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公开(公告)号：US20230319975A1
公开(公告)日：2023-10-05
申请号：US17928356
申请日：2021-05-31
Applicant: MITSUBISHI MATERIALS CORPORATION
Inventor： Yoshiaki Sakaniwa , Toyo Ohashi
CPC classification number: H05K1/0209 , H05K1/0313 , H05K2201/0154 , H05K2201/10227 , H05K3/0061
Abstract: There is provided an insulating resin circuit substrate including an insulating resin layer and a circuit layer consisting of a plurality of metal pieces disposed to be spaced apart in a circuit pattern shape on one surface of the insulating resin layer, in which in a case where a surface of the insulating resin layer in a gap between the metal pieces is analyzed by SEM-EDX, the area rate of a metal element constituting the metal pieces is less than 2.5%.
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公开(公告)号：US20180168038A1
公开(公告)日：2018-06-14
申请号：US15892740
申请日：2018-02-09
Applicant: International Business Machines Corporation
Inventor： Ai Kiar Ang , Michael Lauri
IPC: H05K1/11 , H05K3/34 , H05K1/18 , H01L23/495 , H05K1/03 , H01L25/00 , H01L25/10 , H05K3/32 , H05K1/14 , H01L21/48
CPC classification number: H05K1/11 , H01L21/4839 , H01L23/49537 , H01L23/49555 , H01L23/49565 , H01L23/49575 , H01L25/105 , H01L25/50 , H01L2225/1029 , H01L2924/181 , H05K1/0313 , H05K1/144 , H05K1/18 , H05K1/181 , H05K3/328 , H05K3/341 , H05K3/3421 , H05K3/3426 , H05K2201/10015 , H05K2201/10227 , H05K2201/10515 , H05K2201/1053 , H05K2201/10962 , Y02P70/613 , H01L2924/00012
Abstract: A method includes forming a multi-stacked electronic device having two or more electronic components, each of the electronic components includes a leadframe, the leadframes of each electronic component are physically joined together using a non-solder metal joining process to form a joint, and the joint is located outside a solder connection region.
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公开(公告)号：US20180153035A1
公开(公告)日：2018-05-31
申请号：US15880155
申请日：2018-01-25
Applicant: International Business Machines Corporation
Inventor： Ai Kiar Ang , Michael Lauri
IPC: H05K1/11 , H05K3/32 , H05K1/18 , H01L25/10 , H05K3/34 , H01L23/495 , H05K1/03 , H01L21/48 , H01L25/00 , H05K1/14
CPC classification number: H05K1/11 , H01L21/4839 , H01L23/49537 , H01L23/49555 , H01L23/49565 , H01L23/49575 , H01L25/105 , H01L25/50 , H01L2225/1029 , H01L2924/181 , H05K1/0313 , H05K1/144 , H05K1/18 , H05K1/181 , H05K3/328 , H05K3/341 , H05K3/3421 , H05K3/3426 , H05K2201/10015 , H05K2201/10227 , H05K2201/10515 , H05K2201/1053 , H05K2201/10962 , Y02P70/613 , H01L2924/00012
Abstract: A method includes forming a multi-stacked electronic device having two or more electronic components, each of the electronic components includes a leadframe, the leadframes of each electronic component are physically joined together using a non-solder metal joining process to form a joint, and the joint is located outside a solder connection region.
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公开(公告)号：US20180049316A1
公开(公告)日：2018-02-15
申请号：US15557142
申请日：2016-03-15
Applicant: AutoNetworks Technologies, Ltd. , Sumitomo Wiring Systems, Ltd. , SUMITOMO ELECTRIC INDUSTRIES, LTD.
Inventor： Yu MURONOI , Tou CHIN
CPC classification number: H05K1/0271 , H05K1/0204 , H05K1/0265 , H05K1/181 , H05K3/341 , H05K2201/068 , H05K2201/10227 , H05K2201/10272 , H05K2201/10416 , Y02P70/611
Abstract: A circuit structure that has a high rigidity, has high cooling performance for an electronic component, and can reduce electrical resistance between the electronic component and a bus bar. The circuit structure has a circuit board, bus bars, a binding material, metal chips, and electronic components. The circuit board has opening portions that penetrate in the thickness direction. The bus bars are overlaid on the circuit board. The binding material is interposed between the circuit board and the bus bars and binds them. The metal chips are arranged inside the opening portions and also placed on the bus bars. The metal chips each have a top face, which is located in approximately the same plane as an opening end face of an opening portion, and a bottom face, approximately the entire surface of which is joined to a bus bar. The electronic components are soldered to the circuit board and the top faces of the metal chips.
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公开(公告)号：US20170339786A1
公开(公告)日：2017-11-23
申请号：US15671549
申请日：2017-08-08
Applicant: NITTO DENKO CORPORATION
Inventor： Hiroyuki TANABE , Naohiro TERADA , Yuu SUGIMOTO , Daisuke YAMAUCHI
CPC classification number: H05K1/05 , G11B5/4826 , G11B5/484 , G11B5/4853 , H05K1/0278 , H05K1/0393 , H05K1/11 , H05K1/18 , H05K1/181 , H05K3/4007 , H05K3/44 , H05K2201/10151 , H05K2201/10227
Abstract: A suspension board with circuit includes a metal supporting board, a base insulating layer disposed at one side in a thickness direction of the metal supporting board, and a conductor layer disposed at one side in the thickness direction of the base insulating layer and including a connecting terminal electrically connected to a slider. The base insulating layer has a terminal region, when projected in the thickness direction, overlapped with at least the connecting terminal and a circumferential region not overlapped with the terminal region and around the terminal region, and the thickness of the terminal region is thicker than that of the circumferential region.
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Patent Agency Ranking
6.发明申请公开(公告)号：US20170339779A1
公开(公告)日：2017-11-23
申请号：US15158399
申请日：2016-05-18
Applicant: Raytheon Company
Inventor： Brian W. Johansen , Justin Kasemodel , James M. Elliott
CPC classification number: H05K1/0204 , H01L23/4275 , H01L23/4338 , H05K1/181 , H05K3/34 , H05K2201/10227 , H05K2201/10507
Abstract: Heat transfer devices and systems for thermally coupling electrical components to a heatsink can comprise one or more all-metal heat transfer device(s) thermally coupling at least one electrical component to a heatsink. A heat transfer device can comprise a metal cup attached to a metal heatsink, and a metal piston and a compliant device disposed in the cup. The piston is forcible to a secured first position, upon reflowing solder, while compressing the compliant device. Upon reflowing solder again, the compliant device causes the piston to bias and attach to the electrical component to provide an all-metal thermal path and absorb assembly tolerances to avoid using thermal gap fillers. A method is provided for thermally coupling a heatsink to a plurality of electrical components via a plurality of all-metal, expandable heat transfer devices.
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公开(公告)号：US20170273175A1
公开(公告)日：2017-09-21
申请号：US15447374
申请日：2017-03-02
Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.
Inventor： Tsukasa OBINATA , Yusuke KARASAWA , Hideyuki TAKO , Goshi IMAI , Suguru YAMATO
CPC classification number: H05K1/0266 , G06K19/06028 , H05K1/0269 , H05K1/113 , H05K3/429 , H05K3/4602 , H05K2201/0959 , H05K2201/10227
Abstract: An interconnection substrate having a barcode includes a core layer, an interconnection layer over a first surface of the core layer, an insulating layer to cover the interconnection layer, and one or more additional interconnection layers over the insulating layer, wherein the barcode includes cells arranged at spaced intervals, and a cell pattern is made by forming penetrating holes through the core layer in some of the cells but not in remaining ones of the cells, wherein the penetrating holes are filled with resin, and an end face of the resin is exposed on the same side as the first surface such that the interconnection layer is situated in a surrounding area of the end face but not over the end face, and wherein a number of interconnection layers over the end face is smaller than a number of interconnection layers in the surrounding area of the end face.
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公开(公告)号：US20240057251A1
公开(公告)日：2024-02-15
申请号：US18113834
申请日：2023-02-24
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Tae Hong Min , Eun Su Kwon
IPC: H05K1/02
CPC classification number: H05K1/0296 , H05K2201/10227 , H05K2201/10984
Abstract: A printed circuit board includes a first insulating layer, a first pattern buried in a surface of the first insulating layer, the first pattern having a surface exposed from the surface of the first insulating layer, and a metal post disposed on the exposed surface of the first pattern. The metal post includes a first metal layer and a second metal layer. The first metal layer and the second metal layer include different metals.
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公开(公告)号：US20180279515A1
公开(公告)日：2018-09-27
申请号：US15469135
申请日：2017-03-24
Applicant: Microsoft Technology Licensing, LLC
Inventor： Mark Mitchell Gloster , Whitney Giaimo , John Godfrey
CPC classification number: H05K9/0032 , H05K1/181 , H05K3/303 , H05K9/0026 , H05K2201/10227
Abstract: The edge shields disclosed herein utilize a plated edge surface of a PCB to form one or more sides of an electronic shield to reduce the amount of top surface area of the PCB occupied by the electronic shield. More specifically, an edge shield lid is mechanically attached to the plated edge surface to remove a need for solder overprint at the edge of the PCB. The edge shield lid is soldered, welded, adhered, or mechanically attached to edge walls where there is no available edge surface for attachment.
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公开(公告)号：US10064315B2
公开(公告)日：2018-08-28
申请号：US15297458
申请日：2016-10-19
Inventor： Chien-Hsiung Tsao , Yan-Ning Chen
CPC classification number: H05K7/209 , H05K1/0203 , H05K1/0209 , H05K1/0263 , H05K1/181 , H05K3/301 , H05K2201/09072 , H05K2201/10015 , H05K2201/1003 , H05K2201/10166 , H05K2201/10227 , H05K2201/10272 , H05K2201/10492 , H05K2201/10522 , H05K2201/10553 , H05K2201/10568 , H05K2201/10606
Abstract: The disclosure provides a power supply including a high heat-dissipation circuit board assembly system in which a rack is installed on a circuit board so as to be connected to a transformer. Heat produced when electronic components installed on the circuit board are actuated may be conducted and dissipated thereby. The efficiency and the heat conductivity effect of the power supply may be further enhanced by distributing the amount and the flowing direction of the current from the transformer.
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