公开(公告)号：US07667142B2

公开(公告)日：2010-02-23

申请号：US10921616

申请日：2004-08-18

Applicant: Kalu K. Vasoya ,  Bharat M. Mangrolia ,  William E. Davis ,  Richard A. Bohner

Inventor： Kalu K. Vasoya ,  Bharat M. Mangrolia ,  William E. Davis ,  Richard A. Bohner

IPC: H05K1/09

CPC classification number: B32B27/12 ,  B32B5/26 ,  B32B27/04 ,  B32B2260/021 ,  B32B2262/101 ,  B32B2262/106 ,  B32B2307/202 ,  B32B2307/302 ,  B32B2457/00 ,  C08K3/38 ,  C08K9/08 ,  C08K2003/385 ,  H05K1/0206 ,  H05K1/0207 ,  H05K1/0366 ,  H05K1/0373 ,  H05K3/429 ,  H05K3/445 ,  H05K3/4623 ,  H05K3/4641 ,  H05K2201/0209 ,  H05K2201/0278 ,  H05K2201/0287 ,  H05K2201/0323 ,  Y10S428/901 ,  Y10T29/49124 ,  Y10T29/49165 ,  Y10T428/24917 ,  Y10T428/24994 ,  Y10T428/249942 ,  Y10T428/249945 ,  Y10T428/249946 ,  Y10T428/249947 ,  Y10T428/249951 ,  Y10T428/249952 ,  Y10T428/25 ,  Y10T428/292 ,  Y10T428/31504 ,  Y10T442/117 ,  Y10T442/2418

Abstract: Prepregs, laminates, printed wiring board structures and processes for constructing materials and printed wiring boards that enable the construction of printed wiring boards with improved thermal properties. In one embodiment, the prepregs include substrates impregnated with electrically and thermally conductive resins. In other embodiments, the prepregs have substrate materials that include carbon. In other embodiments, the prepregs include substrates impregnated with thermally conductive resins. In other embodiments, the printed wiring board structures include electrically and thermally conductive laminates that can act as ground and/or power planes.

Abstract translation: 预浸料，层压板，印刷线路板结构以及用于构造材料和印刷线路板的工艺，其能够构造具有改善的热性能的印刷线路板。 在一个实施方案中，预浸料包括浸渍有导电和导热树脂的基材。 在其它实施例中，预浸料坯具有包括碳的基底材料。 在其它实施方案中，预浸料包括浸渍有导热树脂的基材。 在其他实施例中，印刷线路板结构包括可以用作接地和/或电力平面的导电和导热的层压板。

公开(公告)号：US07635815B2

公开(公告)日：2009-12-22

申请号：US10921649

申请日：2004-08-18

Applicant: Kalu K. Vasoya ,  Bharat M. Mangrolia ,  William E. Davis ,  Richard A. Bohner

Inventor： Kalu K. Vasoya ,  Bharat M. Mangrolia ,  William E. Davis ,  Richard A. Bohner

IPC: H05K1/03

CPC classification number: B32B27/12 ,  B32B5/26 ,  B32B27/04 ,  B32B2260/021 ,  B32B2262/101 ,  B32B2262/106 ,  B32B2307/202 ,  B32B2307/302 ,  B32B2457/00 ,  C08K3/38 ,  C08K9/08 ,  C08K2003/385 ,  H05K1/0206 ,  H05K1/0207 ,  H05K1/0366 ,  H05K1/0373 ,  H05K3/429 ,  H05K3/445 ,  H05K3/4623 ,  H05K3/4641 ,  H05K2201/0209 ,  H05K2201/0278 ,  H05K2201/0287 ,  H05K2201/0323 ,  Y10S428/901 ,  Y10T29/49124 ,  Y10T29/49165 ,  Y10T428/24917 ,  Y10T428/24994 ,  Y10T428/249942 ,  Y10T428/249945 ,  Y10T428/249946 ,  Y10T428/249947 ,  Y10T428/249951 ,  Y10T428/249952 ,  Y10T428/25 ,  Y10T428/292 ,  Y10T428/31504 ,  Y10T442/117 ,  Y10T442/2418

Abstract: Prepregs, laminates, printed wiring board structures and processes for constructing materials and printed wiring boards that enable the construction of printed wiring boards with improved thermal properties. In one embodiment, the prepregs include substrates impregnated with electrically and thermally conductive resins. In other embodiments, the prepregs have substrate materials that include carbon. In other embodiments, the prepregs include substrates impregnated with thermally conductive resins. In other embodiments, the printed wiring board structures include electrically and thermally conductive laminates that can act as ground and/or power planes.

公开(公告)号：US20070116938A1

公开(公告)日：2007-05-24

申请号：US10582558

申请日：2005-02-18

Applicant: Masayuki Tobita ,  Toru Kimura ,  Hisashi Aoki ,  Naoyuki Shimoyama ,  Tsukasa Ishigaki ,  Mitsukazu Ochi ,  Miyuki Harada

Inventor： Masayuki Tobita ,  Toru Kimura ,  Hisashi Aoki ,  Naoyuki Shimoyama ,  Tsukasa Ishigaki ,  Mitsukazu Ochi ,  Miyuki Harada

IPC: D04H13/00

CPC classification number: C08G59/28 ,  B32B15/08 ,  B32B15/092 ,  B32B15/20 ,  B32B27/04 ,  B32B27/18 ,  B32B27/38 ,  B32B2250/03 ,  B32B2250/40 ,  B32B2274/00 ,  B32B2307/202 ,  B32B2307/206 ,  B32B2457/08 ,  C08G59/5033 ,  C08J5/24 ,  C08J2363/00 ,  C08K7/02 ,  H05K1/0366 ,  H05K2201/0129 ,  H05K2201/0141 ,  H05K2201/0287 ,  H05K2201/029 ,  H05K2201/068 ,  Y10T428/249924 ,  C08L63/00

Abstract: A thermoplastic polymer composite formed article or a thermoplastic polymer composite formed article formed from a thermoplastic polymer or a thermoplastic polymer and a fiber, wherein the fiber is arranged along a first plane and the molecular chains of the thermoplastic polymer or thermoplastic polymer is oriented in the direction intersecting with the first plane, and the molecular chains of the thermoplastic polymer or thermoplastic polymer has a degree (a) of orientation in a range of 0.5 or more and less than 1.0, and wherein the thermal expansion coefficients of said formed article in the direction along the first plane and in the direction intersecting with the first plane are both 5×10−6 to 50×10−6 (/K), and the difference between the thermal expansion coefficient in the direction along the first plane and the thermal expansion coefficient in the direction intersecting with the first plane is 30×10−6 (/K) or less.

Abstract translation: 由热塑性聚合物或热塑性聚合物和纤维形成的热塑性聚合物复合成型制品或热塑性聚合物复合成型制品，其中纤维沿着第一平面布置，热塑性聚合物或热塑性聚合物的分子链定向于 方向与第一平面相交，并且热塑性聚合物或热塑性聚合物的分子链具有在0.5以上且小于1.0的范围内的取向度（a），并且其中所述成型制品的热膨胀系数在 沿着第一平面和与第一平面相交的方向的方向均为5×10 -6〜50×10 -6（/ K），热膨胀系数 沿着第一平面的方向和与第一平面相交的方向的热膨胀系数为30×10 -6（/ K）以下。

公开(公告)号：US06869664B2

公开(公告)日：2005-03-22

申请号：US10020506

申请日：2001-12-11

Applicant: Kalu K. Vasoya ,  Bharat M. Mangrolia ,  William E. Davis ,  Richard A. Bohner

Inventor： Kalu K. Vasoya ,  Bharat M. Mangrolia ,  William E. Davis ,  Richard A. Bohner

IPC: C08J5/24 ,  B32B5/26 ,  B32B27/04 ,  C08K3/38 ,  C08K9/08 ,  H05K1/02 ,  H05K1/03 ,  H05K3/42 ,  H05K3/44 ,  H05K3/46 ,  B32B15/00

CPC classification number: B32B27/12 ,  B32B5/26 ,  B32B27/04 ,  B32B2260/021 ,  B32B2262/101 ,  B32B2262/106 ,  B32B2307/202 ,  B32B2307/302 ,  B32B2457/00 ,  C08K3/38 ,  C08K9/08 ,  C08K2003/385 ,  H05K1/0206 ,  H05K1/0207 ,  H05K1/0366 ,  H05K1/0373 ,  H05K3/429 ,  H05K3/445 ,  H05K3/4623 ,  H05K3/4641 ,  H05K2201/0209 ,  H05K2201/0278 ,  H05K2201/0287 ,  H05K2201/0323 ,  Y10S428/901 ,  Y10T29/49124 ,  Y10T29/49165 ,  Y10T428/24917 ,  Y10T428/24994 ,  Y10T428/249942 ,  Y10T428/249945 ,  Y10T428/249946 ,  Y10T428/249947 ,  Y10T428/249951 ,  Y10T428/249952 ,  Y10T428/25 ,  Y10T428/292 ,  Y10T428/31504 ,  Y10T442/117 ,  Y10T442/2418

Abstract: Prepregs, laminates, printed wiring board structures and processes for constructing materials and printed wiring boards that enable the construction of printed wiring boards with improved thermal properties. In one embodiment, the prepregs include substrates impregnated with electrically and thermally conductive resins. In other embodiments, the prepregs have substrate materials that include carbon. In other embodiments, the prepregs include substrates impregnated with thermally conductive resins. In other embodiments, the printed wiring board structures include electrically and thermally conductive laminates that can act as ground and/or power planes.

公开(公告)号：US20020157859A1

公开(公告)日：2002-10-31

申请号：US10020506

申请日：2001-12-11

Inventor： Kalu K. Vasoya ,  Bharat M. Mangrolia ,  William E. Davis ,  Richard A. Bohner

IPC: H05K001/00

CPC classification number: B32B27/12 ,  B32B5/26 ,  B32B27/04 ,  B32B2260/021 ,  B32B2262/101 ,  B32B2262/106 ,  B32B2307/202 ,  B32B2307/302 ,  B32B2457/00 ,  C08K3/38 ,  C08K9/08 ,  C08K2003/385 ,  H05K1/0206 ,  H05K1/0207 ,  H05K1/0366 ,  H05K1/0373 ,  H05K3/429 ,  H05K3/445 ,  H05K3/4623 ,  H05K3/4641 ,  H05K2201/0209 ,  H05K2201/0278 ,  H05K2201/0287 ,  H05K2201/0323 ,  Y10S428/901 ,  Y10T29/49124 ,  Y10T29/49165 ,  Y10T428/24917 ,  Y10T428/24994 ,  Y10T428/249942 ,  Y10T428/249945 ,  Y10T428/249946 ,  Y10T428/249947 ,  Y10T428/249951 ,  Y10T428/249952 ,  Y10T428/25 ,  Y10T428/292 ,  Y10T428/31504 ,  Y10T442/117 ,  Y10T442/2418

Abstract: Prepregs, laminates, printed wiring board structures and processes for constructing materials and printed wiring boards that enable the construction of printed wiring boards with improved thermal properties. In one embodiment, the prepregs include substrates impregnated with electrically and thermally conductive resins. In other embodiments, the prepregs have substrate materials that include carbon. In other embodiments, the prepregs include substrates impregnated with thermally conductive resins. In other embodiments, the printed wiring board structures include electrically and thermally conductive laminates that can act as ground and/or power planes.

Abstract translation: 预浸料，层压板，印刷线路板结构以及用于构造材料和印刷线路板的工艺，其能够构造具有改善的热性能的印刷线路板。 在一个实施方案中，预浸料包括浸渍有导电和导热树脂的基材。 在其它实施例中，预浸料坯具有包括碳的基底材料。 在其它实施方案中，预浸料包括浸渍有导热树脂的基材。 在其他实施例中，印刷线路板结构包括可以用作接地和/或电力平面的导电和导热的层压板。

公开(公告)号：US20020127379A1

公开(公告)日：2002-09-12

申请号：US10045344

申请日：2001-10-25

Applicant: Matsushita Electric Industrial Co., Ltd.

Inventor： Takeshi Suzuki ,  Toshihiro Nishii ,  Satoru Tomekawa ,  Fumio Echigo

IPC: B32B003/00

CPC classification number: H05K3/4069 ,  H05K1/0366 ,  H05K1/115 ,  H05K3/0032 ,  H05K3/0047 ,  H05K3/4614 ,  H05K3/4652 ,  H05K2201/0287 ,  H05K2201/029 ,  H05K2201/0355 ,  H05K2201/094 ,  H05K2203/1461 ,  Y10S428/901 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/24322 ,  Y10T428/24802 ,  Y10T428/24917 ,  Y10T428/24994 ,  Y10T428/249953

Abstract: A circuit board includes an electrical insulator layer formed of a reinforcer sheet with density distribution in its in-plane direction, an electrical conductor filled in a plurality of inner via holes provided in the electrical insulator layer in its thickness direction, and a wiring layer connected to the electrical conductor. The inner via holes provided in a high-density portion of the reinforcer sheet are formed to have a smaller cross-section than the inner via holes provided in a low-density portion of the reinforcer sheet. In this manner, it is possible to provide a circuit board that can achieve a high-density wiring and an inner via connection resistance with less variation, when a base material including a reinforcer sheet with density distribution in its in-plane direction such as a glass-epoxy base material is used for an insulator layer.

Abstract translation: 电路板包括由其面内方向具有密度分布的增强片形成的电绝缘体层，填充在电绝缘体层的厚度方向上的多个内部通孔中的电导体和连接到电绝缘体层的布线层 到电导体。 设置在加强片的高密度部分中的内通孔形成为具有比设置在加强片的低密度部分中的内通孔更小的横截面。 以这种方式，可以提供一种电路板，其可以实现高密度布线和具有较小变化的内部通孔连接电阻，当包括在其面内方向上具有密度分布的增强片的基底材料 玻璃 - 环氧树脂基材用于绝缘体层。

公开(公告)号：US5478421A

公开(公告)日：1995-12-26

申请号：US129553

申请日：1993-09-28

Applicant: Jonas Medney ,  Fred E. Klimpl

Inventor： Jonas Medney ,  Fred E. Klimpl

IPC: B32B15/08 ,  B29B15/10 ,  B29B15/12 ,  B29C53/56 ,  B29C53/58 ,  B29C53/76 ,  B29C53/80 ,  B29C70/06 ,  B29C70/10 ,  B29C70/16 ,  B29C70/20 ,  B29C70/34 ,  B29K105/08 ,  B29L9/00 ,  B29L31/34 ,  B32B5/12 ,  B32B5/28 ,  C08J5/24 ,  H05K1/02 ,  H05K1/03 ,  H05K3/00 ,  H05K3/36 ,  H05K3/46 ,  B65H81/00

CPC classification number: B29C70/347 ,  B29C53/564 ,  B29C53/58 ,  B29C53/76 ,  B29C53/8016 ,  B29C70/202 ,  H05K1/0366 ,  H05K3/4626 ,  B29C2793/009 ,  B29C53/821 ,  B29L2031/3425 ,  H05K2201/0145 ,  H05K2201/0278 ,  H05K2201/0287 ,  H05K2203/085 ,  H05K2203/1327 ,  H05K3/0047 ,  Y10S428/901 ,  Y10T29/49158 ,  Y10T29/49176 ,  Y10T428/24074

Abstract: A warp-free laminate is produced by winding a first set of strands or filaments about a flat mandrel with a second set of strands being wound transverse to the first set. The two sets may be perpendicular to each other. The filaments are maintained under a controlled tension while being impregnated with a resin and during subsequent cure of the resin. In order to permit the formation of a warp-free product, the winding pattern is such that it forms a mirror image about a neutral axis or plane of symmetry. The winding pattern may be chosen to provide interstices in a predetermined pattern determining punching out or high speed drilling of hole openings for subsequent printed circuit applications.

Abstract translation: 通过在第一组横向缠绕第二组股线的情况下围绕扁平心轴缠绕第一组股线或细丝来生产无翘曲的层压体。 两组可以彼此垂直。 将长丝保持在可控制的张力下，同时用树脂浸渍并在随后的树脂固化期间。 为了允许形成无翘曲的产品，卷绕图案使得其形成关于中性轴或对称平面的镜像。 可以选择卷绕图案以在预定图案中提供间隙，以确定用于后续印刷电路应用的孔孔的冲孔或高速钻孔。

公开(公告)号：US5269863A

公开(公告)日：1993-12-14

申请号：US989736

申请日：1992-12-10

Applicant: Erik Middelman

Inventor： Erik Middelman

IPC: B29C67/20 ,  B29C70/20 ,  B29C70/50 ,  H05K1/03 ,  H05K3/02 ,  B32B31/20 ,  H05K3/46

CPC classification number: B29C70/16 ,  B29C70/202 ,  B29C70/50 ,  B32B38/18 ,  H05K1/0366 ,  B29C67/20 ,  B29K2105/0076 ,  B29L2031/3425 ,  B32B2038/1891 ,  B32B37/1027 ,  H05K2201/0287

Abstract: A method for the manufacture in a continuous process of a flat substrate from a fibres-reinforced matrix for a printed circuit, in which use is made of at least two moving layers of reinforcing fibres and the fibres are positioned in at least two crossing directions, whereupon the filaments layers provided with matrix material, optionally together with one or more electrical conducting layers, such as a metal foil, and/or insulating layers on one or on either outer side, are passed through a preferably heated laminating zone, such as a double belt press, characterized in that use is made of filaments-containing layers made up of a plurality of mutually parallel filaments that are not bonded in the form of a fabric and extend substantially linearly.

Abstract translation: 一种从用于印刷电路的纤维增强基质的平坦基材的连续方法中制造的方法，其中使用由至少两层增强纤维的移动层和纤维构成至少两个交叉方向， 由此，设置有矩阵材料的细丝层可选地与一个或多个导电层（例如金属箔）和/或在一个或任何外侧上的绝缘层一起通过优选加热的层压区域，例如 双带式压榨机，其特征在于，使用由多个相互平行的长丝构成的长丝层，所述长丝不以织物的形式接合并且基本上线性地延伸。

公开(公告)号：US09763326B1

公开(公告)日：2017-09-12

申请号：US14304029

申请日：2014-06-13

Applicant: Flextronics AP, LLC

Inventor： Weifeng Liu ,  Zhen Feng ,  Anwar Mohammed

IPC: H05K1/11 ,  H05K1/03 ,  A41D1/00 ,  H05K3/30

CPC classification number: H01M6/40 ,  A41D1/002 ,  A41D1/005 ,  D05B17/00 ,  H01M2/08 ,  H01M6/12 ,  H01M10/0436 ,  H01R4/00 ,  H01R4/02 ,  H01R4/029 ,  H01R43/005 ,  H01R43/02 ,  H01R43/0235 ,  H05K1/0271 ,  H05K1/0296 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/0366 ,  H05K1/0373 ,  H05K1/038 ,  H05K1/0393 ,  H05K1/09 ,  H05K1/11 ,  H05K1/111 ,  H05K1/112 ,  H05K1/115 ,  H05K1/18 ,  H05K1/181 ,  H05K1/189 ,  H05K3/284 ,  H05K3/30 ,  H05K3/305 ,  H05K3/32 ,  H05K3/4015 ,  H05K3/42 ,  H05K3/4644 ,  H05K7/02 ,  H05K9/009 ,  H05K13/04 ,  H05K2201/0154 ,  H05K2201/0158 ,  H05K2201/0162 ,  H05K2201/0287 ,  H05K2201/05 ,  H05K2201/09418 ,  H05K2201/09818

Abstract: An electronics assembly includes one or more electronic components coupled to a fabric. Each electronic component includes one or more electrical connection points, such as a bond pad or solder bump. The electronics assembly also includes one or more electrically conductive wire braids, one electrically conductive wire braid coupled to one electrical connection point on an electronic component. The electrically conductive wire braid is stitched to the fabric by an electrically conductive wire, thereby providing an electrical connection between the electronic component and the electrically conductive wire via the electrically conductive wire braid.

公开(公告)号：US08377543B2

公开(公告)日：2013-02-19

申请号：US12514365

申请日：2007-10-09

Applicant: Toshinobu Ogatsu

Inventor： Toshinobu Ogatsu

IPC: B32B9/00

CPC classification number: H05K3/4688 ,  H05K1/0366 ,  H05K1/0393 ,  H05K3/4635 ,  H05K3/4691 ,  H05K2201/0287 ,  H05K2201/029 ,  H05K2201/0296 ,  H05K2201/09018 ,  H05K2203/302 ,  Y10T428/24917 ,  Y10T442/3065 ,  Y10T442/3195 ,  Y10T442/3236

Abstract: Provided is a multilayer-wired substrate for mobile electric equipment, wherein the multilayer-wired substrate is very strong, includes a larger elastically deformable region and a higher elasticity than those of the conventional structure, and can be curved. The multilayer-wired substrate is a multilayer-wired substrate including one or more insulating layers. At least one insulating layer of the substrate is made of a material in which the mechanical characteristic in an in-plane direction component exhibits anisotropy.

Abstract translation: 本发明提供一种移动电子设备用多层布线基板，其中多层布线基板非常坚固，包括比常规结构更大的弹性变形区域和更高的弹性，并且可以是弯曲的。 多层布线基板是包括一个或多个绝缘层的多层布线基板。 衬底的至少一个绝缘层由其中面内方向分量的机械特性表现出各向异性的材料制成。