公开(公告)号：US20150348882A1

公开(公告)日：2015-12-03

申请号：US14727554

申请日：2015-06-01

Applicant: Infineon Technologies AG

Inventor： Alfred Swain Hong YEO

IPC: H01L23/495 ,  H05K1/18 ,  H01L21/56 ,  H01L23/31 ,  H01L25/16

CPC classification number: H01L23/49531 ,  H01L21/56 ,  H01L23/3107 ,  H01L23/495 ,  H01L23/49555 ,  H01L23/49589 ,  H01L25/16 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/181 ,  H05K1/18 ,  H05K3/3426 ,  H05K2201/10515 ,  H05K2201/10522 ,  H05K2201/1053 ,  H05K2201/10689 ,  H05K2201/10765 ,  H05K2201/10772 ,  H05K2201/10962 ,  Y02P70/613 ,  Y10T29/4913 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: An electronic device comprising a package comprising an encapsulated electronic chip, at least one at least partially exposed electrically conductive carrier lead for mounting the package on and electrically connecting the electronic chip to a carrier, and at least one at least partially exposed electrically conductive connection lead, and an electronic member stacked with the package so as to be mounted on and electrically connected to the package by the at least one connection lead.

Abstract translation: 一种包括封装的电子器件，包括封装的电子芯片，至少一个至少部分暴露的导电载体引线，用于将封装安装在电子芯片上并将其电连接到载体上;以及至少一个至少部分暴露的导电连接引线 以及与所述封装堆叠的电子部件，以通过所述至少一个连接引线安装在所述封装上并与所述封装电连接。

公开(公告)号：US20150194374A1

公开(公告)日：2015-07-09

申请号：US14590021

申请日：2015-01-06

Applicant: Iinfineon Technologies AG

Inventor： Sergey ANANIEV

IPC: H01L23/495 ,  H01L25/065 ,  H01L23/00 ,  H01L21/56 ,  H01L23/31

CPC classification number: H01L23/49575 ,  H01L23/3121 ,  H01L23/49555 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/50 ,  H01L24/73 ,  H01L2224/32013 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48096 ,  H01L2224/48101 ,  H01L2224/48106 ,  H01L2224/48145 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/13055 ,  H01L2924/181 ,  H05K3/3426 ,  H05K2201/10757 ,  H05K2201/10765 ,  H05K2201/10772 ,  Y02P70/613 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2924/00

Abstract: A package (120), wherein the package (120) has at least one electronic chip (124), an encapsulation body (138) that encapsulates the electronic chip(s) (124), and a plurality of terminal pins (122) to connect the electronic chip(s) (124), wherein each of the said terminal pins (122) has an encapsulated section (126), which is encapsulated at least partially by the encapsulation body (138) and has an exposed section (128) that protrudes from the encapsulation body (138), and wherein at least a portion of the exposed sections (128) laterally extends from the encapsulation body (138) up to a reversal point (130) and laterally extends back from the reversal point (130) to the encapsulation body (138), so that a free end (132) of the exposed sections (128) is laterally aligned with or to a corresponding side wall (134) of the encapsulation body (138) or is spaced from the corresponding side wall (134) of the encapsulation body (138) laterally outwardly.

Abstract translation: 一种封装（120），其中所述封装（120）具有至少一个电子芯片（124），封装所述电子芯片（124）的封装体（138），以及多个端子引脚（122）， 连接所述电子芯片（124），其中所述端子引脚（122）中的每一个具有封装部分（126），所述封装部分至少部分地由所述封装体（138）封装并具有暴露部分（128） 其从所述封装主体（138）突出，并且其中所述暴露部分（128）的至少一部分从所述封装体（138）横向延伸到反转点（130）并且横向从所述反转点（130）向后延伸 ），以使得暴露部分（128）的自由端（132）与封装主体（138）的相应侧壁（134）横向对准或者与相应的封闭主体（138）的相应侧壁（134）间隔开 封闭体（138）的侧壁（134）横向向外。

公开(公告)号：US08988857B2

公开(公告)日：2015-03-24

申请号：US13323916

申请日：2011-12-13

Applicant: John E. McConnell ,  Alan P. Webster ,  Lonnie G. Jones ,  Garry L. Renner ,  Jeffrey Bell

Inventor： John E. McConnell ,  Alan P. Webster ,  Lonnie G. Jones ,  Garry L. Renner ,  Jeffrey Bell

IPC: H01G2/20 ,  H01G4/06 ,  H01G4/228 ,  H01G4/30 ,  H05K3/30 ,  H01G4/38 ,  H01G2/06 ,  H01G4/232

CPC classification number: H01G4/232 ,  H01G2/06 ,  H01G4/12 ,  H01G4/30 ,  H01G4/38 ,  H05K3/303 ,  H05K2201/09063 ,  H05K2201/10515 ,  H05K2201/10772 ,  H05K2201/10856 ,  H05K2201/10878 ,  Y02P70/613 ,  Y10T29/49139 ,  Y10T29/49142

Abstract: An improved passive electronic stacked component is described. The component has a stack of individual electronic capacitors and a first lead attached to a first side of the stack. A second lead is attached to a second side of the stack. A foot is attached to the first lead and extends inward towards the second lead. A stability pin is attached to one of the foot or the first lead.

Abstract translation: 描述了改进的无源电子堆叠部件。 该组件具有堆叠的单个电子电容器和附接到堆叠的第一侧的第一引线。 第二引线连接到堆叠的第二侧。 脚连接到第一引线并向内延伸到第二引线。 稳定销连接到脚或第一引线之一。

公开(公告)号：US20140185214A1

公开(公告)日：2014-07-03

申请号：US13731127

申请日：2012-12-31

Applicant: Zhen Jia

Inventor： Zhen Jia

IPC: H05K7/20 ,  H05K3/34 ,  G06F1/18

CPC classification number: H05K7/20127 ,  G06F1/185 ,  G06F1/188 ,  H05K1/141 ,  H05K1/144 ,  H05K1/181 ,  H05K3/368 ,  H05K2201/042 ,  H05K2201/10772 ,  H05K2201/10946 ,  Y10T29/49144

Abstract: Disclosed are a method, system, and/or apparatus to stack a processor power module on a populated printed circuit board. A stacked processor power module includes a bare printed circuit board comprising a top surface and a bottom surface. The stacked processor power module also includes a first pair of metal lead legs coupled to an upper region of the bottom surface of the bare printed circuit board and a second pair of metal lead legs coupled to a lower region of the bottom surface of the bare printed circuit board. An integrated circuit board assembly includes a populated printed circuit board having a mounting region upon which to stack the stacked processor power module above the mounting region of the populated printed circuit board by coupling the first pair of metal lead legs and the second pair of metal lead legs to the mounting region.

Abstract translation: 公开了一种在填充的印刷电路板上堆叠处理器电源模块的方法，系统和/或装置。 堆叠的处理器电源模块包括裸露的印刷电路板，其包括顶表面和底表面。 堆叠的处理器功率模块还包括耦合到裸露印刷电路板的底表面的上部区域的第一对金属引线脚和耦合到裸露印刷电路板的底部表面的下部区域的第二对金属引脚 电路板。 集成电路板组件包括具有安装区域的填充印刷电路板，在该安装区域上，通过将第一对金属引线脚和第二对金属引线耦合在堆叠的处理器电源模块上而在堆叠的印刷电路板的安装区域上方 腿到安装区域。

公开(公告)号：US20070117453A1

公开(公告)日：2007-05-24

申请号：US11624409

申请日：2007-01-18

Applicant: Slobadan Pavlovic

Inventor： Slobadan Pavlovic

IPC: H01R13/66

CPC classification number: H01R43/0256 ,  H01R4/023 ,  H01R13/41 ,  H05K3/3426 ,  H05K2201/10189 ,  H05K2201/10772 ,  H05K2201/1084 ,  Y02P70/613

Abstract: A surface mount electrical connector includes a terminal body having a first elongate member that cooperates with a housing to secure the terminal body to the connector housing. A second elongate member of the terminal body includes a curved portion having an aperture therethrough. The curved portion includes a convex surface that facilitates automated assembly operations, and the aperture helps to overcome surface tension in liquid solder, thereby promoting a secure electrical connection.

Abstract translation: 表面安装电连接器包括终端主体，其具有与壳体配合的第一细长构件，以将终端主体固定到连接器壳体。 终端主体的第二细长构件包括具有穿过其中的孔的弯曲部分。 弯曲部分包括有助于自动组装操作的凸面，并且该孔有助于克服液体焊料中的表面张力，由此促进安全的电连接。

公开(公告)号：US20050012187A1

公开(公告)日：2005-01-20

申请号：US10892483

申请日：2004-07-16

Applicant: Koujiro Kameyama ,  Kiyoshi Mita

Inventor： Koujiro Kameyama ,  Kiyoshi Mita

IPC: H01L23/12 ,  H01L21/68 ,  H01L23/31 ,  H01L23/48 ,  H01L23/495 ,  H05K3/34 ,  H01L21/48 ,  H01L31/11

CPC classification number: H01L21/6835 ,  H01L21/78 ,  H01L23/3107 ,  H01L23/49548 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2221/68331 ,  H01L2224/32245 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/10253 ,  H01L2924/181 ,  H05K3/3426 ,  H05K3/3442 ,  H05K2201/09154 ,  H05K2201/10772 ,  H05K2201/10931 ,  Y02P70/613 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A semiconductor device comprises a semiconductor element and electrodes electrically connected to the semiconductor element, the semiconductor element and the electrodes being sealed by a sealing agent having an insulating property, the electrodes being exposed around a mounting surface that is joined via a joining agent to an external mounting circuit board, wherein the electrodes are shaped so that the joining agent is visually identifiable from side surfaces surrounding the mounting surface when the mounting surface is joined via the joining agent to the mounting circuit board.

Abstract translation: 半导体器件包括半导体元件和电连接到半导体元件的电极，半导体元件和电极被具有绝缘性能的密封剂密封，电极暴露在通过接合剂连接到安装表面上 外部安装电路板，其中电极被成形为使得当安装表面经由接合剂连接到安装电路板时，接合剂可以从围绕安装表面的侧表面可视地识别。

公开(公告)号：US20030098339A1

公开(公告)日：2003-05-29

申请号：US10340798

申请日：2003-01-13

Inventor： Makoto Totani ,  Toshihiro Miyake ,  Tomohiro Yokochi ,  Takehito Teramae ,  Yoshitaro Yazaki ,  Kazuyuki Deguchi ,  Hajime Nakagawa

IPC: B23K001/00 ,  B23K031/00 ,  B23K031/02

CPC classification number: H05K3/363 ,  H05K3/3452 ,  H05K3/3494 ,  H05K2201/0129 ,  H05K2201/091 ,  H05K2201/0989 ,  H05K2201/09909 ,  H05K2201/10772 ,  H05K2203/0195 ,  H05K2203/0278 ,  H05K2203/065

Abstract: Lands formed on a flexible printed circuit board are electrically connected with lands formed on a rigid printed circuit board through solder. At this point, solder resist is formed between neighboring two lands on the rigid printed circuit board, and is terminated with an end portion that is interposed between the rigid printed circuit board and the flexible printed circuit board. Accordingly, even when surplus solder is extruded onto the rigid printed circuit board, the solder resist can prevent solder bridges from being formed between the lands.

Abstract translation: 形成在柔性印刷电路板上的焊盘通过焊料与刚性印刷电路板上形成的焊盘电连接。 此时，在刚性印刷电路板上的相邻的两个焊盘之间形成阻焊剂，并且端接有刚性印刷电路板和柔性印刷电路板之间的端部。 因此，即使剩余焊料被挤出到刚性印刷电路板上，阻焊剂也可以防止在焊盘之间形成焊料桥。

公开(公告)号：US6159045A

公开(公告)日：2000-12-12

申请号：US173377

申请日：1998-10-15

Applicant: Brian R. Vicich

Inventor： Brian R. Vicich

IPC: H01R12/55 ,  H01R13/73 ,  H05K3/34 ,  H02B1/01

CPC classification number: H05K3/3447 ,  H01R12/707 ,  H05K2201/09045 ,  H05K2201/10189 ,  H05K2201/10568 ,  H05K2201/10598 ,  H05K2201/10772

Abstract: A method and apparatus for engaging electrical components to a circuit board. The body of the component has at least one fastener integrally formed therewith. The at least one fastener includes a neck portion engaged to the body of the component and extending to a hook portion. The fastener is configured to reside substantially within a through-hole formed in a circuit board. The through-hole in the circuit board has a solder lining, and the fastener is placed into the through-hole. The solder is reflowed via known soldering techniques so that the hook portion of the fastener is engaged by the reflowed solder, thus engaging the component to the circuit board.

Abstract translation: 一种用于将电气部件接合到电路板的方法和装置。 该部件的主体具有与其一体形成的至少一个紧固件。 所述至少一个紧固件包括接合到所述部件的主体并延伸到钩部的颈部。 紧固件构造成基本上位于形成在电路板中的通孔内。 电路板中的通孔具有焊接衬垫，并且紧固件被放置在通孔中。 焊料通过已知的焊接技术回流，使得紧固件的钩部分被回流的焊料接合，从而将部件接合到电路板。

公开(公告)号：US5688150A

公开(公告)日：1997-11-18

申请号：US512508

申请日：1995-08-08

Applicant: Jack Seidler ,  Leonard J. Pollock

Inventor： Jack Seidler ,  Leonard J. Pollock

IPC: H01R4/02 ,  H01R43/02 ,  H05K3/34

CPC classification number: H01R12/57 ,  H01R43/0256 ,  H05K3/3405 ,  H05K3/3426 ,  H01R4/02 ,  H05K2201/10386 ,  H05K2201/10772 ,  H05K2201/10984 ,  H05K3/3478 ,  Y02P70/613

Abstract: A solder-bearing metallic lead, and methods of fabricating and using it, where the lead is formed with a solder-retaining portion having a cross-sectional profile with undercuts, which may be in a V-shape or flat, where solder surrounds said solder-retaining portion and undercuts, and extends outwardly from the lead while leaving a portion of the lead uncovered by solder to permit the lead metal to form direct contact with a substrate or other conductive pad.

Abstract translation: 一种含焊料的金属引线及其制造和使用方法，其中引线形成有焊料保持部分，该焊料保持部分具有可以为V形或扁平的底切的截面轮廓，其中焊料围绕所述 焊料保持部分和底切部分，并且从引线向外延伸，同时留下未被焊料覆盖的引线的一部分，以允许引线金属与衬底或其它导电焊盘形成直接接触。

公开(公告)号：US5351393A

公开(公告)日：1994-10-04

申请号：US913880

申请日：1992-07-15

Applicant: George D. Gregoire

Inventor： George D. Gregoire

IPC: H01L23/495 ,  H05K1/14 ,  H05K3/34 ,  H05K3/36

CPC classification number: H05K3/3426 ,  H01L23/49555 ,  H05K1/141 ,  H01L2924/0002 ,  H05K2201/049 ,  H05K2201/09472 ,  H05K2201/10303 ,  H05K2201/10689 ,  H05K2201/10704 ,  H05K2201/10772 ,  H05K2201/10818 ,  H05K3/368 ,  Y02P70/613 ,  Y10T29/49135 ,  Y10T29/4914

Abstract: A surface-mount integrated circuit converter board assembly having a pin grid array arranged enables a conventional surface-mount lead device to be mounted for subsequent attachment to a printed circuit board. The converter board assembly includes an array of spaced apart pins, arranged in rows and columns for mounting, and a plurality of spaced apart pin pads connected thereto. The pin pads are sufficiently spaced apart to avoid interference. A set of surface-mount lead pads is part of the converter board and is interconnected to the array of pins by a plurality of lead traces. The method of making the converter board with a surface-mount integrated circuit device includes forming or reforming the leads of the device to align with the surface-mount pads.

Abstract translation: 具有布置的引脚格栅阵列的表面贴装集成电路转换器板组件能够安装常规的表面安装引线装置以便随后附接到印刷电路板。 转换器板组件包括排列成行和列的用于安装的间隔开的销的阵列，以及与之连接的多个间隔开的销垫。 引脚垫足够间隔开以避免干扰。 一组表面安装引线焊盘是转换器板的一部分，并通过多个引线与引脚阵列互连。 制造具有表面贴装集成电路器件的转换器板的方法包括将器件的引线形成或重整以与表面安装焊盘对准。