公开(公告)号：US09894761B2

公开(公告)日：2018-02-13

申请号：US15173697

申请日：2016-06-05

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Takashi Hoshi ,  Takeshi Kitamura ,  Keiko Kashihara ,  Hiroharu Inoue

IPC: H05K1/03 ,  H05K1/02 ,  C08J5/24 ,  C08G59/62 ,  C08L63/00

CPC classification number: H05K1/0366 ,  B32B15/14 ,  B32B2260/046 ,  C08G59/62 ,  C08J5/24 ,  C08J2363/00 ,  C08J2433/02 ,  C08J2433/06 ,  C08J2433/08 ,  C08L63/00 ,  H05K1/0271 ,  H05K1/0373 ,  H05K2201/0133 ,  H05K2201/0209 ,  H05K2201/0224 ,  H05K2201/029

Abstract: A prepreg includes a resin composition including: (A) at least one of an epoxy resin having a naphthalene skeleton and a phenolic hardener having a naphthalene skeleton; (B) a polymer having at least the structures of formulae (2) and (3) among formulae (1), (2) and (3) and having a weight-average molecular weight of from 200,000 to 850,000 inclusive; and (C) an inorganic filler: wherein x:y:z (molar fraction)=0:0.95:0.05 to 0.2:0.6:0.2 (where x+y+z≦1, 0≦x≦0.2, 0.6≦y≦0.95, 0.05≦z≦0.2); R1 represents a hydrogen atom or a methyl group and R2 includes at least one of a glycidyl group and an epoxidized alkyl group among a hydrogen atom, an alkyl group, a glycidyl group and an epoxidized alkyl group in formula (2); and R3 represents a hydrogen atom or a methyl group and R4 represents Ph (phenyl group), —COOCH2Ph or —COO(CH2)2Ph in formula (3).

公开(公告)号：US09867283B2

公开(公告)日：2018-01-09

申请号：US15197736

申请日：2016-06-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jin-gyu Kim ,  Hyun Lee ,  Dong-han Kim

IPC: H05K1/03 ,  H05K1/02 ,  H01L23/498 ,  H01L21/48 ,  H05K3/00

CPC classification number: H05K1/0271 ,  H01L21/4846 ,  H01L23/145 ,  H01L23/49838 ,  H05K1/03 ,  H05K1/0366 ,  H05K3/0011 ,  H05K2201/0287 ,  H05K2201/029 ,  H05K2201/0293 ,  H05K2201/2009

Abstract: A package board includes a stack structure that includes a circuit layer and a fiber layer. The fiber layer includes at least one first fiber that extends in a first direction and is a non-woven fiber. Also, a prepreg includes a first fiber that is a non-woven fiber; a plurality of second fibers that are spaced apart from the first fiber and are woven fibers; and an insulating layer that fills gaps between the first fiber and the plurality of second fibers.

公开(公告)号：US20170339780A1

公开(公告)日：2017-11-23

申请号：US15161074

申请日：2016-05-20

Applicant: Robert Bisson ,  Marko Antonic

Inventor： Robert Bisson ,  Marko Antonic

IPC: H05K1/02 ,  H05K1/03 ,  H05K3/00 ,  G06F17/50 ,  H05K1/18 ,  H05K3/30

CPC classification number: G06F17/5077 ,  H05K1/024 ,  H05K1/0245 ,  H05K1/0248 ,  H05K1/0298 ,  H05K1/0366 ,  H05K1/182 ,  H05K3/0005 ,  H05K2201/029 ,  H05K2201/044

Abstract: A method of manufacturing a printed circuit board (PCB) includes determining a weft direction of the PCB, and defining a routing design of differential pairs. The routing design is designed to have a fixed region in the weft direction. The method further includes manufacturing the PCB according to the routing design.

公开(公告)号：US09826575B2

公开(公告)日：2017-11-21

申请号：US13716808

申请日：2012-12-17

Applicant: ROLLS-ROYCE PLC

Inventor： Michael Christopher Willmot ,  Paul Broughton ,  Richard Peace ,  Gary Alan Skinner ,  Robin Charles Kennea

IPC: H02G3/03 ,  H05B3/28 ,  F02C7/12 ,  F02C7/20 ,  B23P6/00 ,  H02G3/04 ,  H01R12/00 ,  H02G3/32 ,  B60R16/02 ,  B64C3/34 ,  F02C7/141 ,  B60R16/08 ,  F02C7/16 ,  H01R12/57 ,  H01R12/59 ,  H01R12/51 ,  H01R12/61 ,  H02G3/00 ,  B60R16/00 ,  B64D29/08 ,  F02C7/00 ,  F02C7/32 ,  H02G1/00 ,  H02G3/02 ,  F02C7/047 ,  F02C7/224 ,  F24H1/10 ,  H05B1/02 ,  H05K7/20

CPC classification number: H05B3/28 ,  B23P6/005 ,  B60R16/00 ,  B60R16/02 ,  B60R16/0207 ,  B60R16/0215 ,  B60R16/08 ,  B64C3/34 ,  B64D29/08 ,  F02C7/00 ,  F02C7/047 ,  F02C7/12 ,  F02C7/141 ,  F02C7/16 ,  F02C7/20 ,  F02C7/224 ,  F02C7/32 ,  F05D2260/30 ,  F05D2300/603 ,  F16M13/02 ,  F24H1/105 ,  H01R12/00 ,  H01R12/51 ,  H01R12/515 ,  H01R12/57 ,  H01R12/59 ,  H01R12/592 ,  H01R12/61 ,  H02G1/00 ,  H02G3/00 ,  H02G3/02 ,  H02G3/04 ,  H02G3/0487 ,  H02G3/32 ,  H05B1/0236 ,  H05K1/0393 ,  H05K7/20 ,  H05K2201/029 ,  Y02T50/672 ,  Y10T29/49002 ,  Y10T29/49117 ,  Y10T29/49234 ,  Y10T29/49236 ,  Y10T29/49238 ,  Y10T156/10

Abstract: An electrical raft assembly for a gas turbine engine is provided. The raft assembly comprises a rigid electrical raft formed of a rigid material that includes an electrical system comprising electrical conductors embedded in the rigid material. The raft assembly further comprises an engine component that is mounted to the electrical raft. The electrical raft includes one or more integral cooling passages which guide a coolant fluid through the raft to cool the engine component.

公开(公告)号：US20170325334A1

公开(公告)日：2017-11-09

申请号：US15529183

申请日：2015-05-13

Applicant: ZTE CORPORATION

Inventor： Tao GUO ,  Fengchao MA ,  Yuanwang ZHANG

IPC: H05K3/10 ,  H05K1/03 ,  H05K1/02

CPC classification number: H05K3/10 ,  H05K1/0245 ,  H05K1/0248 ,  H05K1/0306 ,  H05K1/0366 ,  H05K2201/029

Abstract: A method for wiring differential signal lines and a PCB are disclosed. The wiring method includes: providing a rectangle-shaped glass fiber fabric formed of glass fibers which are woven and interlaced with each other and an adhesive filled therebetween; determining a wiring direction and obtaining a glass fiber bundle number of the glass fiber fabric in the wiring direction; equally dividing the glass fiber fabric into glass fiber units, and obtaining a width of each glass fiber unit according to a size of the glass fiber fabric in a direction perpendicular to the wiring direction and the number of the glass fiber units; determining a line distance and line widths of the differential signal lines; and according to the line distance and the line widths, forming the differential signal lines on a metal layer along the wiring direction to make the differential signal lines meet predetermined requirements.

公开(公告)号：US09814136B2

公开(公告)日：2017-11-07

申请号：US14417592

申请日：2013-07-25

Applicant: KYOCERA Corporation

Inventor： Katsura Hayashi ,  Keisaku Matsumoto

IPC: H05K1/00 ,  H05K1/11 ,  H01L23/498 ,  H05K3/46 ,  H01L23/14 ,  H05K1/02 ,  H05K1/18

CPC classification number: H05K1/112 ,  H01L23/145 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49894 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2924/15174 ,  H05K1/0298 ,  H05K1/181 ,  H05K3/4602 ,  H05K3/4655 ,  H05K2201/0175 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0269 ,  H05K2201/029

Abstract: A wiring board includes a first electrically-conductive layer; and a first resin layer covering the first electrically-conductive layer, the first resin layer including a resin portion and inorganic insulating particles dispersed in the resin portion. The first resin layer has a first layer region which is in contact with one main surface and side surfaces of the first electrically-conductive layer, and a second layer region which is located on a side of the first layer region which side is opposite to the first electrically-conductive layer. The inorganic insulating particles include a plurality of first inorganic insulating particles contained in the first layer region, and a plurality of second inorganic insulating particles contained in the second layer region. A content rate of the first inorganic insulating particles in the first layer region is lower than a content rate of the second inorganic insulating particles in the second layer region.

公开(公告)号：US09786590B2

公开(公告)日：2017-10-10

申请号：US15070184

申请日：2016-03-15

Applicant: SK Hynix Inc.

Inventor： In Chul Hwang ,  Ki Young Kim ,  Myung Geun Park

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L23/498 ,  H01L23/00 ,  H05K1/11

CPC classification number: H01L23/4985 ,  H01L23/49838 ,  H01L23/49894 ,  H01L24/17 ,  H01L2224/17104 ,  H05K1/111 ,  H05K1/189 ,  H05K3/32 ,  H05K3/3436 ,  H05K2201/0281 ,  H05K2201/029 ,  H05K2201/10962 ,  Y02P70/613

Abstract: A semiconductor package may be provided. The semiconductor package may include a substrate formed with one or more connection pads. The semiconductor package may include a semiconductor device including at least one bump. The semiconductor package may include an anisotropic conductive fabric including conductive fibers and configured to electrically couple the at least one connection pad to the at least one bump.

公开(公告)号：US09730274B2

公开(公告)日：2017-08-08

申请号：US13716254

申请日：2012-12-17

Applicant: ROLLS-ROYCE PLC

Inventor： Paul Broughton ,  Richard Peace ,  Gary Alan Skinner ,  Michael Christopher Willmot ,  Robin Charles Kennea

IPC: H05B3/28 ,  F02C7/12 ,  F02C7/20 ,  B23P6/00 ,  H02G3/04 ,  H01R12/00 ,  H02G3/32 ,  B60R16/02 ,  B64C3/34 ,  F02C7/141 ,  B60R16/08 ,  F02C7/16 ,  H01R12/57 ,  H01R12/59 ,  H01R12/51 ,  H01R12/61 ,  H02G3/00 ,  B60R16/00 ,  B64D29/08 ,  F02C7/00 ,  F02C7/32 ,  H02G1/00 ,  H02G3/02 ,  F02C7/047 ,  F02C7/224 ,  F24H1/10 ,  H05B1/02 ,  H05K7/20

CPC classification number: H05B3/28 ,  B23P6/005 ,  B60R16/00 ,  B60R16/02 ,  B60R16/0207 ,  B60R16/0215 ,  B60R16/08 ,  B64C3/34 ,  B64D29/08 ,  F02C7/00 ,  F02C7/047 ,  F02C7/12 ,  F02C7/141 ,  F02C7/16 ,  F02C7/20 ,  F02C7/224 ,  F02C7/32 ,  F05D2260/30 ,  F05D2300/603 ,  F16M13/02 ,  F24H1/105 ,  H01R12/00 ,  H01R12/51 ,  H01R12/515 ,  H01R12/57 ,  H01R12/59 ,  H01R12/592 ,  H01R12/61 ,  H02G1/00 ,  H02G3/00 ,  H02G3/02 ,  H02G3/04 ,  H02G3/0487 ,  H02G3/32 ,  H05B1/0236 ,  H05K1/0393 ,  H05K7/20 ,  H05K2201/029 ,  Y02T50/672 ,  Y10T29/49002 ,  Y10T29/49117 ,  Y10T29/49234 ,  Y10T29/49236 ,  Y10T29/49238 ,  Y10T156/10

Abstract: An electrical raft 200 comprising electrical conductors 252 embedded in a rigid material are provided to a gas turbine engine. The raft 200 is used to transport electrical signals (which may be, for example power and/or control signals) around a gas turbine engine. The electrical raft 200 has an electrical connector 700 embedded therein which is used to connect the electrical raft to an electrical unit, such as an EEC of a gas turbine engine The electrical connector 700 is resiliently biased so as to ensure a reliable electrical connection.

公开(公告)号：US09706648B2

公开(公告)日：2017-07-11

申请号：US14857907

申请日：2015-09-18

Applicant: PHILIPS LIGHTING HOLDING B.V.

Inventor： Guofu Zhou ,  Johannes Adrianus Maria Rademakers ,  Petrus Antonius Henricus Snoeijen ,  Josephus Henricus Gerardus Bax ,  Frank Anton Van Abellen ,  Liesbeth Van Pieterson

IPC: H01R33/00 ,  H01R12/00 ,  H05K1/02 ,  F21V21/00 ,  H05K1/03 ,  H05K1/18 ,  H05K3/30 ,  H05K3/32 ,  H05K1/11 ,  F21K9/20

CPC classification number: H05K1/0283 ,  F21K9/20 ,  F21V21/00 ,  H05K1/0277 ,  H05K1/038 ,  H05K1/111 ,  H05K1/181 ,  H05K1/189 ,  H05K3/303 ,  H05K3/321 ,  H05K2201/0281 ,  H05K2201/029 ,  H05K2201/10106 ,  H05K2203/0152 ,  Y10T29/4913

Abstract: A method of manufacturing an electronic textile (1) comprising the steps of: providing a textile carrier (2) comprising a plurality of conductor lines (6a-b); releasably attaching (101) the textile carrier (2) to a rigid support plate (20); providing (102) a conductive substance on the textile carrier (2) in a pattern forming a plurality of sets of connection pads (5a-b) on the textile carrier (2), each set of connection pads defining a component placement position for placement of an electronic component (3), and each set of connection pads (5a-b) comprising a connection pad overlapping one of the conductor lines, the connection pad having a connection pad length (Lcp) in a direction parallel to the conductor line and a connection pad width (Wcp) in a direction perpendicular to the conductor line, wherein the connection pad width (Wcp) is at least one percent of an extension (Wtc) of the textile carrier (2) in the direction perpendicular to the conductor line; automatically placing (103) electronic components (3) at the component placement positions; curing (104) the conductive substance to attach the electronic components (3) to the textile carrier (2), thereby forming the electronic textile (1) and removing (105) the electronic textile from the rigid support plate.

公开(公告)号：US20170179003A1

公开(公告)日：2017-06-22

申请号：US15070184

申请日：2016-03-15

Applicant: SK Hynix Inc.

Inventor： In Chul HWANG ,  Ki Young KIM ,  Myung Geun PARK

IPC: H01L23/498 ,  H01L23/00 ,  H05K1/11

CPC classification number: H01L23/4985 ,  H01L23/49838 ,  H01L23/49894 ,  H01L24/17 ,  H01L2224/17104 ,  H05K1/111 ,  H05K1/189 ,  H05K3/32 ,  H05K3/3436 ,  H05K2201/0281 ,  H05K2201/029 ,  H05K2201/10962 ,  Y02P70/613

Abstract: A semiconductor package may be provided. The semiconductor package may include a substrate formed with one or more connection pads. The semiconductor package may include a semiconductor device including at least one bump. The semiconductor package may include an anisotropic conductive fabric including conductive fibers and configured to electrically couple the at least one connection pad to the at least one bump.