公开(公告)号：US08520392B2

公开(公告)日：2013-08-27

申请号：US12968610

申请日：2010-12-15

Applicant: Christian Johann ,  Matthias Roder ,  Ruediger Laubenstein

Inventor： Christian Johann ,  Matthias Roder ,  Ruediger Laubenstein

IPC: H05K7/20 ,  H05K1/00 ,  H05K1/16

CPC classification number: H05K1/189 ,  H05K2201/10113

Abstract: An electronic-control unit (7) includes a conductor board (12) made of a flexible substrate and defining at least one conducting path and cut (13) of the board (12). A basic body (11) is made of a thermally and electrically conductive material and thermally and electrically coupled to the board (12) and defines at least one elongated groove (15) that acts as a bending area (15) of the body (11) and expands over substantially an entire width of the body (11) in an aligned area of the cut (13) of the board (12) and a flat projection of the body (11) onto which the substrate is fastened. A basic-body-conductor-board unit is formed before the board (12) is assembled with at least one electronic component (16). The basic-body-conductor-board unit is re-shaped into a desired geometry after the assembly of the board (12) with the component (16). A method produces the basic-body-conductor-board unit.

Abstract translation: 电子控制单元（7）包括由柔性基板制成并限定板（12）的至少一个导电路径和切口（13）的导体板（12）。 基体（11）由导热导电材料制成并且热和电耦合到板（12）并且限定用作主体（11）的弯曲区域（15）的至少一个细长凹槽（15） ），并且在基板（12）的切口（13）的对准区域和主体（11）的平坦突起上基本上整个宽度上扩展，基板被紧固在该平坦突起上。 在基板（12）与至少一个电子部件（16）组装之前形成基体导体板单元。 在板（12）与组件（16）组装之后，基体导体板单元被重新成形为所需的几何形状。 一种方法产生基体导体板单元。

公开(公告)号：US20100055976A1

公开(公告)日：2010-03-04

申请号：US12548804

申请日：2009-08-27

Applicant: Yasuhiro OHMORI ,  Masahiko NAKAMURA

Inventor： Yasuhiro OHMORI ,  Masahiko NAKAMURA

IPC: H01R13/60

CPC classification number: H05K3/301 ,  F21V19/0085 ,  H01R9/15 ,  H01R33/0872 ,  H01R33/7692 ,  H05K2201/10113 ,  H05K2201/10598

Abstract: The present invention provides a connection structure of a circuit board and a connecting device of the present invention including: a connecting device electrically and mechanically connectable to an electronic component; and a circuit board having a surface to mount the connecting device thereon. The connecting device has a locking piece for attaching the connecting device to the surface of the circuit board. The circuit board has an elongated locking hole for receiving the locking piece. The locking piece is adapted to be locked at a lip of the locking hole by sliding or turning the locking piece in a predetermined direction inside the locking hole.

Abstract translation: 本发明提供了本发明的电路板和连接装置的连接结构，包括：电气和机械连接到电子部件的连接装置; 以及具有用于将连接装置安装在其上的表面的电路板。 连接装置具有用于将连接装置连接到电路板的表面的锁定片。 电路板具有用于接收锁定件的细长锁定孔。 锁定片适于通过沿锁定孔内的预定方向滑动或转动锁定片而锁定在锁定孔的唇缘处。

公开(公告)号：US20090159565A1

公开(公告)日：2009-06-25

申请号：US11962164

申请日：2007-12-21

Applicant: John B. Szczech ,  Daniel R. Gamota ,  Tomasz L. Klosowiak ,  Jerzy Wielgus

Inventor： John B. Szczech ,  Daniel R. Gamota ,  Tomasz L. Klosowiak ,  Jerzy Wielgus

IPC: B44C1/22

CPC classification number: H05K3/027 ,  H05K1/0393 ,  H05K3/16 ,  H05K2201/0116 ,  H05K2201/0317 ,  H05K2201/10113 ,  H05K2203/0557 ,  H05K2203/056

Abstract: A method for delineating a metallization pattern in a layer of sputtered aluminum or sputtered copper using a broad spectrum high intensity light source. The metal is deposited on a polymeric substrate by sputtering, so that it has a porous nanostructure. An opaque mask that is a positive representation of the desired metallization pattern is then situated over the metallization layer, exposing those portions of the metallization layer intended to be removed. The masked metallization layer is then exposed to a rapid burst of high intensity visible light from an arc source sufficient to cause complete removal of the exposed portions of the metallization layer, exposing the underlying substrate and creating the delineated pattern.

Abstract translation: 使用广谱高强度光源描绘溅射铝或溅射铜层中的金属化图案的方法。 通过溅射将金属沉积在聚合物基底上，使其具有多孔纳米结构。 然后将作为所需金属化图案的正表示的不透明掩模放置在金属化层上方，暴露预期要去除的金属化层的那些部分。 掩蔽的金属化层然后暴露于来自电弧源的高强度可见光的快速爆发，足以引起金属化层的暴露部分的完全去除，暴露下面的衬底并产生描绘图案。

公开(公告)号：US07462802B2

公开(公告)日：2008-12-09

申请号：US11356259

申请日：2006-02-17

Applicant: Yasuji Hiramatsu

Inventor： Yasuji Hiramatsu

IPC: B23K26/38 ,  B23K26/03

CPC classification number: B23K26/066 ,  B23K26/03 ,  B23K26/032 ,  B23K26/04 ,  B23K26/0622 ,  B23K26/064 ,  B23K26/0643 ,  B23K26/0648 ,  B23K26/0665 ,  B23K26/067 ,  B23K26/0673 ,  B23K26/08 ,  B23K26/082 ,  B23K26/0853 ,  B23K26/382 ,  B23K26/389 ,  B23K26/40 ,  B23K2101/42 ,  B23K2103/16 ,  B23K2103/42 ,  B23K2103/50 ,  H05K1/0269 ,  H05K3/0008 ,  H05K3/0026 ,  H05K3/0035 ,  H05K3/4644 ,  H05K3/4679 ,  H05K2201/09781 ,  H05K2201/09918 ,  H05K2201/10113

Abstract: There is provided a laser processing apparatus, a multilayer printed wiring board manufacturing apparatus, and a manufacturing method to form via holes of ultra-fine diameter. The laser beam from the CO2 laser oscillator (60) is converted to the shortened wavelength beam by a tellurium crystal (94) to control diffraction of the laser beam. Simultaneously, when the laser beam is condensed, a limit value of the condensation limit is reduced. Thereby, the spot diameter of laser beam is reduced and a hole for via hole is bored on the interlayer insulation resin on a substrate (10). Therefore, even when the laser beam output is raised to form a deeper hole, the hole diameter is not widened and thereby a hole for a small diameter via hole can be formed.

公开(公告)号：US20080214023A1

公开(公告)日：2008-09-04

申请号：US11919391

申请日：2006-04-27

Applicant: Stefan Hackenbuchner ,  Gunther Hirschmann

Inventor： Stefan Hackenbuchner ,  Gunther Hirschmann

IPC: H01R33/945

CPC classification number: H05K1/0256 ,  H01R33/945 ,  H05B41/02 ,  H05B41/042 ,  H05K2201/09063 ,  H05K2201/10113

Abstract: The invention relates to a lamp base (2) for a high-pressure discharge lamp with a printed circuit board (30) mounted inside and populated with electrical components and printed conductors (31) for electrically contacting the components. At least one electrical contact (33) is mounted on the printed circuit board (30) for current supply (16) to the lamp, and at least one partition (24, 25) is provided for electrical insulation between the at least one electrical contact (33) or current supply (16) and the printed conductors (31) on the printed circuit board (30).

Abstract translation: 本发明涉及一种用于高压放电灯的灯座（2），其具有安装在内部并装有电气部件的印刷电路板（30）和用于电接触部件的印刷导体（31）。 至少一个电触头（33）安装在印刷电路板（30）上用于向灯供电（16），并且提供至少一个隔板（24,25）用于在至少一个电触点 （33）或电流源（16）和印刷电路板（30）上的印刷导体（31）。

公开(公告)号：US20070002544A1

公开(公告)日：2007-01-04

申请号：US11170823

申请日：2005-06-30

Applicant: Brian Forbes ,  William Sanderson ,  Daniel Ragland ,  Tim Menard

Inventor： Brian Forbes ,  William Sanderson ,  Daniel Ragland ,  Tim Menard

IPC: H05K7/00

CPC classification number: H05K1/0269 ,  H05K3/4626 ,  H05K3/4688 ,  H05K2201/0108 ,  H05K2201/09936 ,  H05K2201/10113 ,  Y10T29/49126

Abstract: A method and apparatus include providing a printed circuit board (PCB) having at least one light permeable layer, at least one non-light permeable layer having at least one void therethrough that may be vertically aligned with the at least one light permeable layer, and a source of illumination to simultaneously illuminate through the void and the at least one light permeable layer.

Abstract translation: 一种方法和装置包括提供具有至少一个透光层的印刷电路板（PCB），至少一个不透光层，其具有至少一个空隙，其可以与至少一个透光层垂直对准，以及 照明源同时照亮空隙和至少一个透光层。

公开(公告)号：US5918966A

公开(公告)日：1999-07-06

申请号：US609072

申请日：1996-02-29

Applicant: Werner Arnold

Inventor： Werner Arnold

IPC: H01K1/26 ,  H05K3/30 ,  F21M7/00

CPC classification number: H05K3/306 ,  H01K1/26 ,  H05K2201/10113 ,  H05K2201/10568 ,  H05K2201/10651 ,  H05K2201/10878

Abstract: A light with a rubber-elastic cap, especially a colored silicone cap, particularly for attachment to printed circuit boards by soldering in the connecting wires of the light emerging from the bottom of the glass bulb, the silicone cap being provided with an edge thickening, which covers the lower section of the glass bulb and protrudes downward beyond the bottom of the glass bulb as installation edge, and the light connection wires being inclined and/or bent downward in such a manner that, after insertion in the boreholes of the printed circuit board, they brace the installation edge against the printed circuit board.

Abstract translation: 具有橡胶弹性帽，特别是彩色硅胶帽的灯，特别是通过焊接在从玻璃灯泡的底部出射的光的连接线中连接到印刷电路板，硅胶帽设置有边缘增厚， 其覆盖玻璃泡的下部并且作为安装边缘向下突出超过玻璃泡的底部，并且光连接线以下述方式倾斜和/或向下弯曲，使得在插入印刷电路的钻孔中之后 它们将安装边缘抵靠印刷电路板。

公开(公告)号：US5382874A

公开(公告)日：1995-01-17

申请号：US970767

申请日：1992-11-03

Applicant: Ralph E. Johnson

Inventor： Ralph E. Johnson

IPC: H01K1/46 ,  H01J5/54 ,  H01K1/32 ,  H01K5/02 ,  H01K7/04 ,  H05K3/30 ,  H05K3/34 ,  H01K1/42

CPC classification number: H05K3/3442 ,  H01J5/54 ,  H01K1/325 ,  H01K1/46 ,  H01K5/02 ,  H01K7/04 ,  H05K2201/10113 ,  H05K2201/10568 ,  H05K2201/10583 ,  H05K2201/10916 ,  H05K3/303 ,  Y02P70/613

Abstract: A surface mountable miniature incandescent lamp assembly has an elongated substantially cylindrical glass envelope wherein a filament is contained in contact with metal members having glass-to-metal seals with the glass envelope. A substantial portion of the outer surface of the glass envelope is coated with a light reflective metal coating, with a non-coated elongated window transparent to light being left on the surface. The metal members extend axially to the outside from the envelope and, when mounted to a circuit board provide electric contact for the lamp. At least one of the end members includes a unique surface feature, such as a flat portion of an otherwise cylindrical surface, which is directionally coupled relative to the window of the glass envelope and which acts as a key or indexing surface for mounting the lamp assembly to the receiving surface (circuit board) with the window disposed in the desired direction.

Abstract translation: 可表面安装的小型白炽灯组件具有细长的基本上圆柱形的玻璃外壳，其中灯丝包含与玻璃与金属密封件的金属部件接触。 玻璃外壳的外表面的主要部分涂覆有光反射金属涂层，其中未涂覆的细长窗口对于留在表面上的光而言是透明的。 金属构件从外壳轴向延伸到外部，并且当安装到电路板时为灯提供电接触。 至少一个端部构件包括独特的表面特征，例如其它圆柱形表面的平坦部分，其相对于玻璃外壳的窗口定向耦合，并且用作安装灯组件的键或分度表面 到达接收表面（电路板），窗口设置在所需方向。

公开(公告)号：US4669869A

公开(公告)日：1987-06-02

申请号：US147726

申请日：1980-05-08

Applicant: Donald F. Sullivan

Inventor： Donald F. Sullivan

IPC: G03F7/16 ,  G03F7/20 ,  H05K3/00 ,  H05K3/28 ,  G03B27/10

CPC classification number: H05K3/0082 ,  G03F7/16 ,  G03F7/2035 ,  H05K2201/10113 ,  H05K2203/056 ,  H05K2203/0759 ,  H05K2203/1121 ,  H05K3/0002 ,  H05K3/28

Abstract: Paste-consistency photopolymer is imaged onto printed wiring boards by coating the board overall and positioning the photographic film over the board in register and off-contact. A resilient blade is pressed against the phototool at one end of the board and drawn across the surface, thus forcing the photographic film into intimate contact with the photopolymer and purging all air therebetween. Mounted on the resilient blade aft of leading edge is a shuttered tubular lamp which hardens the photopolymer where the photographic film is clear, so that in a single pass the photographic film is sequentially mated and photopolymer exposed, to produce line widths unmatched by competing dry film systems and at speeds of 0.5 feet per second.

Abstract translation: 通过将印刷电路板整体涂布并将照相胶片定位在印刷电路板上，将粘合剂一致性光敏聚合物成像到印刷电路板上，并将其放置在非接触状态。 弹性叶片在板的一端被压靠在光学工具上并被拉过表面，从而迫使照相胶片与光聚合物紧密接触并清除其间的所有空气。 安装在弹性叶片的前缘的后方是一个快速的管状灯，其使感光聚合物硬化，其中照相胶片是透明的，使得在单次通过中，照相胶片依次配对和光聚合物曝光，以产生与竞争干膜无法比拟的线条宽度 系统，速度为0.5英尺/秒。

公开(公告)号：US4657839A

公开(公告)日：1987-04-14

申请号：US526455

申请日：1983-08-25

Applicant: Donald F. Sullivan

Inventor： Donald F. Sullivan

IPC: G03F7/16 ,  G03F7/20 ,  H05K3/00 ,  H05K3/28 ,  G03C1/74 ,  G03C5/16 ,  G03C9/00 ,  G03C11/12

CPC classification number: H05K3/0082 ,  G03F7/16 ,  G03F7/2035 ,  H05K2201/10113 ,  H05K2203/056 ,  H05K2203/0759 ,  H05K2203/1121 ,  H05K3/0002 ,  H05K3/28

Abstract: Improved resolution in a low cost non-critical photopolymer printing process is achieved by a non-volatile liquid image quality photopolymer layer disposed with air free surfaces sandwiched between two carrier surfaces, one being transparent and carrying a transparency image in contact with the liquid photopolymer to be exposed by radiation to cure the layer and produce the image pattern. In a typical example, paste-consistency photopolymer is imaged onto printed wiring boards by coating the board overall and positioning the photographic film over the board in register and off-contact. A resilient blade is pressed against the phototool at one end of the board and drawn across the surface, thus forcing the photographic film into intimate contact with the photopolymer and purging all air therebetween. Mounted on the resilient blade aft of leading edge is a shuttered tubular lamp which hardens the photopolymer where the photographic film is clear, so that in a single pass the photographic film is sequentially mated and photopolymer exposed, to produce line widths unmatched by competing dry film systems and at speeds of 0.5 feet per second. Film thicknesses from 0.006 mm to 0.05 mm can give resolutions for line widths and spacings as fine as 0.076 mm.

Abstract translation: 通过非易失性液体图像质量感光聚合物层实现了在低成本非关键光聚合物印刷方法中的改进的分辨率，该无色液体图像质量感光聚合物层设置有夹在两个载体表面之间的无空气表面，一个是透明的并且携带与液体光聚合物接触的透明图像 通过辐射暴露以固化层并产生图像图案。 在一个典型的例子中，通过将印刷电路板整体涂布并将照相胶片定位在印刷电路板上并进行脱离接触，将糊状稠度光敏聚合物成像到印刷电路板上。 弹性叶片在板的一端被压靠在光学工具上并被拉过表面，从而迫使照相胶片与光聚合物紧密接触并清除其间的所有空气。 安装在弹性叶片的前缘的后方是一个快速的管状灯，其使感光聚合物硬化，其中照相胶片是透明的，使得在单次通过中，照相胶片依次配对和光聚合物曝光，以产生与竞争干膜无法比拟的线条宽度 系统，速度为0.5英尺/秒。 薄膜厚度从0.006 mm到0.05 mm可以给出线宽和间距分辨率，精细到0.076 mm。