公开(公告)号：US20080200360A1

公开(公告)日：2008-08-21

申请号：US11995138

申请日：2006-08-21

Applicant: Thomas Beck ,  Irene Kubitza ,  Hans-Jurgen Schreier ,  Gerhard Steinberger

Inventor： Thomas Beck ,  Irene Kubitza ,  Hans-Jurgen Schreier ,  Gerhard Steinberger

IPC: C11D7/32 ,  C11D7/50

CPC classification number: H05K3/26 ,  C11D7/261 ,  C11D7/3218 ,  C11D7/5013 ,  C11D7/5022 ,  C11D11/0047 ,  G03F7/40 ,  G03F7/405 ,  G03F7/425 ,  H05K3/244 ,  H05K3/28 ,  H05K2201/0761 ,  H05K2203/122

Abstract: To reduce ionic contaminants on printed circuit boards that are at least partially covered with a solder resist mask and are provided with top layers on the copper structures, an aqueous cleaning solution is used, which contains at least one ethanolamine compound and/or the salt thereof, at least one alcoholic solvent and, at need, at least one guanidine compound and/or the salt thereof.

Abstract translation: 为了减少至少部分地被阻焊掩模覆盖的印刷电路板上的离子污染物，并且在铜结构上设置有顶层，使用含水清洗溶液，其含有至少一种乙醇胺化合物和/或其盐 ，至少一种醇溶剂和需要的至少一种胍化合物和/或其盐。

公开(公告)号：US20080073614A1

公开(公告)日：2008-03-27

申请号：US11903837

申请日：2007-09-25

Applicant: Daisaku Akiyama ,  Daisuke Katayama

Inventor： Daisaku Akiyama ,  Daisuke Katayama

IPC: C09K13/08

CPC classification number: H05K3/26 ,  C23F1/30 ,  C23F1/44 ,  H05K3/108 ,  H05K3/181 ,  H05K2201/0761

Abstract: A metal removing solution of the present invention is a solution for removing palladium, tin, silver, palladium alloy, silver alloy, and tin alloy, and the metal removing solution contains a chain thiocarbonyl compound. A removing method of the present invention for removing palladium, tin, silver, palladium alloy, silver alloy, and tin alloy is a method for selectively removing a metal other than copper or copper alloy, from a system that includes copper or copper alloy and at least one selected from palladium, tin, silver, palladium alloy, silver alloy, and tin alloy, by using a metal removing solution containing a chain thiocarbonyl compound. Thus, the present invention provides the metal removing solution capable of removing palladium, tin, silver, palladium alloy, silver alloy, and tin alloy, the solution having an excellent property of removing palladium, tin, silver, palladium alloy, silver alloy, tin alloy, and the like without attacking copper, and having an excellent handleability since the solution does not contain any toxic substance; and the removing method using the foregoing metal removing solution.

Abstract translation: 本发明的金属去除溶液是用于除去钯，锡，银，钯合金，银合金和锡合金的溶液，金属去除溶液含有链硫代羰基化合物。 本发明的除去钯，锡，银，钯合金，银合金，锡合金的除去方法是从包含铜或铜合金的系统中选择除去铜或铜合金以外的金属的方法， 通过使用含有链硫代羰基化合物的金属去除溶液，选自钯，锡，银，钯合金，银合金和锡合金中的至少一种。 因此，本发明提供能够除去钯，锡，银，钯合金，银合金和锡合金的金属去除溶液，该溶液具有优异的除去钯，锡，银，钯合金，银合金，锡 合金等而不侵蚀铜，并且由于溶液不含任何有毒物质，因此具有优异的可操作性; 以及使用上述金属去除溶液的除去方法。

公开(公告)号：US20080011981A1

公开(公告)日：2008-01-17

申请号：US11900959

申请日：2007-09-14

Applicant: Masayo Kuriyama ,  Ryo Ogushi ,  Daisaku Akiyama ,  Kaoru Urushibata

Inventor： Masayo Kuriyama ,  Ryo Ogushi ,  Daisaku Akiyama ,  Kaoru Urushibata

IPC: C09K13/04 ,  C09K13/06

CPC classification number: H05K3/26 ,  C23F1/28 ,  C23F1/30 ,  H05K3/181 ,  H05K2201/0761 ,  H05K2203/0789 ,  H05K2203/124

Abstract: An etchant of the present invention includes an aqueous solution containing hydrochloric acid, nitric acid, and a cupric ion source. An etching method of the present invention includes bringing the etchant into contact with at least one metal selected from nickel, chromium, nickel-chromium alloys, and palladium. Another etching method of the present invention includes bringing a first etchant that includes an aqueous solution containing at least the following components A to C (A. hydrochloric acid; B. at least one compound selected from the following (a) to (c): (a) compounds with 7 or less carbon atoms, containing a sulfur atom(s) and at least one group selected from an amino group, an imino group, a carboxyl group, a carbonyl group, and a hydroxyl group; (b) thiazole; and (c) thiazole compounds; and C. a surfactant) into contact with a surface of the metal, and then bringing a second solution that includes an aqueous solution containing hydrochloric acid, nitric acid, and a cupric ion source into contact with the surface of the metal. According to the etchant and the etching methods of the present invention, it is possible to etch at least one metal selected from nickel, chromium, nickel-chromium alloys, and palladium quickly and suppress excessive dissolution of copper.

Abstract translation: 本发明的蚀刻剂包括含有盐酸，硝酸和铜离子源的水溶液。 本发明的蚀刻方法包括使蚀刻剂与选自镍，铬，镍 - 铬合金和钯中的至少一种金属接触。 本发明的另一种蚀刻方法包括使包含至少含有以下组分A至C的水溶液的第一蚀刻剂（A.盐酸; B.至少一种选自以下（a）至（c）的化合物： （a）具有7个以下碳原子的含有硫原子和至少1个选自氨基，亚氨基，羧基，羰基和羟基的基团的化合物;（b）噻唑 ;和（c）噻唑化合物;和C.a表面活性剂）与金属的表面接触，然后使包含含有盐酸，硝酸和铜离子源的水溶液的第二溶液与 金属表面。 根据本发明的蚀刻剂和蚀刻方法，可以快速地蚀刻选自镍，铬，镍 - 铬合金和钯中的至少一种金属并抑制铜的过度溶解。

公开(公告)号：US07219826B2

公开(公告)日：2007-05-22

申请号：US10805768

申请日：2004-03-22

Applicant: Junji Nakamura

Inventor： Junji Nakamura

IPC: B23K31/02

CPC classification number: H01L23/3735 ,  C04B37/026 ,  C04B2237/125 ,  C04B2237/126 ,  C04B2237/127 ,  C04B2237/343 ,  C04B2237/366 ,  C04B2237/407 ,  C04B2237/64 ,  C04B2237/704 ,  C04B2237/706 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K3/06 ,  H05K3/067 ,  H05K3/26 ,  H05K3/38 ,  H05K2201/0761 ,  H05K2203/1476 ,  H01L2924/00

Abstract: There is provided a method for producing a reliable metal/ceramic bonding substrate at low costs by forming a desired fillet on the peripheral portion of a metal circuit by a small number of steps. After an active metal containing brazing filler metal 12 is applied on a ceramic substrate 10 to bond a metal member 14 thereto, a resist 16 is applied on a predetermined portion of a surface of the metal member 14 to etch unnecessary portions, and then the resist is removed. Thereafter, unnecessary part of a metal layer 12b, which is formed of a metal other than an active metal of the active metal containing brazing filler metal 12, is etched with a chemical to be removed. Then, unnecessary part of an active metal layer 12a, which is formed of the active metal and a compound thereof, is selectively etched with a chemical, which inhibits the metal member 14 and the metal layer 12b from being etched and which selectively etch the active metal layer 12b, to form a metal circuit on the ceramic substrate 10. This metal circuit is chemically polished to form a fillet on the peripheral portion of the metal circuit.

Abstract translation: 提供了一种通过以少量的步骤在金属电路的周边部分上形成所需的圆角而以低成本制造可靠的金属/陶瓷接合基板的方法。 在将含有活性金属的钎料12施加到陶瓷基板10上以将金属构件14接合到其上之后，将抗蚀剂16施加在金属构件14的表面的预定部分上以蚀刻不需要的部分，然后将抗蚀剂 被删除。 之后，用除去含有活性金属的活性金属的活性金属以外的金属形成的金属层12b的不必要部分被除去。 然后，用化学物质选择性地蚀刻由活性金属形成的活性金属层12a的不需要的部分和其化合物，其抑制金属部件14和金属层12b被蚀刻并且选择性蚀刻 活性金属层12b，以在陶瓷基板10上形成金属电路。 该金属电路被化学抛光以在金属电路的周边部分上形成圆角。

公开(公告)号：US20060157351A1

公开(公告)日：2006-07-20

申请号：US11317596

申请日：2005-12-23

Applicant: Takashi Oda

Inventor： Takashi Oda

IPC: C25D5/02

CPC classification number: C25D5/022 ,  H05K1/0346 ,  H05K3/108 ,  H05K3/26 ,  H05K2201/0761 ,  H05K2203/095

Abstract: A printed circuit board having prescribed conductive patterns formed on an insulating layer is provided about 20 mm apart from an AC electrode provided in a plasma etching device. An earth electrode is provided on the side opposing the AC electrode. More specifically, the printed circuit board is provided outside a sheath layer that is a region having a high plasma density generated in the vicinity of the AC electrode. The frequency of an AC power supply is preferably not more than 1 GHz. The pressure in the device is preferably in the range from 1.33×10−2 Pa to 1.33×102 Pa. The inter-electrode distance between the AC electrode and the earth electrode is preferably not more than 150 mm, more preferably from 40 mm to 100 mm.

Abstract translation: 在绝缘层上形成具有规定导电图案的印刷电路板，与设置在等离子体蚀刻装置中的AC电极间隔开大约20mm。 在与AC电极相对的一侧设置接地电极。 更具体地，印刷电路板设置在作为在交流电极附近产生的具有高等离子体密度的区域的皮层之外。 交流电源的频率优选为1GHz以下。 装置中的压力优选在1.33×10 -2 Pa至1.33×10 2 Pa的范围内。 AC电极和接地电极之间的电极间距离优选为150mm以下，更优选为40mm〜100mm。

公开(公告)号：US06926922B2

公开(公告)日：2005-08-09

申请号：US10408422

申请日：2003-04-07

Applicant: Mei Kiu Leung ,  Willetta Lai ,  Pit Kai Peter Cheng ,  Cecilia Po Sze Wong

Inventor： Mei Kiu Leung ,  Willetta Lai ,  Pit Kai Peter Cheng ,  Cecilia Po Sze Wong

IPC: C23C18/18 ,  H05K3/24 ,  H05K3/26 ,  H05K3/38 ,  H05K3/42 ,  B05D5/12

CPC classification number: H05K3/244 ,  H05K3/26 ,  H05K3/383 ,  H05K2201/0761 ,  H05K2201/09063 ,  H05K2203/121

Abstract: A process and composition for manufacturing printed wiring boards that reduces or eliminates the problem of depositing electroless nickel in through holes that are not designed to be metal plated is provided. Also provided by the present invention is a method and composition for depositing a final finish that is even and bright. The present invention is particularly suitable for the manufacture of printed circuit boards containing one or more electroless nickel-immersion gold layers.

Abstract translation: 提供一种用于制造印刷线路板的方法和组合物，其减少或消除了将非电解镍沉积在未设计为金属镀覆的通孔中的问题。 本发明还提供了一种沉积最终光洁度的方法和组合物，其是均匀且明亮的。 本发明特别适用于制造含有一种或多种无电镀镍浸镀金层的印刷电路板。

公开(公告)号：US20050067703A1

公开(公告)日：2005-03-31

申请号：US10502129

申请日：2003-10-22

Applicant: Takeshi Hashimoto

Inventor： Takeshi Hashimoto

IPC: H01L21/60 ,  H01L23/495 ,  H01L23/538 ,  H05K1/00 ,  H05K3/00 ,  H05K3/20 ,  H05K3/22 ,  H05K3/38 ,  H01L23/48

CPC classification number: H01L23/49572 ,  H01L23/5387 ,  H01L2924/0002 ,  H05K1/0393 ,  H05K3/0032 ,  H05K3/202 ,  H05K3/22 ,  H05K3/386 ,  H05K2201/0761 ,  H05K2203/0522 ,  H01L2924/00

Abstract: The present invention provides an electronic device having high insulating reliability, in which metal portions of a circuit are not electrically conductive with each other via an adhesive layer even when the electronic device is used in high-temperature low-humidity conditions or high-temperature high-humidity conditions, and provides a production method for the electronic device, and a semiconductor device comprising the electronic device. In the electronic device in which a circuit formed by pattern formation of metal portions is attached via an adhesive layer to an insulating base, the adhesive layer, which contacts adjacent metal portions, is divided. Typically, the electronic device is one of a lead frame having a lead frame fixing tape, a TAB tape, and a flexible printed circuit board.

Abstract translation: 本发明提供一种具有高绝缘可靠性的电子器件，其中电路中的金属部分通过粘合剂层彼此不导电，即使电子器件用于高温低湿条件或高温高 并且提供了一种电子设备的制造方法以及包括该电子设备的半导体器件。 在通过金属部分的图案形成形成的电路经由粘合剂层附着到绝缘基底的电子装置中，与邻接的金属部分接触的粘合剂层被分割。 通常，电子设备是具有引线框架固定带，TAB带和柔性印刷电路板的引线框架之一。

公开(公告)号：US06790478B1

公开(公告)日：2004-09-14

申请号：US10030779

申请日：2002-05-24

Applicant: Walter Roethlingshoefer ,  Manfred Boehm

Inventor： Walter Roethlingshoefer ,  Manfred Boehm

IPC: B05D136

CPC classification number: H01L23/49894 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K3/22 ,  H05K2201/0761 ,  H05K2203/1163 ,  H05K2203/1173 ,  H01L2924/00

Abstract: In a ceramic hybrid substrate and a method for treating the surface of a ceramic hybrid substrate having ceramic surface areas and metallic surface areas, the ceramic surface areas are esterified.

Abstract translation: 在陶瓷混合基板和陶瓷混合基板的表面处理陶瓷表面积和金属表面积的方法中，陶瓷表面积被酯化。

公开(公告)号：US06751857B2

公开(公告)日：2004-06-22

申请号：US09824506

申请日：2001-04-02

Applicant: Andrew Michael Cherniski ,  James Kristian Koch

Inventor： Andrew Michael Cherniski ,  James Kristian Koch

IPC: H05K332

CPC classification number: H01L23/48 ,  H01L23/49562 ,  H01L23/49586 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/0256 ,  H05K3/301 ,  H05K3/306 ,  H05K3/3447 ,  H05K2201/0133 ,  H05K2201/0761 ,  H05K2201/10166 ,  H05K2201/10424 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/49142 ,  Y10T29/49144 ,  Y10T29/53174 ,  Y10T29/53183 ,  H01L2924/00

Abstract: A method and apparatus to eliminate conductive contamination reliability problems for assembled substrates, such as electrical arcing in power semiconductor leads. One embodiment of the invention involves a method for assembling an electrical component having leads on a substrate having conductive contacts, wherein an elastomer part encapsulates the leads of the electrical component. A second embodiment of the invention involves assembling an electrical component having leads to a substrate having conductive contacts, wherein an elastomer shape cut by a punch die encapsulates the leads of the electrical component. A third embodiment of the invention involves an assembled substrate including an electrical component having leads, and an elastomer surrounding the leads to encapsulate the leads.

Abstract translation: 一种用于消除组装的衬底的导电污染可靠性问题的方法和装置，例如功率半导体引线中的电弧。 本发明的一个实施例涉及一种用于组装具有导体的电气部件的方法，所述导线在具有导电触点的基板上，其中弹性体部件封装电气部件的引线。 本发明的第二实施例涉及将具有导线的电气部件组装到具有导电触点的基板上，其中由冲压模切割的弹性体形状封装电气部件的引线。 本发明的第三实施例涉及包括具有引线的电气部件的组装的基板和围绕引线的弹性体以封装引线。

公开(公告)号：US06544584B1

公开(公告)日：2003-04-08

申请号：US08813765

申请日：1997-03-07

Applicant: Edward Lee Arrington ,  John Christopher Camp ,  Robert Jeffrey Day ,  Edmond Otto Fey ,  Curtis Michael Gunther ,  Thomas Richard Miller

Inventor： Edward Lee Arrington ,  John Christopher Camp ,  Robert Jeffrey Day ,  Edmond Otto Fey ,  Curtis Michael Gunther ,  Thomas Richard Miller

IPC: B05D512

CPC classification number: H05K3/26 ,  H05K3/184 ,  H05K2201/0761 ,  H05K2203/0796 ,  Y10S428/901 ,  Y10T428/12396 ,  Y10T428/12715 ,  Y10T428/12861 ,  Y10T428/12868 ,  Y10T428/24917 ,  Y10T428/31678

Abstract: A process for removal of undesirable conductive material (e.g., catalyst material and seeped circuit material) on a circuitized substrate and the resultant circuitized substrates disclosed. Such process and resultant circuit effectively address the electrical shorting problems caused by nonremoval of the residual catalyst material and circuit material which has seeped under the residual catalyst material. The process includes the steps of: a) providing a catalyst layer (e.g., palladium and tin) having circuit pattern (e.g., copper) thereon; b) pretreating the catalyst layer and the circuit pattern (e.g., with a cyanide dip) for removal of undesirable portions of each which cause electrical leakage between circuit lines of the circuit pattern; c) oxidizing the catalyst layer and the circuit pattern (e.g., with chlorite, permanganate, hydrogen peroxide, or air at a temperature elevated above ambient conditions); and d) removing the undesirable portions of the catalyst layer and the undesirable portions of the circuit pattern (e.g., with a cyanide submersion). The resultant circuitized substrate includes a circuit pattern on a catalyst layer wherein undesirable portions of the catalyst layer and circuit pattern are completely removed between the circuit features of the circuit pattern so that electrical leakage between the circuit features does not occur.

Abstract translation: 用于去除电路化基板上的不期望的导电材料（例如催化剂材料和渗出的电路材料）的方法以及公开的所得的电路化基板。 这种工艺和结果电路有效地解决了残余催化剂材料和残余催化剂材料下渗出的电路材料的非破坏所引起的电短路问题。 该方法包括以下步骤：a）在其上提供具有电路图案（例如铜）的催化剂层（例如钯和锡） b）预处理催化剂层和电路图案（例如，用氰化物浸渍），以除去在电路图案的电路线之间引起漏电的各部分的不希望的部分; c）氧化催化剂层和电路图案（例如，在高于环境条件的温度下使用亚氯酸盐，高锰酸盐，过氧化氢或空气）; 以及d）去除催化剂层的不期望的部分和电路图案的不希望的部分（例如，氰化物浸没）。 所得到的电路化衬底包括在催化剂层上的电路图案，其中在电路图案的电路特征之间催化剂层和电路图案的不期望部分被完全去除，使得电路特征之间的电泄漏不会发生。