂剥离的预浸料，以具有优异的PPE介电性能和良好的粘着性。 一种由基材和包含PPE颗粒的可固化树脂组合物构成的含PPE的预浸料，其中所述预浸料的特征在于：（1）使用甲苯和甲醇的混合溶剂以95:5的质量比从预浸料中提取的PPE 包括不溶于混合溶剂的PPE颗粒（A），（2）PPE颗粒（A）中所含的PPE的量为70质量％以上，（3）包含在PPE颗粒（A）中的PPE的数均分子量 PPE颗粒（A）为8,000-40,000。
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Patent Agency Ranking
16.发明申请公开(公告)号：US20150056472A1
公开(公告)日：2015-02-26
申请号：US14465818
申请日：2014-08-21
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Chung Hee LEE , Jae Choon Cho , Hee Sun Chun , Yong Yoon Jang , Dong Hoon Kim , Choon Keun Lee
CPC classification number: H05K1/0366 , H05K1/0298 , H05K1/036 , H05K1/115 , H05K2201/0137 , H05K2201/0145 , H05K2201/0195
Abstract: Disclosed herein are a laminate for a printed circuit board, a printed circuit board using the same, and a method of manufacturing the same.The laminate for a printed circuit board includes: a first insulating film; and a second insulating film formed on the first insulating film, wherein a content of a reaction accelerator in the first insulating film is different from that of the second insulating film.
Abstract translation: 本文公开了一种用于印刷电路板的层压板，使用其的印刷电路板及其制造方法。 用于印刷电路板的层压板包括：第一绝缘膜; 以及形成在所述第一绝缘膜上的第二绝缘膜，其中所述第一绝缘膜中的反应促进剂的含量与所述第二绝缘膜的含量不同。
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公开(公告)号：US20150000960A1
公开(公告)日：2015-01-01
申请号：US14486815
申请日：2014-09-15
Applicant: Sinovia Technologies
Inventor： Whitney GAYNOR , George BURKHARD
CPC classification number: G06F3/041 , B05D3/007 , B82Y10/00 , B82Y20/00 , B82Y40/00 , G03F1/24 , G03F7/0002 , G03F7/0047 , G03F7/038 , G03F7/0388 , G03F7/161 , G06F3/044 , G06F2203/04103 , H01B1/22 , H01B5/14 , H01B13/0013 , H01L51/444 , H01L51/5203 , H05K1/0271 , H05K1/0274 , H05K1/036 , H05K1/09 , H05K3/103 , H05K2201/0108 , H05K2201/0137 , H05K2203/10 , Y10T428/24355 , Y10T442/188 , Y10T442/191
Abstract: A composite conductive film is provided that includes a layer of cross-linked polymer having a surface and an inorganic mesh comprising a plurality of inorganic nanowires. The plurality of inorganic nanowires is embedded throughout at least a region of the layer of cross-linked polymer. The region is continuous from the surface of the layer of cross-linked polymer. The layer of cross-linked polymer and the inorganic mesh are arranged to form the composite conductive film. The composite conductive film has a pencil test hardness in a range of 2H to 9H.
Abstract translation: 提供一种复合导电膜，其包括具有表面的交联聚合物层和包含多个无机纳米线的无机网。 多个无机纳米线被嵌入到交联聚合物层的至少一个区域内。 该区域从交联聚合物层的表面连续。 布置交联聚合物层和无机网以形成复合导电膜。 复合导电膜的铅笔测试硬度在2H〜9H的范围内。
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公开(公告)号：US11751330B2
公开(公告)日：2023-09-05
申请号：US17874369
申请日：2022-07-27
Applicant: E-Circuit Motors, Inc.
Inventor： George Harder Milheim , Steven Robert Shaw , Ryan Terrence Duffy , Edward Charles Carignan
CPC classification number: H05K1/0373 , H05K1/165 , H05K3/10 , H05K2201/0137 , H05K2201/086
Abstract: A dielectric substrate may support conductive traces that form windings for a least one pole of a planar armature of an axial flux machine. At least a portion of the dielectric substrate, which is adapted to be positioned within an annular active area of the axial flux machine, may include a soft magnetic material. Such a planar armature may be produced, for example, by forming the conductive traces on the dielectric substrate, and filling interstitial gaps between the conductive traces with at least one epoxy material in which the soft magnetic material is embedded.
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公开(公告)号：US20230240009A1
公开(公告)日：2023-07-27
申请号：US18127295
申请日：2023-03-28
Applicant: TOPPAN INC.
Inventor： Takeshi TAKADA , Yuki UMEMURA
CPC classification number: H05K1/09 , H05K3/42 , H05K2201/0137 , H05K2203/072 , H05K3/46
Abstract: A wiring board includes a first wiring layer disposed on the first adhesion layer; and a second wiring layer disposed on the second adhesion layer, wherein a proportion of copper remaining in the first wiring layer is represented by C=B/A (%), where A is a total area of the first wiring layer, B is an area of copper in the first wiring layer, and C is a remaining copper ratio C defined as the proportion of copper remaining in the first wiring layer, and wherein when the remaining copper ratio C is set to 70 to 100%, the first adhesion layer is comprised of at least one material having a first predetermined Young's modulus, and the first wiring layer is comprised of at least one material having a second predetermined Young's modulus, the first predetermined Young's modulus being 0.1 to 0.85 times the second predetermined Young's modulus.
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公开(公告)号：US20170332488A1
公开(公告)日：2017-11-16
申请号：US15666540
申请日：2017-08-01
Applicant: NHK SPRING CO., LTD.
Inventor： Katsumi MIZUNO , Daiki IKEDA
CPC classification number: H05K1/056 , H05K1/0256 , H05K1/0263 , H05K1/0373 , H05K3/103 , H05K3/20 , H05K3/202 , H05K3/44 , H05K2201/0137 , H05K2201/09672 , H05K2201/09727 , H05K2201/1028 , H05K2203/0278 , H05K2203/1105
Abstract: According to one embodiment, a metal base circuit board includes a metal base substrate, a first circuit pattern, and a first insulating layer between the metal base substrate and the first circuit pattern. The first insulating layer covers a lower surface of the first circuit pattern and at least part of a side surface of the first circuit pattern, the lower surface facing the metal base substrate, the at least part of the side surface being adjacent to the lower surface.
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