公开(公告)号：US20240205530A1

公开(公告)日：2024-06-20

申请号：US18405268

申请日：2024-01-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sewon KIM

IPC: H04N23/57 ,  H05K1/18

CPC classification number: H04N23/57 ,  H05K1/183 ,  H05K2201/10015 ,  H05K2201/10151 ,  H05K2201/10636

Abstract: A camera module according to an embodiment of the present disclosure may comprise: a rigid printed circuit board (RPCB), a metal plate coupled to the lower surface of the RPCB and having one or more holes formed therein, a multi-layer ceramic condenser (MLCC) disposed in the one or more holes in the RPCB, and an image sensor disposed on the metal plate. With reference to the lower surface of the RPCB, the MLCC may be formed to have a height less than the height of the metal plate. A camera module structure according to an embodiment of the present disclosure may comprise: a flexible printed circuit board (FPCB), an RPCB coupled to the lower surface of the FPCB and having one or more first holes formed therein, a metal plate coupled to the lower surface of the RPCB and having one or more second holes formed in areas corresponding to the first holes, respectively, an MLCC disposed in the first holes and the second holes below the FPCB, and an image sensor disposed on the metal plate. The MLCC may be disposed in at least one of spaces formed through the first holes and the second holes. According to various embodiments of the present disclosure, a different camera module structure may be utilized such that no separate space is necessary to mount a laminated ceramic capacitor, and space utilization may be improved.

公开(公告)号：US12002626B2

公开(公告)日：2024-06-04

申请号：US17452046

申请日：2021-10-22

Applicant: Taiyo Yuden Co., Ltd.

Inventor： Hiroaki Sato

IPC: H01G4/012 ,  H01G4/12 ,  H01G4/248 ,  H01G4/30 ,  H05K1/18

CPC classification number: H01G4/30 ,  H01G4/012 ,  H01G4/12 ,  H01G4/248 ,  H05K1/181 ,  H05K2201/10015

Abstract: A multi-layer ceramic electronic component includes: a ceramic body including internal electrodes laminated in a first direction, a first main surface including a first flat region facing in the first direction, and a second main surface including a second flat region facing in the first direction; and a pair of external electrodes connected to the internal electrodes and facing each other in a second direction orthogonal to the first direction, a dimension of the ceramic body in the first direction being 1.1 times or more and 1.6 times or less a dimension of the ceramic body in a third direction orthogonal to the first and second directions, the first flat region being formed at a center portion of the first main surface in the second direction, the second flat region being formed at a center portion of the second main surface in the third direction.

公开(公告)号：US11990285B2

公开(公告)日：2024-05-21

申请号：US17438105

申请日：2020-02-19

Applicant: TAIYO YUDEN CO., LTD.

Inventor： Riki Suemasa ,  Takayuki Sekiguchi

IPC: H01G4/35 ,  H01G4/12 ,  H01G4/232 ,  H05K1/18 ,  H01G4/252 ,  H01G4/33

CPC classification number: H01G4/35 ,  H01G4/12 ,  H01G4/232 ,  H05K1/181 ,  H01G4/252 ,  H01G4/33 ,  H05K2201/10015

Abstract: A multi-terminal capacitor is provided that can be used either as a feedthrough capacitor or as a LW reversal capacitor. A multi-terminal capacitor includes a capacitor body shaped like a rectangular parallelepiped. The capacitor body includes a capacitance forming portion configured to form capacitance between a first conductor film and a second conductor film facing each other with a dielectric film being interposed therebetween. On one of the surfaces of the capacitor body in the third direction, first and second external terminals electrically connected to the first conductor film, and a third external terminal electrically connected to the second conductor film are provided. On the other of the surfaces of the capacitor body in the third direction, fourth and fifth external terminals electrically connected to the first conductor film and a sixth external terminal electrically connected to the second conductor film are provided.

公开(公告)号：US11985771B2

公开(公告)日：2024-05-14

申请号：US17325559

申请日：2021-05-20

Applicant: HYUNDAI MOBIS CO., LTD.

Inventor： Jeong Gyun Park

IPC: H05K5/00 ,  B60R21/01 ,  H05K5/06 ,  H05K1/18

CPC classification number: H05K5/006 ,  B60R21/01 ,  H05K5/0056 ,  H05K5/0069 ,  H05K5/066 ,  H05K1/18 ,  H05K2201/10015 ,  H05K2201/10151 ,  H05K2201/10189 ,  H05K2201/105

Abstract: The present invention relates to an airbag control unit including a housing that forms an enclosure and has an opening at an end thereof; a PCB that is coupled to the housing by coupling to a corner portion in the opening and an electrical connection structure in which a terminal pin is inserted into a terminal pin hole; and a cover provided in a shape covering the opening and includes an edge joined and fixed along an edge of the opening.

公开(公告)号：US20240138052A1

公开(公告)日：2024-04-25

申请号：US18483870

申请日：2023-10-09

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yoshihito OTSUBO

IPC: H05K1/02 ,  H01L23/367 ,  H01L25/10 ,  H01L25/16 ,  H05K1/14 ,  H05K1/18

CPC classification number: H05K1/0203 ,  H01L23/3675 ,  H01L25/105 ,  H01L25/162 ,  H05K1/144 ,  H05K1/181 ,  H01L2225/1094 ,  H05K2201/042 ,  H05K2201/10015 ,  H05K2201/1003 ,  H05K2201/10522 ,  H05K2201/10545 ,  H05K2201/1056

Abstract: A first sealing resin is disposed between a first lower main surface and a second upper main surface. An upper circuit board first mounting electrode is disposed on the first lower main surface. A lower circuit board first mounting electrode is disposed on the second upper main surface. A first component is mounted on the lower circuit board first mounting electrode and is disposed in the first sealing resin. A first conductor layer is disposed on an upper circuit board. As viewed in the downward direction, a heat conduction member overlaps the first component, is disposed in a space between the first lower main surface and the second upper main surface, and is coupled to the first conductor layer via a conductor. A part of a heat dissipation member is exposed from the first sealing resin in a direction orthogonal to an up-down axis.

公开(公告)号：US20240130046A1

公开(公告)日：2024-04-18

申请号：US18546526

申请日：2021-02-22

Applicant: Nippon Telegraph and Telephone Corporation

Inventor： Teruo Jo ,  Munehiko Nagatani ,  Hideyuki Nosaka

IPC: H05K1/18

CPC classification number: H05K1/185 ,  H01L28/86 ,  H05K2201/10015

Abstract: A capacitor includes a pair of facing stacked electrodes connected to an electrical wiring from the outside. The stacked electrode includes a plurality of wiring layers and a via layer between the wiring layers. The stacked electrode includes combs and a comb connection portion connected to base ends of the combs. A dielectric is provided between one stacked electrode and the other stacked electrode. The comb of the other stacked electrode is disposed between the combs of the one stacked electrode.

公开(公告)号：US11943869B2

公开(公告)日：2024-03-26

申请号：US17163648

申请日：2021-02-01

Applicant: KEMET Electronics Corporation

Inventor： Brandon Summey ,  Peter A. Blais ,  Robert Andrew Ramsbottom ,  Jeffrey Poltorak ,  Courtney Elliott

IPC: H05K1/11 ,  H01G9/045 ,  H05K1/03 ,  H05K1/18 ,  H05K3/30 ,  H05K3/46

CPC classification number: H05K1/185 ,  H01G9/045 ,  H05K1/0393 ,  H05K3/30 ,  H05K3/4697 ,  H05K2201/10015

Abstract: An improved circuit board core material, and method of making the circuit board core material, is provided wherein the circuit board core material is particularly suitable for use in a circuit board. The circuit board core material comprises a laminate. The laminate comprises a prepreg layer with a first clad layer on the prepreg layer wherein the prepreg layer comprises a pocket. An electronic component is in the pocket wherein the electronic component comprises a first external termination and a second external termination. The first external termination is laminated to, and in electrical contact with, the first clad layer and said second external termination is in electrical contact with a conductor.

公开(公告)号：US11942260B2

公开(公告)日：2024-03-26

申请号：US17672192

申请日：2022-02-15

Applicant: Delta Electronics, Inc.

Inventor： Yahong Xiong ,  Da Jin ,  Qinghua Su

IPC: H05K1/18 ,  G05F1/575 ,  G06F1/18 ,  H01F17/04 ,  H01F17/06 ,  H01F27/02 ,  H01F27/24 ,  H01F27/28 ,  H01F27/29 ,  H01L25/16 ,  H01R12/52 ,  H01R12/58 ,  H02M3/00 ,  H02M3/158 ,  H05K1/02 ,  H05K1/11 ,  H05K1/14 ,  H05K1/16 ,  H05K3/28 ,  H05K7/14 ,  H05K7/20

CPC classification number: H01F27/2804 ,  G05F1/575 ,  G06F1/183 ,  H01F17/04 ,  H01F17/06 ,  H01F27/02 ,  H01F27/24 ,  H01F27/292 ,  H01L25/16 ,  H01R12/52 ,  H01R12/58 ,  H02M3/003 ,  H02M3/1584 ,  H05K1/0203 ,  H05K1/111 ,  H05K1/117 ,  H05K1/145 ,  H05K1/165 ,  H05K1/181 ,  H05K1/186 ,  H05K3/284 ,  H05K7/1427 ,  H05K7/2089 ,  H05K2201/10015 ,  H05K2201/1003 ,  H05K2201/10053 ,  H05K2201/10166 ,  H05K2201/10522 ,  H05K2201/10636 ,  H05K2201/10734 ,  H05K2201/10984

Abstract: A power module includes a power circuit and a magnetic assembly. The power circuit includes at least one switch element. The magnetic assembly includes at least one first electrical conductor and a magnetic core module comprising at least one hole, wherein the at least one first electrical conductor passes through the at least one hole, and a terminal of the at least one first electrical conductor is electrically connected to the at least one switch element. The power circuit and the magnetic assembly are arranged in sequence along a same direction.

公开(公告)号：US20240049393A1

公开(公告)日：2024-02-08

申请号：US17886618

申请日：2022-08-12

Applicant: Mellanox Technologies, Ltd.

Inventor： Xiuzhuang Yang ,  Huiying Chen ,  Weibin He ,  Di Wu

IPC: H05K1/14 ,  H05K1/18 ,  H05K1/11 ,  H05K3/34

CPC classification number: H05K1/145 ,  H05K1/141 ,  H05K1/181 ,  H05K1/113 ,  H05K3/3442 ,  H05K2201/10015 ,  H05K2201/09672 ,  H05K2201/10606 ,  H05K2201/10515 ,  H05K2201/1053 ,  H01G4/385

Abstract: Electronic devices, electronic modules, and methods for manufacturing electronic devices and/or electronic modules are described herein. In some embodiments, the present invention may be directed to an electronic module that includes a pair of printed circuit boards (PCBs) and a capacitor positioned between the PCBs. Each of the PCBs may include a pair of vias configured to provide electrical connections through the PCB, and the capacitor may include a pair of pins. Each pin of the capacitor may be aligned with a via of one of the PCBs and a corresponding via of the other PCB such that each pin is configured to provide electrical connection between the two PCBs. Additionally, the pair of pins may be configured to support the PCBs with respect to each other.

公开(公告)号：US20240032198A1

公开(公告)日：2024-01-25

申请号：US17870063

申请日：2022-07-21

Applicant: Rockwell Collins, Inc.

Inventor： Martin J. Jennings ,  Justin R. Dewald

IPC: H05K1/18 ,  H05K1/11 ,  H05K1/02 ,  H05K3/32

CPC classification number: H05K1/181 ,  H05K1/111 ,  H05K1/0277 ,  H05K3/32 ,  H05K2201/10015 ,  H05K2201/10545

Abstract: A capacitor bank includes a printed circuit board adapted for a first capacitor disposed on a first surface of the printed circuit board and a second capacitor disposed on a second, opposing surface of the printed circuit board. The first and second capacitor are connected to the printed circuit board at surface mounts pads on opposing sides of the printed circuit board that may be in electronic communication with each other. The capacitors may be connected in series or parallel. Multiple printed circuit boards with capacitors on opposing surfaces may include flexible printed circuit board portions to allow the capacitor bank to be folded into an available space.