公开(公告)号：US20160309559A1

公开(公告)日：2016-10-20

申请号：US15136599

申请日：2016-04-22

Applicant: ARKALUMEN INC.

Inventor： Gerald Edward BRIGGS

IPC: H05B33/08

CPC classification number: H05B33/0827 ,  F21K9/60 ,  F21K99/00 ,  F21S4/20 ,  F21V23/005 ,  F21V23/04 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/62 ,  H01L2924/0002 ,  H05B33/0803 ,  H05B33/0845 ,  H05B33/0857 ,  H05K1/05 ,  H05K2201/09309 ,  H05K2201/09972 ,  H05K2201/10106 ,  H01L2924/00

Abstract: A LED based lighting apparatus is disclosed. The light engine used in the lighting apparatus may use printed circuit board and have a plurality of LED groups that are independently controllable by a control unit. The power supply input and return paths connected to each LED group may be implemented on different layers to allow a compact footprint that may be used with traditional fluorescent encasements with relatively little modification. The LEDs may comprise a subset of LEDs having a first colour and a subset of LEDs having a second colour different from said first colour intertwined on the light engine.

Abstract translation: 公开了一种基于LED的照明装置。 在照明装置中使用的光引擎可以使用印刷电路板，并且具有可由控制单元独立控制的多个LED组。 连接到每个LED组的电源输入和返回路径可以在不同的层上实现，以允许紧凑的占地面积可以与具有相对较少修改的传统荧光灯罩一起使用。 LED可以包括具有第一颜色的LED的子集和具有与在光引擎上交织的所述第一颜色不同的第二颜色的LED的子集。

公开(公告)号：US20160307875A1

公开(公告)日：2016-10-20

申请号：US15191774

申请日：2016-06-24

Applicant: Renesas Electronics Corporation

Inventor： Yoichiro KURITA ,  Masaya KAWANO ,  Koji SOEJIMA

IPC: H01L25/065 ,  H01L25/00

CPC classification number: H01L25/50 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/13 ,  H01L23/3121 ,  H01L23/49816 ,  H01L23/522 ,  H01L23/5226 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5386 ,  H01L24/02 ,  H01L24/16 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/16 ,  H01L25/18 ,  H01L2221/68345 ,  H01L2221/68372 ,  H01L2224/02319 ,  H01L2224/02331 ,  H01L2224/02333 ,  H01L2224/02372 ,  H01L2224/02373 ,  H01L2224/02379 ,  H01L2224/02381 ,  H01L2224/16137 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2224/17181 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81005 ,  H01L2224/83005 ,  H01L2225/06513 ,  H01L2225/06544 ,  H01L2225/06555 ,  H01L2225/06582 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/18161 ,  H01L2924/19015 ,  H01L2924/19041 ,  H01L2924/19105 ,  H05K3/0058 ,  H05K3/284 ,  H05K3/4682 ,  H05K2201/0195 ,  H05K2201/09527 ,  H05K2201/096 ,  H05K2201/09972 ,  H05K2203/016 ,  H05K2203/0733 ,  H05K2203/1469 ,  H01L2924/00 ,  H01L2224/0401

Abstract: In a conventional electronic device and a method of manufacturing the same, reduction in cost of the electronic device is hindered because resin used in an interconnect layer on the solder ball side is limited. The electronic device includes an interconnect layer (a first interconnect layer) and an interconnect layer (a second interconnect layer). The second interconnect layer is formed on the undersurface of the first interconnect layer. The second interconnect layer is larger in area seen from the top than the first interconnect layer and is extended to the outside from the first interconnect layer.

公开(公告)号：US09456488B2

公开(公告)日：2016-09-27

申请号：US14090445

申请日：2013-11-26

Applicant: Taiyo Yuden Co., Ltd.

Inventor： Masaya Shimamura ,  Takehiko Kai ,  Eiji Mugiya ,  Tetsuo Saji ,  Hiroshi Nakamura

IPC: H05K1/02 ,  H05K3/28 ,  H05K9/00 ,  H05K5/06 ,  H01L23/31 ,  H01L21/56 ,  H01L23/552 ,  H01L23/00

CPC classification number: H05K1/0216 ,  H01L21/561 ,  H01L23/3135 ,  H01L23/552 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/97 ,  H01L2924/12042 ,  H01L2924/15159 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19105 ,  H05K1/0215 ,  H05K1/0269 ,  H05K3/284 ,  H05K5/065 ,  H05K9/0037 ,  H05K9/0083 ,  H05K2201/09036 ,  H05K2201/09145 ,  H05K2201/09972 ,  H05K2201/1056 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012

Abstract: There is provided a circuit module including a circuit substrate having a mount surface; a mount component mounted on the mount surface; a sealing body formed on the mount surface, the sealing body covering the mount component and having a trench formed from a main surface of the sealing body to the mount surface; and a shield having an inner shield section formed within the trench and an outer shield section that covers the sealing body and the inner shield section, the outer shield section including a first section having a flat surface formed on the main surface of the shielding body and a second section formed on the inner shield section and protruded or sagged from the first section.

Abstract translation: 提供一种电路模块，包括具有安装表面的电路基板; 安装在安装表面上的安装部件; 所述密封体形成在所述安装表面上，所述密封体覆盖所述安装部件，并且具有从所述密封体的主表面到所述安装表面形成的沟槽; 以及屏蔽体，其具有形成在所述沟槽内的内屏蔽部和覆盖所述密封体和所述内屏蔽部的外屏蔽部，所述外屏蔽部具有形成在所述屏蔽体的主表面上的平坦面的第一部， 形成在所述内屏蔽部上并从所述第一部分突出或下垂的第二部分。

公开(公告)号：US20160278219A1

公开(公告)日：2016-09-22

申请号：US15163978

申请日：2016-05-25

Applicant: YAZAKI CORPORATION

Inventor： Ken Ito

IPC: H05K5/00 ,  H05K3/22 ,  H05K5/02

CPC classification number: H05K5/0034 ,  H05K3/22 ,  H05K3/284 ,  H05K5/0226 ,  H05K5/0239 ,  H05K5/0247 ,  H05K2201/09736 ,  H05K2201/09781 ,  H05K2201/0989 ,  H05K2201/09972 ,  H05K2201/2009 ,  H05K2203/1316 ,  H05K2203/1327

Abstract: An electronic circuit unit in which a mold exclusion part, having a rear surface side covered by mold resin and a front surface side exposed from an outer case, is provided at a part of a plate surface of a circuit board which is mounted with electronic components and is covered by the outer case formed by the mold resin. The outer case is multi-material molded using plural kinds of resin having different fluidities. A rear wall of the outer case located on the rear surface side of the mold exclusion part is made of one of the plural kinds of the resin having a fluidity higher than a fluidity of another one of the plural kinds of the resin constituting the other portion of the outer case.

Abstract translation: 一种电子电路单元，其具有被模制树脂覆盖的后表面侧和从外壳暴露的前表面侧的模具排除部分设置在安装有电子部件的电路板的板表面的一部分处 并被由模制树脂形成的外壳覆盖。 外壳使用具有不同流动性的多种树脂进行多材料成型。 位于模具排除部的后表面侧的外壳的后壁由构成另一部分的多种树脂中的另一种的流动性高于多种树脂的多种树脂中的一种制成 的外壳。

公开(公告)号：US09420692B2

公开(公告)日：2016-08-16

申请号：US14609742

申请日：2015-01-30

Applicant: DENSO CORPORATION

Inventor： Akito Itou ,  Junji Sugiura ,  Hirotsugu Kato

IPC: G01R31/02 ,  H05K1/18 ,  H05K1/02

CPC classification number: H05K1/181 ,  H05K1/0231 ,  H05K1/0262 ,  H05K2201/0746 ,  H05K2201/09972

Abstract: An electronic control device for executing fundamental and additional functions includes: a fundamental circuit element that executes the fundamental function; an additional circuit element that executes the additional function; and a printed wiring board having a rectangular shape divided into first and second regions. The fundamental circuit element is mounted in the first region, and the additional circuit element is mounted in the second region. The fundamental circuit element includes an operation voltage generating circuit for supplying an operation voltage to at least a part of the fundamental and additional circuit elements and a bypass capacitor for functioning for the additional circuit element. The bypass capacitor is connected to a power source wiring pattern for supplying the operation voltage to the additional circuit element. The bypass capacitor is arranged in the first region at a position nearer the second region than the operation voltage generating circuit.

Abstract translation: 用于执行基本和附加功能的电子控制装置包括：执行基本功能的基本电路元件; 执行附加功能的附加电路元件; 以及划分为第一和第二区域的具有矩形形状的印刷线路板。 基本电路元件安装在第一区域中，并且附加电路元件安装在第二区域中。 基本电路元件包括用于向至少一部分基波和附加电路元件提供操作电压的操作电压产生电路和用于附加电路元件的旁路电容器。 旁路电容器连接到用于向附加电路元件提供工作电压的电源布线图案。 旁路电容器布置在比操作电压产生电路更靠近第二区域的位置处的第一区域中。

公开(公告)号：US09398694B2

公开(公告)日：2016-07-19

申请号：US13348295

申请日：2012-01-11

Applicant: Thomas Merkle ,  Stefan Koch ,  Joo-Young Choi

Inventor： Thomas Merkle ,  Stefan Koch ,  Joo-Young Choi

IPC: H01L25/00 ,  H05K1/18 ,  H05K1/02 ,  H01L23/66 ,  H01L25/16 ,  H01L23/538 ,  H05K1/16 ,  H01L23/498

CPC classification number: H05K3/4697 ,  H01L23/49827 ,  H01L23/5389 ,  H01L23/66 ,  H01L25/16 ,  H01L2223/6616 ,  H01L2223/6633 ,  H01L2223/6677 ,  H01L2223/6683 ,  H01L2924/0002 ,  H05K1/0243 ,  H05K1/16 ,  H05K1/185 ,  H05K3/301 ,  H05K3/465 ,  H05K2201/0715 ,  H05K2201/0723 ,  H05K2201/09972 ,  H05K2201/09981 ,  H05K2203/1469 ,  H01L2924/00

Abstract: The present invention relates to the field of integrating electronic systems that operate at mm-wave and THz frequencies. A monolithic multichip package, a carrier structure for such a package as well as manufacturing methods for manufacturing such a package and such a carrier structure are proposed to obtain a package that fully shields different functions of the mm-wave/THz system. The package is poured into place by polymerizing photo sensitive monomers. It gradually grows around and above the MMICs (Monolithically Microwave Integrated Circuit) making connection to the MMICs but recessing the high frequency areas of the chip. The proposed approach leads to functional blocks that are electromagnetically completely shielded. These units can be combined and cascaded according to system needs.

Abstract translation: 本发明涉及以毫米波和太赫兹频率工作的集成电子系统的领域。 提出了一种单片多芯片封装，这种封装的载体结构以及用于制造这种封装和这种载体结构的制造方法，以获得完全屏蔽mm波/ THz系统的不同功能的封装。 通过聚合光敏单体将包装倒入适当位置。 它逐渐在MMIC（单片微波集成电路）之上和之上增长，连接到MMIC，但使芯片的高频区域变得困难。 所提出的方法导致电磁完全屏蔽的功能块。 这些单元可以根据系统需要进行组合和级联。

公开(公告)号：US09347631B2

公开(公告)日：2016-05-24

申请号：US14606013

申请日：2015-01-26

Applicant: ARKALUMEN INC.

Inventor： Gerald Edward Briggs

IPC: F21S9/00 ,  H01L33/48 ,  H05B37/02 ,  H05B33/08 ,  F21S4/00 ,  H01L25/075 ,  H05K1/05 ,  F21K99/00 ,  F21V23/00 ,  F21V23/04 ,  H01L33/62 ,  F21Y101/02 ,  F21Y105/00

CPC classification number: H05B33/0827 ,  F21K9/60 ,  F21K99/00 ,  F21S4/20 ,  F21V23/005 ,  F21V23/04 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/62 ,  H01L2924/0002 ,  H05B33/0803 ,  H05B33/0845 ,  H05B33/0857 ,  H05K1/05 ,  H05K2201/09309 ,  H05K2201/09972 ,  H05K2201/10106 ,  H01L2924/00

Abstract: A LED based lighting apparatus is disclosed. The light engine used in the lighting apparatus may use a multi-layer metal core printed circuit board and have a plurality of LED groups that are independently controllable by a control unit. The power supply input and return paths connected to each LED group may be implemented on different layers to allow a compact footprint that may be used with traditional fluorescent encasements with relatively little modification.

公开(公告)号：US20160044835A1

公开(公告)日：2016-02-11

申请号：US14813448

申请日：2015-07-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yong Won LEE ,  Hyun-Tae JANG ,  Jung Je BANG

IPC: H05K9/00 ,  H05K3/28 ,  H05K3/30 ,  H05K3/00 ,  H05K1/02 ,  H05K1/18

CPC classification number: H05K1/0216 ,  G06F1/18 ,  H05K1/181 ,  H05K9/0032 ,  H05K2201/09972 ,  H05K2201/10371

Abstract: A printed circuit board (PCB) assembly includes a PCB, electronic components mounted on the PCB, a shield can provided to block electromagnetic waves of the electronic components, and an insulating layer provided to prevent an electrical short between the electronic components and the shield can, and the insulating layer is sprayed and formed on the shield can. The insulating layer which is sprayed and formed on the shield can does not have an adhesive layer, and thus the thickness thereof can be remarkably reduced compared to insulating materials requiring an adhesive layer.

Abstract translation: 印刷电路板（PCB）组件包括PCB，安装在PCB上的电子部件，可以设置用于阻挡电子部件的电磁波的屏蔽罩，以及用于防止电子部件和屏蔽壳之间的电短路的绝缘层 并且绝缘层被喷涂并形成在屏蔽罐上。 在屏蔽罩上喷涂形成的绝缘层不具有粘合剂层，因此与需要粘合剂层的绝缘材料相比，其厚度可以显着降低。

公开(公告)号：US09253880B2

公开(公告)日：2016-02-02

申请号：US13689031

申请日：2012-11-29

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Mi Jin Park ,  Romero Christian ,  Seung Wook Park

IPC: H05K1/03 ,  H05K1/02 ,  H05K3/40 ,  H05K3/46

CPC classification number: H05K1/0298 ,  H01L2224/10 ,  H05K1/0237 ,  H05K3/4038 ,  H05K3/4644 ,  H05K2201/09681 ,  H05K2201/09972 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: Disclosed herein is a printed circuit board, including: a core layer; and a plurality of circuit layers stacked on the core layer, wherein one of the circuit layers includes a mesh pattern and a solid pattern, and another of the circuit layers include a first signal pattern opposite to the mesh pattern and a second signal pattern opposite to the solid pattern, the second signal pattern having a high-speed signal line with a higher speed, as compared with the second signal pattern.

Abstract translation: 这里公开了一种印刷电路板，包括：芯层; 以及堆叠在所述芯层上的多个电路层，其中所述电路层中的一个包括网格图案和固体图案，并且所述电路层中的另一个包括与所述网格图案相对的第一信号图案和与所述网格图案相对的第二信号图案 固体图案，第二信号图案具有与第二信号图案相比具有较高速度的高速信号线。

公开(公告)号：US09252132B2

公开(公告)日：2016-02-02

申请号：US14224166

申请日：2014-03-25

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Shigeru Tago ,  Noboru Kato

IPC: H01L23/02 ,  H01L25/065 ,  H01L23/498 ,  H01L23/538 ,  H01L23/00 ,  H01L23/48 ,  H05K1/18 ,  H01L23/31 ,  H01L23/525 ,  H01L23/528

CPC classification number: H01L25/0657 ,  H01L23/3114 ,  H01L23/481 ,  H01L23/49827 ,  H01L23/525 ,  H01L23/5286 ,  H01L23/5389 ,  H01L24/20 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/06182 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/19 ,  H01L2924/00013 ,  H01L2924/19105 ,  H05K1/185 ,  H05K2201/09972 ,  H01L2224/13099 ,  H01L2224/05099 ,  H01L2224/05599

Abstract: A semiconductor device includes an analog integrated circuit and a digital integrated circuit provided on a major surface of a substrate. An analog ground terminal is provided for the analog integrated circuit, and digital ground terminals are provided for the digital integrated circuit. An analog ground layer is stacked on the substrate so as to face the analog integrated circuit, and digital ground layers are stacked on the substrate so as to face the digital integrated circuit. The analog ground terminal is connected to the analog ground layer, and the digital ground terminals are connected to the digital ground layers, respectively.

Abstract translation: 半导体器件包括设置在基板的主表面上的模拟集成电路和数字集成电路。 为模拟集成电路提供模拟接地端子，为数字集成电路提供数字接地端子。 将模拟接地层堆叠在基板上以面向模拟集成电路，并且数字接地层堆叠在基板上以面对数字集成电路。 模拟接地端子连接到模拟接地层，数字接地端子分别连接到数字接地层。