公开(公告)号：US20180004318A1

公开(公告)日：2018-01-04

申请号：US15200949

申请日：2016-07-01

Applicant: Khaled Ahmed ,  Prashant Majhi

Inventor： Khaled Ahmed ,  Prashant Majhi

IPC: G06F3/041 ,  C23C14/34 ,  H05K1/09 ,  C23C16/50 ,  C23C14/14 ,  H05K1/02 ,  H01J37/32 ,  C23C16/24

CPC classification number: G06F3/041 ,  G06F2203/04102 ,  G06F2203/04103 ,  H01J37/32009 ,  H01J37/32532 ,  H01J2237/3321 ,  H01J2237/334 ,  H05K1/0271 ,  H05K1/0346 ,  H05K1/0393 ,  H05K1/09 ,  H05K3/0014 ,  H05K3/007 ,  H05K3/027 ,  H05K3/067 ,  H05K3/107 ,  H05K2201/0154 ,  H05K2201/0323 ,  H05K2201/0338 ,  H05K2201/0341 ,  H05K2201/0385 ,  H05K2201/0391 ,  H05K2203/0759 ,  H05K2203/0769 ,  H05K2203/107

Abstract: Systems, apparatuses, and/or methods to manufacture and/or implement a sensor film, a composite electrode, and/or a computing device such as a flexible device. The sensor film may include a random network of metal lines and graphene interconnecting the metal lines. The composite electrode may be formed from the sensor film. In addition, the composite electrode may include a first portion including a metal layer in a graphene layer, wherein the metal layer is randomly located in the graphene layer, and a second portion excluding the metal layer and including the graphene layer. The sensor film may be patterned to include any composite electrode configuration, such as an antenna electrode configuration, a touch electrode configuration, and so on. Thus, the flexible device may include a flexible touch screen.

公开(公告)号：US09241410B2

公开(公告)日：2016-01-19

申请号：US13485274

申请日：2012-05-31

Applicant: Saori Ishigaki ,  Jun Ishii ,  Yoshito Fujimura ,  Yuu Sugimoto

Inventor： Saori Ishigaki ,  Jun Ishii ,  Yoshito Fujimura ,  Yuu Sugimoto

IPC: H05K1/16 ,  H05K1/18 ,  H05K3/32 ,  G11B5/48

CPC classification number: H05K1/189 ,  G11B5/484 ,  G11B5/4853 ,  G11B5/4873 ,  H05K3/321 ,  H05K2201/0385 ,  H05K2201/053 ,  H05K2201/09072 ,  H05K2201/10083

Abstract: A wired circuit board includes an insulating layer, and a conductive layer including a wire covered with the insulating layer and a terminal continued to the wire to electrically connect the wire to an electronic element. The insulating layer is formed with an insulating opening exposing the terminal, and the terminal is formed in a pattern which is indented in a thickness direction.

Abstract translation: 布线电路板包括绝缘层和导电层，导电层包括被绝缘层覆盖的导线，以及连接到导线的端子，以将导线电连接到电子元件。 绝缘层形成有露出端子的绝缘开口，并且端子形成为在厚度方向上凹陷的图案。

公开(公告)号：US20150373848A1

公开(公告)日：2015-12-24

申请号：US14625983

申请日：2015-02-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jong-hyun SEOK

IPC: H05K1/11 ,  H05K1/18 ,  G11C11/401 ,  H01C13/02

CPC classification number: H01C13/02 ,  G11C5/04 ,  G11C7/10 ,  G11C11/401 ,  H05K1/117 ,  H05K3/3415 ,  H05K2201/0385 ,  H05K2201/09545 ,  H05K2201/10159

Abstract: A semiconductor module includes a printed circuit board including an integrated circuit chip, connecting terminals at an edge of the printed circuit board, and signal lines respectively connecting electrical connection pads of the integrated circuit chip to the connecting terminals. The connecting terminals are plated using via-holes of the printed circuit board respectively connected to the signal lines.

Abstract translation: 半导体模块包括印刷电路板，其包括集成电路芯片，印刷电路板的边缘处的连接端子以及分别将集成电路芯片的电连接焊盘连接到连接端子的信号线。 使用分别连接到信号线的印刷电路板的通孔来对连接端子进行电镀。

公开(公告)号：US09888567B2

公开(公告)日：2018-02-06

申请号：US14989921

申请日：2016-01-07

Applicant: SK hynix Inc.

Inventor： Seung Yeop Lee ,  Joo Hyun Kang ,  Jong Hoon Kim ,  Han Jun Bae

IPC: H05K1/11 ,  H05K1/02 ,  H01L23/538 ,  H05K1/00 ,  H05K1/18 ,  H05K7/00 ,  H05K1/14

CPC classification number: H05K1/028 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5386 ,  H01L23/5387 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/97 ,  H01L2924/15174 ,  H01L2924/15184 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/14 ,  H05K1/147 ,  H05K2201/0385 ,  H05K2201/05 ,  H05K2201/058 ,  H01L2924/00012

Abstract: A flexible device includes a first conductive pattern, a second conductive pattern, and a dielectric layer. The first conductive pattern includes a first sliding contact portion and a first extension portion. The second conductive pattern includes a second sliding contact portion overlapping with the first sliding contact portion and the second conductive pattern includes a second extension portion. The second sliding contact portion is in contact with the first sliding contact portion and is movable on the first sliding contact portion for a sliding motion. The first and second conductive patterns are embedded in the dielectric layer.

公开(公告)号：US20130014976A1

公开(公告)日：2013-01-17

申请号：US13485274

申请日：2012-05-31

Applicant: Saori ISHIGAKI ,  Jun ISHII ,  Yoshito FUJIMURA ,  Yuu SUGIMOTO

Inventor： Saori ISHIGAKI ,  Jun ISHII ,  Yoshito FUJIMURA ,  Yuu SUGIMOTO

IPC: H05K1/00 ,  H05K3/10 ,  H05K1/05

CPC classification number: H05K1/189 ,  G11B5/484 ,  G11B5/4853 ,  G11B5/4873 ,  H05K3/321 ,  H05K2201/0385 ,  H05K2201/053 ,  H05K2201/09072 ,  H05K2201/10083

Abstract: [Purpose] To provide a wired circuit board in which it is possible to inhibit a conductive adhesive from leaking to the outside, while inhibiting terminals from being increased in size, and also improve connection reliability.[Solving Means] A suspension board with circuit 3 includes power-source wires 25B, and piezoelectric-side terminals 40 formed continuously to the power-source wires 25B and electrically connected thereunder to piezoelectric elements 5. Each of the piezoelectric-side terminals 40 includes an outer contact portion 51, and an inner contact portion 53 provided around the outer contact portion 51 to protrude below the outer contact portion 51.

Abstract translation: [目的]提供一种布线电路基板，其中可以抑制导电粘合剂泄漏到外部，同时抑制端子的尺寸增加，并且还提高连接可靠性。 具体实施方式具有电路3的悬挂基板包括电源线25B和压电侧端子40，压电侧端子40与电源线25B连续地形成，并且与压电元件5电连接。各压电侧端子40包括 外接触部51和设置在外接触部51周围的内接触部53，突出到外接触部51的下方。

公开(公告)号：US20080099922A1

公开(公告)日：2008-05-01

申请号：US11554472

申请日：2006-10-30

Applicant: Noriaki Sakamoto

Inventor： Noriaki Sakamoto

IPC: H01L23/52 ,  H01L23/48 ,  H01L29/40 ,  H01L21/00

CPC classification number: H01L23/49531 ,  H01L21/565 ,  H01L23/4334 ,  H01L23/49544 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/3025 ,  H05K1/056 ,  H05K3/284 ,  H05K3/328 ,  H05K3/4084 ,  H05K3/44 ,  H05K2201/0382 ,  H05K2201/0385 ,  H05K2201/09554 ,  H05K2201/1034 ,  H05K2201/10924 ,  H05K2203/049 ,  H01L2924/00 ,  H01L2924/20753 ,  H01L2924/2076 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: A first insulating layer is formed on a front surface of a rectangular circuit board. Conductive patterns having a predetermined shape are formed on a front surface of the first insulating layer. A semiconductor element and a chip element are electrically connected to the conductive patterns by use of solder or conductive paste. The conductive patterns, the semiconductor element and the chip element which are formed on the front surface of the circuit board, are covered with a sealing resin. Pads on the circuit board and leads are connected to each other by use of thin metal wires.

Abstract translation: 第一绝缘层形成在矩形电路板的前表面上。 具有预定形状的导电图案形成在第一绝缘层的前表面上。 半导体元件和芯片元件通过使用焊料或导电膏电连接到导电图案。 形成在电路板的前表面上的导电图案，半导体元件和芯片元件被密封树脂​​覆盖。 电路板上的焊盘和引线通过使用细金属线相互连接。

公开(公告)号：US09793034B2

公开(公告)日：2017-10-17

申请号：US14625983

申请日：2015-02-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jong-hyun Seok

IPC: H01C13/02 ,  G11C5/04 ,  H05K1/11 ,  G11C11/401 ,  G11C7/10 ,  H05K3/34

CPC classification number: H01C13/02 ,  G11C5/04 ,  G11C7/10 ,  G11C11/401 ,  H05K1/117 ,  H05K3/3415 ,  H05K2201/0385 ,  H05K2201/09545 ,  H05K2201/10159

Abstract: A semiconductor module includes a printed circuit board including an integrated circuit chip, connecting terminals at an edge of the printed circuit board, and signal lines respectively connecting electrical connection pads of the integrated circuit chip to the connecting terminals. The connecting terminals are plated using via-holes of the printed circuit board respectively connected to the signal lines.

公开(公告)号：US20130020606A1

公开(公告)日：2013-01-24

申请号：US13186461

申请日：2011-07-19

Applicant: Chang HAN ,  Lac NGUYEN

Inventor： Chang HAN ,  Lac NGUYEN

IPC: H01L33/62 ,  H05K3/00 ,  H05K1/11

CPC classification number: H05K1/0203 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/48091 ,  H05K1/0204 ,  H05K1/0306 ,  H05K1/05 ,  H05K2201/0385 ,  H05K2201/09045 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2201/10416 ,  H05K2201/10969 ,  H01L2924/00014

Abstract: An LED device with improved circuit board LED support structure is presented. A top surface of a thermally-conductive substrate of this LED device comprises a thermally-conductive pillar. The pillar is not covered with a dielectric layer and an LED package is arranged directly on the pillar with the LED packages bottom thermally-conductive plate in direct contact with the pillar top surface.

Abstract translation: 提出了一种具有改进的电路板LED支撑结构的LED器件。 该LED装置的导热基板的顶面包括导热柱。 柱子不被电介质层覆盖，并且LED封装直接布置在柱上，LED封装底部导热板与柱顶表面直接接触。

公开(公告)号：US20040111882A1

公开(公告)日：2004-06-17

申请号：US10728177

申请日：2003-12-04

Inventor： Toshiyuki Nakamura ,  Hideto Tanaka ,  Akira Ichiryu ,  Motonobu Takahashi ,  Masahito Ishii ,  Daisuke Arai

IPC: H05K003/36 ,  H05K003/02 ,  H05K001/00

CPC classification number: H05K3/4614 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2224/16 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H05K3/4038 ,  H05K3/4046 ,  H05K3/4617 ,  H05K3/462 ,  H05K2201/0385 ,  H05K2201/10378 ,  H05K2203/1189 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/4916 ,  Y10T29/49165

Abstract: A process for producing a printed wiring board-forming sheet comprising a resin sheet having a through hole in the thickness direction and a metal chip inserted in the through hole. The sheet is produced by placing a resin sheet and conductive metal sheet in this order on a die base having a die hole, performing punching from the conductive metal sheet side to form a punched hole in the conductive metal sheet and to form a punched hole in the resin sheet and inserting the punched conductive metal chip in the through hole of the resin sheet whereby the front and back surfaces of the sheet can be electrically connected to each other. If the conductive metal chip is so inserted that its tip protrudes from the surface of the sheet, and if a large number of such substrates are laminated, electrical connection in the thickness direction can readily be made by virtue of the protruded conductive metal chips and a multi-layer board can be readily produced.

Abstract translation: 一种印刷线路板形成用片材的制造方法，其特征在于，具有在厚度方向上具有通孔的树脂片和插入所述通孔的金属片。 该片材通过将树脂片和导电金属片依次放置在具有模孔的模座上，从导电金属片侧进行冲压以在导电金属片中形成冲孔并在 树脂片，并将穿孔的导电金属芯片插入树脂片的通孔中，由此片材的前表面和后表面可以彼此电连接。 如果导电金属芯片如此插入，使得其尖端从片材的表面突出，并且如果大量这样的衬底被层压，则厚度方向上的电连接可以容易地由于突出的导电金属片和 多层板可以很容易地生产。

公开(公告)号：US20170064832A1

公开(公告)日：2017-03-02

申请号：US14989921

申请日：2016-01-07

Applicant: SK hynix Inc.

Inventor： Seung Yeop Lee ,  Joo Hyun Kang ,  Jong Hoon Kim ,  Han Jun Bae

IPC: H05K1/18 ,  H05K1/02

CPC classification number: H05K1/028 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5386 ,  H01L23/5387 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/97 ,  H01L2924/15174 ,  H01L2924/15184 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/14 ,  H05K1/147 ,  H05K2201/0385 ,  H05K2201/05 ,  H05K2201/058 ,  H01L2924/00012

Abstract: A flexible device includes a first conductive pattern, a second conductive pattern, and a dielectric layer. The first conductive pattern includes a first sliding contact portion and a first extension portion. The second conductive pattern includes a second sliding contact portion overlapping with the first sliding contact portion and the second conductive pattern includes a second extension portion. The second sliding contact portion is in contact with the first sliding contact portion and is movable on the first sliding contact portion for a sliding motion. The first and second conductive patterns are embedded in the dielectric layer.

Abstract translation: 柔性器件包括第一导电图案，第二导电图案和介电层。 第一导电图案包括第一滑动接触部分和第一延伸部分。 第二导电图案包括与第一滑动接触部分重叠的第二滑动接触部分，并且第二导电图案包括第二延伸部分。 第二滑动接触部分与第一滑动接触部分接触并可在第一滑动接触部分上移动以进行滑动。 第一和第二导电图案嵌入在介电层中。