公开(公告)号：US08932705B2

公开(公告)日：2015-01-13

申请号：US12645967

申请日：2009-12-23

Applicant: Chung-Kun Cho ,  Myung-Sup Jung ,  Kwang-Hee Kim ,  Jae-Jun Lee ,  Kalinina Fedosya ,  Mahn Jong Kim ,  Chung Won Park

Inventor： Chung-Kun Cho ,  Myung-Sup Jung ,  Kwang-Hee Kim ,  Jae-Jun Lee ,  Kalinina Fedosya ,  Mahn Jong Kim ,  Chung Won Park

IPC: B32B3/26 ,  B32B15/08 ,  C08K7/22 ,  C08K7/24 ,  C08K7/26 ,  H05K1/03 ,  C08K7/28 ,  C08K5/1515 ,  C08K5/3415

CPC classification number: H05K1/0373 ,  C08K5/1515 ,  C08K5/3415 ,  C08K7/28 ,  H05K2201/0209 ,  H05K2201/0254 ,  Y10T428/249953 ,  Y10T428/249971 ,  Y10T428/31678 ,  Y10T428/31681

Abstract: Disclosed is a thermosetting resin composition including a thermosetting aromatic oligomer represented by the following Chemical Formula 1, a hollow particle, and solvent, and a board comprising the same. In the above Chemical Formula 1, wherein B, L1, L2, Z1 and Z2 are the same as in defined in the specification.

Abstract translation: 公开了一种热固性树脂组合物，其包含由以下化学式1表示的热固性芳族低聚物，中空颗粒和溶剂，以及包含该热固性树脂组合物的板。 在上述化学式1中，其中B，L1，L2，Z1和Z2与说明书中定义相同。

公开(公告)号：US20140147682A1

公开(公告)日：2014-05-29

申请号：US14129183

申请日：2013-03-15

Applicant: MITSUBISHI ENGINEERING PLASTICS CORPORATION

Inventor： Takahiro Takano ,  Takahiko Sumino ,  Kentarou Ishihara

IPC: C08K3/00 ,  H05K1/03 ,  F21V7/22

CPC classification number: C08K3/00 ,  C08K3/22 ,  C08K3/2279 ,  C08K3/40 ,  C08K7/14 ,  C08K9/02 ,  C08K2003/2231 ,  C08K2003/2241 ,  C08L23/06 ,  C08L77/06 ,  C08L91/06 ,  C08L101/12 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1641 ,  C23C18/204 ,  C23C18/32 ,  C23C18/38 ,  C23C18/42 ,  F21V7/22 ,  H05K1/0373 ,  H05K3/105 ,  H05K2201/0129 ,  H05K2201/0209 ,  H05K2201/0221 ,  H05K2201/0245 ,  H05K2201/0254 ,  H05K2201/0293 ,  H05K2201/0347 ,  H05K2201/09118 ,  H05K2201/10106 ,  H05K2201/2054 ,  H05K2203/0723 ,  H05K2203/107

Abstract: Provided is a thermoplastic resin composition which is excellent in platability (appearance of plating), and keeps high reflectance even after thermal aging. A thermoplastic resin composition comprising: per (A) 100 parts by weight of a crystalline thermoplastic resin having a melting point, measured by differential scanning calorimetry (DSC) at a heating rate of 10° C./min, of 250° C. or above; (B) 10 to 80 parts by weight of a glass filler; (C) 1 to 30 parts by weight of a laser direct structuring additive having a reflectance at 450 nm of 25% or above; and (D) 20 to 150 parts by weight of titanium oxide.

Abstract translation: 提供一种热塑性树脂组合物，其电镀性（电镀外观）优异，即使在热老化后也保持高反射率。 一种热塑性树脂组合物，其包含：（A）100重量份具有熔点的结晶热塑性树脂，其通过差示扫描量热法（DSC）以10℃/ min的加热速率测定为250℃，或 以上; （B）10〜80重量份玻璃填料; （C）1〜30重量份在450nm以上的反射率为25％以上的激光直接结构化添加剂; 和（D）20〜150重量份的氧化钛。

公开(公告)号：US07964685B2

公开(公告)日：2011-06-21

申请号：US12521502

申请日：2007-12-27

Applicant: Akihiko Yoshiwara ,  Junji Kodemura

Inventor： Akihiko Yoshiwara ,  Junji Kodemura

IPC: C08G61/08 ,  C08F2/02 ,  C08F4/70 ,  C08F36/00 ,  B32B15/08

CPC classification number: C08L65/00 ,  C08G61/08 ,  C08G2261/418 ,  C08J5/24 ,  C08J2365/00 ,  C08K3/36 ,  C08K7/26 ,  H01B3/448 ,  H05K1/0373 ,  H05K2201/0158 ,  H05K2201/0254

Abstract: A polymerizable composition is obtained by mixing a metathesis polymerization catalyst including benzylidene(1,3-dimethyl-4-imidazolidin-2-ylidene)(tricyclohexylphosphine)ruthenium dichloride, a cycloolefin monomer such as 2-norbornene or tetracyclo[6.2.1.13,6.02,7]dodec-4-ene, a chain transfer agent such as allyl methacrylate, and hollow particles such as Shirasu balloons. A crosslinkable resin composite is obtained by coating or impregnating the polymerizable composition onto or into a support medium, and carrying out bulk polymerization of the polymerizable composition. A crosslinked resin composite is obtained by crosslinking the crosslinkable resin composite.

Abstract translation: 通过将包含亚苄基（1,3-二甲基-4-咪唑烷-2-亚基）（三环己基膦）二氯化钌，易环烯烃单体如2-降冰片烯或四环[6.2.1.13,6.02 ，7]十二碳-4-烯，链转移剂如甲基丙烯酸烯丙酯和中空颗粒如白砂糖气球。 通过将可聚合组合物涂布或浸渍到载体介质上或浸渍到载体介质中并进行可聚合组合物的本体聚合来获得可交联树脂复合材料。 通过使交联性树脂复合体交联而得到交联树脂复合体。

公开(公告)号：US07816428B2

公开(公告)日：2010-10-19

申请号：US12278156

申请日：2007-04-24

Applicant: Shuji Sasaki ,  Yasuhisa Nishi ,  Shinji Yamano ,  Mitsuyoshi Iwasa

Inventor： Shuji Sasaki ,  Yasuhisa Nishi ,  Shinji Yamano ,  Mitsuyoshi Iwasa

IPC: C08J9/32

CPC classification number: C01B33/18 ,  C01B13/322 ,  C01P2004/32 ,  C01P2004/34 ,  C01P2006/12 ,  C03C11/002 ,  H05K1/0373 ,  H05K2201/0133 ,  H05K2201/0209 ,  H05K2201/0254 ,  Y10T428/2982

Abstract: The present invention herein provides fine inorganic hollow powder having a high hollowness rate, which can be incorporated into, for instance, a low dielectric rubber or resin composition. The inorganic hollow powder has an average hollowness rate of higher than 70% by volume and an average particle size ranging from 3 to 20 μm and the powder preferably has an average hollowness rate ranging from 75 to 85% by volume, an average particle size ranging from 5 to 15 μm, a maximum particle size of not more than 25 μm, a specific surface area of not more than 10 m2/g, an average sphericity degree of not less than 0.90 and a purity of not less than 99% by mass. The inorganic hollow powder can be prepared by a method comprising the steps of forming a flame using a burner provided with at least a triplet-tubular portion comprising, in order from the outermost side, a combustion-improving gas-supply pipe, a combustible gas-supply pipe and an inorganic raw powder-supply pipe assembled together; injecting, into the flame at a high discharge speed, inorganic raw powder having a specific particle size through the inorganic raw powder-supply pipe, while the powder is entrained with a carrier gas having a specific relative humidity, to thus subject the powder to a heat-treatment.

Abstract translation: 本发明提供具有高中空率的细小的无机中空粉末，其可以结合到例如低介电橡胶或树脂组合物中。 无机中空粉末的平均中空率高于70体积％，平均粒径为3〜20μm，粉末的平均中空率优选为75〜85体积％，平均粒径为 5〜15μm，最大粒径为25μm以下，比表面积为10m 2 / g以下，平均球形度为0.90以上，纯度为99质量％以上 。 无机中空粉末可以通过以下方法制备：使用设置有至少三重管状部分的燃烧器形成火焰的步骤，其包括从最外侧开始的燃烧改善气体供给管，可燃气体 供应管和无机原料粉供应管组装在一起; 通过无机原料粉供给管以高放电速度向火焰喷射具有特定粒径的无机原料粉末，同时将粉末夹在具有特定相对湿度的载气中，从而将粉末置于 热处理。

公开(公告)号：US06756441B2

公开(公告)日：2004-06-29

申请号：US09951414

申请日：2001-09-14

Applicant: Satoru Amou ,  Shinji Yamada ,  Takao Ishikawa ,  Takao Miwa

Inventor： Satoru Amou ,  Shinji Yamada ,  Takao Ishikawa ,  Takao Miwa

IPC: C08L900

CPC classification number: C08K5/01 ,  C08F212/14 ,  C08F212/32 ,  C08F257/02 ,  H05K1/0373 ,  H05K2201/0209 ,  H05K2201/0254 ,  C08L65/00 ,  C08F236/02

Abstract: According to the present invention, there is provided a low dielectric loss tangent resin composition containing a crosslinking component having a weight average molecular weight of not more than 1,000 and a plurality of styrene groups and represented by the formula [1], wherein R is a hydrocarbon skeleton which may have a substituent, R1 is hydrogen, methyl or ethyl, m is an integer of 1-4 and n is an integer of 2 or more, and further containing at least one member selected from a high polymer having a weight average molecular weight of not less than 5,000 and a filler, which resin composition can give a cured product having a good flexibility, high tensile strength and low dielectric constant and dielectric loss tangent.

Abstract translation: 根据本发明，提供一种低介电损耗角正切树脂组合物，其含有重均分子量不大于1000的交联组分和多个苯乙烯基团并由式[1]表示，其中R为 可以具有取代基的烃骨架，R 1是氢，甲基或乙基，m是1-4的整数，n是2以上的整数，并且还含有至少一种选自具有 重均分子量为5000以上的填料，该树脂组合物可以得到具有良好柔软性，高拉伸强度，低介电常数和介电损耗角正切的固化物。

公开(公告)号：US20020161091A1

公开(公告)日：2002-10-31

申请号：US09951414

申请日：2001-09-14

Inventor： Satoru Amou ,  Shinji Yamada ,  Takao Ishikawa ,  Takao Miwa

IPC: C08K003/18

CPC classification number: C08K5/01 ,  C08F212/14 ,  C08F212/32 ,  C08F257/02 ,  H05K1/0373 ,  H05K2201/0209 ,  H05K2201/0254 ,  C08L65/00 ,  C08F236/02

Abstract: According to the present invention, there is provided a low dielectric loss tangent resin composition containing a crosslinking component having a weight average molecular weight of not more than 1,000 and a plurality of styrene groups and represented by the formula null1null, 1 wherein R is a hydrocarbon skeleton which may have a substituent, R1 is hydrogen, methyl or ethyl, m is an integer of 1-4 and n is an integer of 2 or more, and further containing at least one member selected from a high polymer having a weight average molecular weight of not less than 5,000 and a filler, which resin composition can give a cured product having a good flexibility, high tensile strength and low dielectric constant and dielectric loss tangent.

Abstract translation: 根据本发明，提供一种低介电损耗角正切树脂组合物，其含有重均分子量不大于1000的交联组分和多个苯乙烯基团并由式[1]表示，其中R为 可以具有取代基的碳骨架，R1为氢，甲基或乙基，m为1-4的整数，n为2以上的整数，进一步含有选自重均分子量的高分子中的至少一种 分子量不小于5,000的树脂组合物和填料，该树脂组合物可以得到具有良好柔韧性，高拉伸强度和低介电常数以及介电损耗角正切的固化产物。

公开(公告)号：US5785789A

公开(公告)日：1998-07-28

申请号：US344793

申请日：1994-11-23

Applicant: Gerald Gagnon ,  Richard Alwyn Barnett ,  James Anthony Apruzzi

Inventor： Gerald Gagnon ,  Richard Alwyn Barnett ,  James Anthony Apruzzi

IPC: B32B27/04 ,  B32B27/20 ,  H05K1/03 ,  H05K3/02 ,  B32B31/00

CPC classification number: B32B27/04 ,  B32B27/20 ,  B32B37/26 ,  H05K1/0373 ,  B32B2305/30 ,  H05K1/036 ,  H05K1/0366 ,  H05K2201/0209 ,  H05K2201/0254 ,  H05K2203/0152 ,  H05K3/022

Abstract: Disclosed are multilayer electrical structures comprising a discrete, partially-cured, microsphere-filled resin layer, and a method for fabricating such multilayer electrical structures using a carrier member to support and introduce the microsphere-filled resin layer.

Abstract translation: 公开了包括分立的部分固化的微球填充树脂层的多层电结构，以及使用载体构件来制造这种多层电结构以支撑和引入微球填充树脂层的方法。

公开(公告)号：US20150030824A1

公开(公告)日：2015-01-29

申请号：US14334876

申请日：2014-07-18

Applicant: Rogers Corporation

Inventor： Jessica Crosley

IPC: H05K1/03 ,  H05K3/46 ,  H05K3/00 ,  H05K1/02

CPC classification number: H05K1/0373 ,  C03C11/00 ,  C03C14/00 ,  C03C23/008 ,  C03C2214/12 ,  H05K3/4626 ,  H05K3/4652 ,  H05K2201/0209 ,  H05K2201/0254 ,  Y10T428/24893 ,  Y10T428/249971 ,  Y10T428/249974

Abstract: A circuit subassembly is disclosed comprising a conductive metal layer and a dielectric substrate layer having a dielectric constant of less than about 3.5 and a dissipation factor of less than about 0.006 at 10 GHz, wherein the composition of the dielectric substrate layer comprises about 5 to about 70 volume percent of borosilicate microspheres that have been treated with an alkaline solution.

Abstract translation: 公开了一种电路子组件，其包括导电金属层和介电常数小于约3.5的电介质基底层，在10GHz下的耗散因数小于约0.006，其中电介质基底层的组成包括约5至约 已经用碱性溶液处理的70体积％的硼硅酸盐微球。

公开(公告)号：US20140345923A1

公开(公告)日：2014-11-27

申请号：US13995667

申请日：2011-12-09

Applicant: Dennis J. Miller

Inventor： Dennis J. Miller

IPC: H05K3/00 ,  B01F3/12 ,  H05K3/28

CPC classification number: H05K3/0076 ,  B01F3/12 ,  H05K3/28 ,  H05K3/285 ,  H05K2201/0254

Abstract: A circuit board may include a substrate, an interconnected structure associated with the substrate, and a solder mask associated with the interconnected structure and the substrate. The solder mask may be based on a mixture that includes epoxy and a powder. The powder may be hollow glass micro-balloons.

Abstract translation: 电路板可以包括衬底，与衬底相关联的互连结构，以及与互连结构和衬底相关联的焊接掩模。 焊接掩模可以基于包括环氧树脂和粉末的混合物。 粉末可以是中空玻璃微球。

公开(公告)号：US20090030134A1

公开(公告)日：2009-01-29

申请号：US12278156

申请日：2007-04-24

Applicant: Shuji Sasaki ,  Yasuhisa Nishi ,  Shinji Yamano ,  Mitsuyoshi Iwasa

Inventor： Shuji Sasaki ,  Yasuhisa Nishi ,  Shinji Yamano ,  Mitsuyoshi Iwasa

IPC: C08K3/36 ,  C01B33/12

CPC classification number: C01B33/18 ,  C01B13/322 ,  C01P2004/32 ,  C01P2004/34 ,  C01P2006/12 ,  C03C11/002 ,  H05K1/0373 ,  H05K2201/0133 ,  H05K2201/0209 ,  H05K2201/0254 ,  Y10T428/2982

Abstract: The present invention herein provides fine inorganic hollow powder having a high hollowness rate, which can be incorporated into, for instance, a low dielectric rubber or resin composition. The inorganic hollow powder has an average hollowness rate of higher than 70% by volume and an average particle size ranging from 3 to 20 μm and the powder preferably has an average hollowness rate ranging from 75 to 85% by volume, an average particle size ranging from 5 to 15 μm, a maximum particle size of not more than 25 μm, a specific surface area of not more than 10 m2/g, an average sphericity degree of not less than 0.90 and a purity of not less than 99% by mass. The inorganic hollow powder can be prepared by a method comprising the steps of forming a flame using a burner provided with at least a triplet-tubular portion comprising, in order from the outermost side, a combustion-improving gas-supply pipe, a combustible gas-supply pipe and an inorganic raw powder-supply pipe assembled together; injecting, into the flame at a high discharge speed, inorganic raw powder having a specific particle size through the inorganic raw powder-supply pipe, while the powder is entrained with a carrier gas having a specific relative humidity, to thus subject the powder to a heat-treatment.

Abstract translation: 本发明提供具有高中空率的细小的无机中空粉末，其可以结合到例如低介电橡胶或树脂组合物中。 无机中空粉末的平均中空率高于70体积％，平均粒径为3〜20μm，粉末的平均中空率优选为75〜85体积％，平均粒径为 5〜15μm，最大粒径为25μm以下，比表面积为10m2 / g以下，平均球形度为0.90以上，纯度为99质量％以上 。 无机中空粉末可以通过以下方法制备：使用设置有至少三重管状部分的燃烧器形成火焰的步骤，其包括从最外侧开始的燃烧改善气体供给管，可燃气体 供应管和无机原料粉供应管组装在一起; 通过无机原料粉供给管以高放电速度向火焰喷射具有特定粒径的无机原料粉末，同时将粉末夹在具有特定相对湿度的载气中，从而将粉末置于 热处理。