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公开(公告)号：US09349549B2
公开(公告)日：2016-05-24
申请号：US13982065
申请日：2012-01-27
Applicant: Kate Stone
Inventor： Kate Stone
CPC classification number: H01H13/52 , H01H13/7006 , H01H13/79 , H01H2203/02 , H01H2203/022 , H05K1/0293 , H05K1/0386 , H05K1/0393 , H05K1/092 , H05K1/118 , H05K1/16 , H05K2201/0385 , H05K2201/09063 , H05K2201/09263 , H05K2201/10053
Abstract: An electronic component comprises a flexible planar substrate which is substantially non-stretchable, the substrate having at least two slits arranged to allow first and second portions of the substrate lying in the same plane to be moved apart, the first portion of the substrate supporting a region of conductive material.
Abstract translation: 电子部件包括基本上不可拉伸的柔性平面基板，所述基板具有布置成允许位于同一平面中的基板的第一和第二部分移动分开的至少两个切口，所述基板的第一部分支撑 导电材料区域。
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公开(公告)号：US08698186B2
公开(公告)日：2014-04-15
申请号：US13186461
申请日：2011-07-19
Applicant: Lac Nguyen , Chang Han
Inventor： Lac Nguyen , Chang Han
IPC: H01L33/62
CPC classification number: H05K1/0203 , H01L33/62 , H01L33/642 , H01L2224/48091 , H05K1/0204 , H05K1/0306 , H05K1/05 , H05K2201/0385 , H05K2201/09045 , H05K2201/09054 , H05K2201/10106 , H05K2201/10416 , H05K2201/10969 , H01L2924/00014
Abstract: An LED device with improved circuit board LED support structure is presented. A top surface of a thermally-conductive substrate of this LED device comprises a thermally-conductive pillar. The pillar is not covered with a dielectric layer and an LED package is arranged directly on the pillar with the LED packages bottom thermally-conductive plate in direct contact with the pillar top surface.
Abstract translation: 提出了一种具有改进的电路板LED支撑结构的LED器件。 该LED装置的导热基板的顶面包括导热柱。 柱子不被电介质层覆盖，并且LED封装直接布置在柱上，LED封装底部导热板与柱顶表面直接接触。
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公开(公告)号：US20130341173A1
公开(公告)日：2013-12-26
申请号：US13982065
申请日：2012-01-27
Applicant: Kate Stone
Inventor： Kate Stone
CPC classification number: H01H13/52 , H01H13/7006 , H01H13/79 , H01H2203/02 , H01H2203/022 , H05K1/0293 , H05K1/0386 , H05K1/0393 , H05K1/092 , H05K1/118 , H05K1/16 , H05K2201/0385 , H05K2201/09063 , H05K2201/09263 , H05K2201/10053
Abstract: An electronic component comprises a flexible planar substrate which is substantially non-stretchable, the substrate having at least two slits arranged to allow first and second portions of the substrate lying in the same plane to be moved apart, the first portion of the substrate supporting a region of conductive material.
Abstract translation: 电子部件包括基本上不可拉伸的柔性平面基板，所述基板具有布置成允许位于同一平面中的基板的第一和第二部分移动分开的至少两个切口，所述基板的第一部分支撑 导电材料区域。
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公开(公告)号：US07178233B2
公开(公告)日：2007-02-20
申请号：US10728177
申请日：2003-12-04
Applicant: Toshiyuki Nakamura , Hideto Tanaka , Akira Ichiryu , Motonobu Takahashi , Masahito Ishii , Daisuke Arai
Inventor： Toshiyuki Nakamura , Hideto Tanaka , Akira Ichiryu , Motonobu Takahashi , Masahito Ishii , Daisuke Arai
IPC: H01K3/10
CPC classification number: H05K3/4614 , H01L21/4857 , H01L21/486 , H01L23/49822 , H01L23/49827 , H01L2224/16 , H01L2924/01078 , H01L2924/01079 , H01L2924/15311 , H05K3/4038 , H05K3/4046 , H05K3/4617 , H05K3/462 , H05K2201/0385 , H05K2201/10378 , H05K2203/1189 , Y10T29/49126 , Y10T29/49155 , Y10T29/4916 , Y10T29/49165
Abstract: A process for producing a printed wiring board-forming sheet comprising a resin sheet having a through hole in the thickness direction and a metal chip inserted in the through hole. The sheet is produced by placing a resin sheet and conductive metal sheet in this order on a die base having a die hole, performing punching from the conductive metal sheet side to form a punched hole in the conductive metal sheet and to form a punched hole in the resin sheet and inserting the punched conductive metal chip in the through hole of the resin sheet whereby the front and back surfaces of the sheet can be electrically connected to each other. If the conductive metal chip is so inserted that its tip protrudes from the surface of the sheet, and if a large number of such substrates are laminated, electrical connection in the thickness direction can readily be made by virtue of the protruded conductive metal chips and a multi-layer board can be readily produced.
Abstract translation: 一种印刷线路板形成用片材的制造方法，其特征在于，具有在厚度方向上具有通孔的树脂片和插入所述通孔的金属片。 该片材通过将树脂片和导电金属片依次放置在具有模孔的模座上，从导电金属片侧进行冲压以在导电金属片中形成冲孔并在 树脂片，并将穿孔的导电金属芯片插入树脂片的通孔中，由此片材的前表面和后表面可以彼此电连接。 如果导电金属芯片如此插入，使得其尖端从片材的表面突出，并且如果大量这样的衬底被层压，则厚度方向上的电连接可以容易地由于突出的导电金属片和 多层板可以很容易地生产。
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