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    Board connector
    11.
    发明授权
    Board connector 有权
    板连接器

    公开(公告)号：US07467956B2

    公开(公告)日：2008-12-23

    申请号：US11663770

    申请日：2005-09-27

    Applicant: Hiroki Hirai ,  Kenji Okamura ,  Masahide Hio ,  Tetsuya Aihara ,  Hiroshi Nakano ,  Shigeki Shimada

    Inventor： Hiroki Hirai ,  Kenji Okamura ,  Masahide Hio ,  Tetsuya Aihara ,  Hiroshi Nakano ,  Shigeki Shimada

    IPC: H01R12/00

    CPC classification number: H05K3/3426 ,  H01R12/707 ,  H01R12/714 ,  H05K3/341 ,  H05K2201/10189 ,  H05K2201/1084 ,  Y02P70/613

    Abstract: A plurality of terminal fittings 11 are mounted to a housing 20, board connecting portions 13 having mounting portions 14 at lower ends protrude rearward, fixed fittings 30 having mounting plates 32 at lower edges are mounted to opposite side surfaces of the housing 20, and the mounting portion 14 of each terminal fitting 11 and the mounting plates 32 of the fixed fittings 30 are secured to a PCB 40 by reflow soldering. During the reflow soldering, a drawing force toward the PCB 40 acts on each of the terminal fittings 11 and the fixed fittings 30 based on surface tension of molten solder H, but the center of the fixed fitting 30 in the fore/aft direction of the board connecting portion 13 is positioned forward of the center of gravity position O of a connector 10, and rotation moment Mb toward the PCB 40 acts on the front of the housing 20 based on a drawing force Fb on the side of the fixed fitting 30 to prevent the front from being raised.

    Abstract translation: 多个端子配件11安装在壳体20上，具有下端的安装部分14的板连接部分13向后突出，在下边缘处具有安装板32的固定配件30安装在壳体20的相对侧表面上， 每个端子接头11的安装部分14和固定配件30的安装板32通过回流焊接固定到PCB40上。 在回流焊接期间，基于熔融焊料H的表面张力，朝向PCB 40的拉力作用在端子配件11和固定配件30中的每一个上，但固定配件30的中心在前后方向上 板连接部分13位于连接器10的重心位置O的前方，并且朝向PCB 40的转动力矩Mb基于固定配件30侧的拉拔力Fb作用在壳体20的前部上 防止前方被抬起。

    Power semiconductor module with flush terminal elements
    13.
    发明申请
    Power semiconductor module with flush terminal elements 有权
    具有齐平端子元件的功率半导体模块

    公开(公告)号：US20070235860A1

    公开(公告)日：2007-10-11

    申请号：US11403169

    申请日：2006-04-12

    Applicant: Jurgen Steger ,  Yvonne Manz

    Inventor： Jurgen Steger ,  Yvonne Manz

    IPC: H01L23/12 ,  H01L21/00

    CPC classification number: H01L25/072 ,  H01L23/492 ,  H01L23/49811 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48091 ,  H01L2224/49111 ,  H01L2924/00014 ,  H01L2924/19107 ,  H01L2924/30107 ,  H05K1/0306 ,  H05K1/142 ,  H05K3/0061 ,  H05K3/222 ,  H05K3/3426 ,  H05K2201/10818 ,  H05K2201/1084 ,  Y02P70/613 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

    Abstract: A power semiconductor module includes a housing, terminal elements leading to the outside of the housing, an electrically insulated substrate arranged inside the housing, with the substrate being comprised of an insulating body and having on the first main face facing away from the base plate a plurality of connecting tracks electrically insulated from each other. The terminal and connecting elements are arranged on a connecting track in with contact faces contacting connecting tracks or power semiconductor components, with the individual contact faces having a plurality of partial contact faces. In one optional embodiment, each partial contact face has a maximum area of 20 mm2. In another embodiment, partial contact faces each are arranged at a distance of approximately 5 mm with regard to each other and the connection of the partial faces to the connecting tracks or the power semiconductor components is flush.

    Abstract translation: 功率半导体模块包括壳体，通向壳体外部的端子元件，布置在壳体内部的电绝缘基板，其中基板由绝缘体构成，并且在第一主面上背离基板a 多个连接轨道彼此电绝缘。 端子和连接元件布置在连接轨道上，接触面接触连接轨道或功率半导体部件，各个接触面具有多个部分接触面。 在一个可选实施例中，每个部分接触面的最大面积为20mm 2。 在另一个实施例中，部分接触面各自相对于彼此以大约5mm的距离布置，并且部分面与连接轨道或功率半导体部件的连接是齐平的。

    Socket having a structure for grasping solder balls
    15.
    发明授权
    Socket having a structure for grasping solder balls 失效
    具有用于抓取焊球的结构的插座

    公开(公告)号：US07147489B1

    公开(公告)日：2006-12-12

    申请号：US11249857

    申请日：2005-10-12

    Applicant: Louie Lin

    Inventor： Louie Lin

    IPC: H01R12/00

    CPC classification number: H01R12/57 ,  H01R12/7076 ,  H01R43/0256 ,  H05K3/3426 ,  H05K7/1069 ,  H05K2201/10189 ,  H05K2201/1084 ,  H05K2201/10984 ,  H05K2203/041 ,  Y02P70/613

    Abstract: A socket having a structure for grasping solder balls is disclosed. A grasping hole is laterally defined in the solder joint of each terminal of the socket, and a stop wall is formed at the dielectric housing spaced from the grasping hole at a proper distance. The solder ball is secured between the stop wall and the solder joint with a portion of the solder ball being received in the grasping hole. The dimension of the grasping hole is slightly larger than that of a side surface of the solder ball received in the grasping hole, whereby the solder ball is freely movable up and down in the grasping hole of the solder joint. Therefore, when the socket is soldered to the circuit board, the solder balls can automatically fully contact the surface of the circuit board.

    Abstract translation: 公开了一种具有用于抓取焊球的结构的插座。 在插座的每个端子的焊接接头中横向限定抓握孔，并且在介电壳体处以适当的距离与抓握孔隔开形成止挡壁。 焊球固定在止动壁和焊点之间，焊球的一部分被容纳在把持孔中。 抓持孔的尺寸略大于接收在抓持孔中的焊球的侧面的尺寸，由此焊球可以在焊接接头的把持孔中上下自由移动。 因此，当插座焊接到电路板时，焊球可以自动完全接触电路板的表面。

    ELECTRICAL CONNECTOR TERMINAL AND METHOD OF PRODUCING SAME
    16.
    发明申请
    ELECTRICAL CONNECTOR TERMINAL AND METHOD OF PRODUCING SAME 审中-公开
    电气连接器端子及其制造方法

    公开(公告)号：US20060216970A1

    公开(公告)日：2006-09-28

    申请号：US10907297

    申请日：2005-03-28

    Applicant: Slobadan Pavlovic

    Inventor： Slobadan Pavlovic

    IPC: H05K1/00

    CPC classification number: H01R43/0256 ,  H01R4/023 ,  H01R13/41 ,  H05K3/3426 ,  H05K2201/10189 ,  H05K2201/10772 ,  H05K2201/1084 ,  Y02P70/613

    Abstract: A blade terminal for a surface mount electrical connector is provided. A first elongate member of a terminal body cooperates with a housing of the electrical connector to secure the terminal body to the connector housing. A second elongate member of the terminal body includes a curved portion having a hole therethrough. The curved portion includes a convex surface that facilitates automated assembly operations, and the aperture helps to overcome surface tension in liquid solder, thereby promoting a secure electrical connection.

    Abstract translation: 提供了一种用于表面安装电连接器的刀片端子。 终端主体的第一细长构件与电连接器的壳体协作以将终端主体固定到连接器壳体。 终端主体的第二细长构件包括具有穿过其中的孔的弯曲部分。 弯曲部分包括有助于自动组装操作的凸面，并且该孔有助于克服液体焊料中的表面张力，由此促进安全的电连接。

    Terminal for electrical connector
    17.
    发明申请
    Terminal for electrical connector 审中-公开
    电连接器端子

    公开(公告)号：US20050064745A1

    公开(公告)日：2005-03-24

    申请号：US10949997

    申请日：2004-09-23

    Applicant: Chi Zhang

    Inventor： Chi Zhang

    IPC: H01R4/02 ,  H01R12/00 ,  H01R12/55 ,  H01R13/405 ,  H01R43/16 ,  H05K3/34

    CPC classification number: H01R4/028 ,  H01R12/57 ,  H05K3/3426 ,  H05K2201/10189 ,  H05K2201/1084 ,  Y02P70/613

    Abstract: A terminal (1) for an electrical connector includes a flat soldering portion (11), a flexed portion (12) extending from the soldering portion, and a contacting portion (14) extending upwardly from the flexed portion. The soldering portion has a soldering face (111) and the connecting portion extends away from the soldering face. A rectangular overflowing aperture (120) extends through a centre of the flexed portion. Thus, the terminal is securely soldered on a printed circuit board to thereby achieve a reliable electrical connection between the terminal and the printed circuit board.

    Abstract translation: 用于电连接器的端子（1）包括平坦焊接部分（11），从焊接部分延伸的弯曲部分（12）和从弯曲部分向上延伸的接触部分（14）。 焊接部分具有焊接面（111），并且连接部分远离焊接面延伸。 矩形溢流孔（120）延伸穿过弯曲部分的中心。 因此，端子被牢固地焊接在印刷电路板上，从而在端子和印刷电路板之间实现可靠的电连接。

    Solder-bearing electromagnetic shield
    19.
    发明授权
    Solder-bearing electromagnetic shield 失效
    焊接电磁屏蔽

    公开(公告)号：US06796485B2

    公开(公告)日：2004-09-28

    申请号：US10341191

    申请日：2003-01-13

    Applicant: Jack Seidler

    Inventor： Jack Seidler

    IPC: B23K3512

    CPC classification number: H05K9/0028 ,  B23K1/0016 ,  B23K2101/40 ,  H05K3/341 ,  H05K2201/10371 ,  H05K2201/1084 ,  H05K2201/10984 ,  H05K2203/0415 ,  Y02P70/613

    Abstract: An electromagnetic shield is provided and includes a shield body having an upper wall connected to opposing side walls and opposing end walls. At least two opposing walls of the electromagnetic shield each have a plurality of resilient fingers formed at a lower edge thereof. The electromagnetic shield also includes a solder mass securely held by the fingers by being interleaved between the fingers of each of the at least two opposing walls. The interleaving of the solder mass results in the solder mass being securely held by the fingers and ready for mounting to an electronic component for shielding a portion of the electronic component from undesirable and potentially damaging emissions from neighboring components. A method of mounting an electromagnetic shield to an electronic component having a planar surface and a method of interleaving the solder mass are also provided.

    Abstract translation: 提供了一种电磁屏蔽，其包括屏蔽体，该屏蔽体具有连接到相对侧壁和相对端壁的上壁。 电磁屏蔽的至少两个相对的壁各自在其下边缘处形成有多个弹性指状物。 电磁屏蔽还包括通过在至少两个相对壁中的每一个的手指之间交错地由手指牢固地保持的焊料块。 焊料质量的交错导致焊料质量由手指牢固地保持，并且准备安装到电子部件上，用于屏蔽电子部件的一部分不受相邻部件的不期望的和潜在的破坏性的排放。 还提供了将电磁屏蔽件安装到具有平坦表面的电子部件和交错焊料块的方法。

    Surface mount power supplies for standard assembly process
    20.
    发明授权
    Surface mount power supplies for standard assembly process 有权
    表面贴装电源，用于标准组装工艺

    公开(公告)号：US06747875B2

    公开(公告)日：2004-06-08

    申请号：US09964130

    申请日：2001-09-25

    Applicant: Carl Milton Wildrick ,  Gordon K. Y. Lee

    Inventor： Carl Milton Wildrick ,  Gordon K. Y. Lee

    IPC: H05K114

    CPC classification number: H01R12/7088 ,  H05K1/165 ,  H05K3/3426 ,  H05K3/368 ,  H05K2201/10257 ,  H05K2201/1084 ,  Y02P70/613

    Abstract: This improved surface mount power supply can withstand the rigors of the manufacturing process and still create sturdy and robust connection to a user's circuit card. The open frame power module uses a U-shaped or T-shaped interconnect rather than a spherical interconnect. In one embodiment, the U-shaped interconnect can have a hole through one surface to allow the wicking of solder. The wicked solder provides a sturdier connection that is more likely to survive subsequent reflow processes. The power module is also built on a thicker FR4 board. The thicker board is less likely to warp during subsequent heating.

    Abstract translation: 这种改进的表面贴装电源可以承受制造过程的严格性，并且仍然可以创建与用户电路卡的坚固和牢固的连接。 开放式框架功率模块使用U形或T形互连，而不是球形互连。 在一个实施例中，U形互连可以具有穿过一个表面的孔，以允许焊料芯吸。 恶臭的焊料提供了更坚固的连接，更有可能在随后的回流工艺中生存。 电源模块也建在较厚的FR4板上。 较厚的板在随后的加热期间不太可能翘曲。

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