公开(公告)号：US06976881B2

公开(公告)日：2005-12-20

申请号：US11001445

申请日：2004-11-30

Applicant: David L. Brunker ,  Daniel L. Dawiedczyk ,  John E. Lopata ,  Arindum Dutta

Inventor： David L. Brunker ,  Daniel L. Dawiedczyk ,  John E. Lopata ,  Arindum Dutta

IPC: H01B11/00 ,  H01P1/02 ,  H01P3/02 ,  H01R9/03 ,  H01R12/50 ,  H01R12/71 ,  H01R12/79 ,  H01R13/648 ,  H05K1/00 ,  H05K1/02 ,  H05K1/14 ,  H05K3/10 ,  H05K3/40 ,  H01R23/70

CPC classification number: H05K1/024 ,  H01P3/02 ,  H01R12/716 ,  H01R12/79 ,  H01R13/658 ,  H05K1/0284 ,  H05K1/145 ,  H05K3/107 ,  H05K3/403 ,  H05K2201/09036 ,  H05K2201/09118 ,  H05K2201/09236 ,  H05K2201/09645 ,  H05K2201/09981 ,  H05K2201/10189 ,  H05K2201/10893

Abstract: Termination assemblies for terminating high-frequency data signal transmission lines include housings with one or more cavities that receive ends of the transmission line therein. The transmission line typically includes a dielectric body and a plurality of conductive elements disposed thereon, with the plurality of conductive elements being arranged in pairs for differential signal transmission. The termination assemblies, in one embodiment include hollow end caps that are formed from a dielectric and which have one or more conductive contacts or plated surfaces disposed on or within the cavity so that they will frictionally mate with the conductive traces on the transmission line. In another embodiment, a connector housing is provided with a center slot and a plurality of dual loop contacts to provide redundant circuit paths and low inductance to the termination assembly. A coupling element may be utilized in the slot to achieve a desired level of coupling between the termination contacts.

公开(公告)号：US20050250387A1

公开(公告)日：2005-11-10

申请号：US11182988

申请日：2005-07-15

Applicant: David Brunker ,  Daniel Dawiedczyk ,  John Lopata ,  Arindum Dutta

Inventor： David Brunker ,  Daniel Dawiedczyk ,  John Lopata ,  Arindum Dutta

IPC: H01B11/00 ,  H01P1/02 ,  H01P3/02 ,  H01R9/03 ,  H01R12/50 ,  H01R12/71 ,  H01R12/79 ,  H01R13/648 ,  H05K1/00 ,  H05K1/02 ,  H05K1/14 ,  H05K3/10 ,  H05K3/40 ,  H01B11/02

CPC classification number: H05K1/024 ,  H01P3/02 ,  H01R12/716 ,  H01R12/79 ,  H01R13/658 ,  H05K1/0284 ,  H05K1/145 ,  H05K3/107 ,  H05K3/403 ,  H05K2201/09036 ,  H05K2201/09118 ,  H05K2201/09236 ,  H05K2201/09645 ,  H05K2201/09981 ,  H05K2201/10189 ,  H05K2201/10893

Abstract: Termination assemblies for terminating high-frequency data signal transmission lines include housings with one or more cavities that receive ends of the transmission line therein. The transmission line typically includes a dielectric body and a plurality of conductive elements disposed thereon, with the plurality of conductive elements being arranged in pairs for differential signal transmission. The termination assemblies, in one embodiment include hollow end caps that are formed from a dielectric and which have one or more conductive contacts or plated surfaces disposed on or within the cavity so that they will frictionally mate with the conductive traces on the transmission line. In another embodiment, a connector housing is provided with a center slot and a plurality of dual loop contacts to provide redundant circuit paths and low inductance to the termination assembly. A coupling element may be utilized in the slot to achieve a desired level of coupling between the termination contacts.

Abstract translation: 用于终止高频数据信号传输线路的终端组件包括具有一个或多个腔体的壳体，该腔体容纳传输线路的端部。 传输线通常包括绝缘体和设置在其上的多个导电元件，多个导电元件成对布置以用于差分信号传输。 终端组件在一个实施例中包括由电介质形成并且具有一个或多个导电触点或设置在空腔中或腔内的电镀表面的空心端盖，使得它们将与传输线上的导电迹线摩擦配合。 在另一个实施例中，连接器壳体设置有中心狭槽和多个双环触点，以向终端组件提供冗余电路路径和低电感。 可以在槽中使用耦合元件以实现端接触点之间期望的耦合水平。

公开(公告)号：US20050092513A1

公开(公告)日：2005-05-05

申请号：US11001445

申请日：2004-11-30

Applicant: David Brunker ,  Daniel Dawiedczyk ,  John Lopata ,  Arindum Dutta

Inventor： David Brunker ,  Daniel Dawiedczyk ,  John Lopata ,  Arindum Dutta

IPC: H01B11/00 ,  H01P1/02 ,  H01P3/02 ,  H01R9/03 ,  H01R12/50 ,  H01R12/71 ,  H01R12/79 ,  H01R13/648 ,  H05K1/00 ,  H05K1/02 ,  H05K1/14 ,  H05K3/10 ,  H05K3/40 ,  H01B9/02

CPC classification number: H05K1/024 ,  H01P3/02 ,  H01R12/716 ,  H01R12/79 ,  H01R13/658 ,  H05K1/0284 ,  H05K1/145 ,  H05K3/107 ,  H05K3/403 ,  H05K2201/09036 ,  H05K2201/09118 ,  H05K2201/09236 ,  H05K2201/09645 ,  H05K2201/09981 ,  H05K2201/10189 ,  H05K2201/10893

Abstract: Termination assemblies for terminating high-frequency data signal transmission lines include housings with one or more cavities that receive ends of the transmission line therein. The transmission line typically includes a dielectric body and a plurality of conductive elements disposed thereon, with the plurality of conductive elements being arranged in pairs for differential signal transmission. The termination assemblies, in one embodiment include hollow end caps that are formed from a dielectric and which have one or more conductive contacts or plated surfaces disposed on or within the cavity so that they will frictionally mate with the conductive traces on the transmission line. In another embodiment, a connector housing is provided with a center slot and a plurality of dual loop contacts to provide redundant circuit paths and low inductance to the termination assembly. A coupling element may be utilized in the slot to achieve a desired level of coupling between the termination contacts.

Abstract translation: 用于终止高频数据信号传输线路的终端组件包括具有一个或多个腔体的壳体，该腔体容纳传输线路的端部。 传输线通常包括绝缘体和设置在其上的多个导电元件，多个导电元件成对布置以用于差分信号传输。 终端组件在一个实施例中包括由电介质形成并且具有一个或多个导电触点或设置在空腔中或腔内的电镀表面的空心端盖，使得它们将与传输线上的导电迹线摩擦配合。 在另一个实施例中，连接器壳体设置有中心狭槽和多个双环触点，以向终端组件提供冗余电路路径和低电感。 可以在槽中使用耦合元件以实现端接触点之间期望的耦合水平。

公开(公告)号：US20040173894A1

公开(公告)日：2004-09-09

申请号：US09966841

申请日：2001-09-27

Applicant: Amkor Technology, Inc.

Inventor： Mr. Thomas P. Glenn ,  Mr. Steven Webster

IPC: H01L023/48

CPC classification number: H01L23/49811 ,  H01L23/13 ,  H01L23/3121 ,  H01L23/50 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L25/105 ,  H01L2224/05554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10162 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H05K1/119 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2201/10378 ,  H05K2201/10893 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599

Abstract: Abstract of the Disclosure FileNameFileName-33-Integrated circuit packages including interconnection posts with multiple metal terminals are disclosed. An exemplary package includes a molded plastic body with integral plastic posts extending from the body. Each post is coated with a plurality of electrically separate metal terminals. The metal terminals extend from a surface of the body, along a sidewall of a respective post, to an end of the post. An integrated circuit is mounted on the body. Conductive paths, which may include vias through the body, electrically couple different bond pads of the integrated circuit to the metal terminals of the posts. In some embodiments, posts on opposing sides of the plastic body enable stacking, and electrical coupling, of two or more packages. The metal terminals of posts of the lower package may be engaged with the metal terminals of corresponding posts on a mounting substrate.

Abstract translation: 公开文献摘要FileNameFileName-33-公开了包括具有多个金属端子的互连柱的集成电路封装。 示例性包装包括具有从主体延伸的整体塑料柱的模制塑料体。 每个柱涂覆有多个电分离的金属端子。 金属端子从主体的表面沿相应柱的侧壁延伸到柱的端部。 集成电路安装在主体上。 导电路径可以包括通过本体的通孔，将集成电路的不同接合焊盘电耦合到柱的金属端子。 在一些实施例中，塑料体的相对侧上的柱可实现两个或多个包装的堆叠和电耦合。 下部封装的柱的金属端子可以与安装基板上的相应柱的金属端子接合。

公开(公告)号：US20040113711A1

公开(公告)日：2004-06-17

申请号：US10330910

申请日：2002-12-27

Inventor： David L. Brunker ,  Daniel L. Dawiedczyk ,  John E. Lopata ,  Arindum Dutta

IPC: H01P003/02

CPC classification number: H05K1/024 ,  H01P3/02 ,  H01R12/716 ,  H01R12/79 ,  H01R13/658 ,  H05K1/0284 ,  H05K1/145 ,  H05K3/107 ,  H05K3/403 ,  H05K2201/09036 ,  H05K2201/09118 ,  H05K2201/09236 ,  H05K2201/09645 ,  H05K2201/09981 ,  H05K2201/10189 ,  H05K2201/10893

Abstract: An engineered transmission line for transmitting high-frequency data signal s between two points of connection includes a dielectric body and a plurality of conductive elements disposed thereon, with the plurality of conductive elements being arranged in pairs for differential signal transmission. In one embodiment, the dielectric body is solid and has its conductive elements supported on its exterior surface. In another embodiment, the dielectric body is extruded and has grooves or raised lands formed therein. The grooves or lands support conductive elements formed thereon by a suitable plating process. A ground plane may be provided as a base layer of the dielectric body.

Abstract translation: 用于在两个连接点之间传输高频数据信号s的工程传输线包括介电体和设置在其上的多个导电元件，其中多个导电元件成对设置用于差分信号传输。 在一个实施例中，电介质体是固体并且其导电元件被支撑在其外表面上。 在另一个实施例中，电介质体被挤出并且在其中形成有凹槽或凸起的焊盘。 凹槽或平台通过合适的电镀工艺支撑在其上形成的导电元件。 可以提供接地平面作为电介质体的基层。

公开(公告)号：US20030179050A1

公开(公告)日：2003-09-25

申请号：US10330909

申请日：2002-12-27

Inventor： David L. Brunker ,  Daniel L. Dawiedczyk ,  John E. Lopata ,  Arindum Dutta

IPC: H01P003/04

CPC classification number: H05K1/024 ,  H01P3/02 ,  H01R12/716 ,  H01R12/79 ,  H01R13/658 ,  H05K1/0284 ,  H05K1/145 ,  H05K3/107 ,  H05K3/403 ,  H05K2201/09036 ,  H05K2201/09118 ,  H05K2201/09236 ,  H05K2201/09645 ,  H05K2201/09981 ,  H05K2201/10189 ,  H05K2201/10893

Abstract: An engineered transmission line for transmitting high-frequency data signal s between two points of connection includes a dielectric body and a plurality of conductive elements disposed thereon, with the plurality of conductive elements being arranged in pairs for differential signal transmission. In one embodiment, the dielectric body is solid and has its conductive elements supported on its exterior surface. In another embodiment, the dielectric body is extruded and has grooves or raised lands formed therein. The grooves or lands support conductive elements formed thereon by a suitable plating process. A ground plane may be provided as a base layer of the dielectric body. Enlarged conductive surfaces may also be provided on the body which have a greater surface area than those intended for use with the signal channels. The enlarged surfaces are utilized to carry power.

Abstract translation: 用于在两个连接点之间传输高频数据信号s的工程传输线包括介电体和设置在其上的多个导电元件，其中多个导电元件成对设置用于差分信号传输。 在一个实施例中，电介质体是固体并且其导电元件被支撑在其外表面上。 在另一个实施例中，电介质体被挤出并且在其中形成有凹槽或凸起的焊盘。 凹槽或平台通过合适的电镀工艺支撑在其上形成的导电元件。 可以提供接地平面作为电介质体的基层。 放大的导电表面也可以设置在主体上，其具有比用于信号通道的表面积更大的表面积。 放大的表面用于承载电力。

公开(公告)号：US06514090B1

公开(公告)日：2003-02-04

申请号：US09069700

申请日：1998-04-29

Applicant: Dan M. Neal ,  Paul Clouser

Inventor： Dan M. Neal ,  Paul Clouser

IPC: H01R1200

CPC classification number: H05K1/115 ,  G06F13/409 ,  H01R12/58 ,  H05K1/0237 ,  H05K2201/09645 ,  H05K2201/10893 ,  Y10S439/931

Abstract: The present invention relates to an apparatus and method for enhancing the differential signaling speed performance of a PCI bus within a data processing system. In particular it involves the connectors employed with PCI bus architecture. The present invention involves providing improved connectors employed in a PCI bus architecture. These are Split Pin and Split Via connectors which provide significantly higher frequency and higher frequency capability to the board level.

Abstract translation: 本发明涉及用于增强数据处理系统内PCI总线差分信号速度性能的装置和方法。 特别涉及PCI总线架构所使用的连接器。 本发明涉及提供在PCI总线架构中使用的改进的连接器。 这些是Split Pin和Split Via连接器，它们为电路板级提供了更高的频率和更高的频率能力。

公开(公告)号：US4654472A

公开(公告)日：1987-03-31

申请号：US682558

申请日：1984-12-17

Applicant: Samuel Goldfarb

Inventor： Samuel Goldfarb

IPC: H01L23/055 ,  H01L23/49 ,  H05K3/30 ,  H05K3/34 ,  H05K5/00

CPC classification number: H01L24/48 ,  H01L23/055 ,  H05K3/308 ,  H05K3/3426 ,  H01L2223/6622 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/4823 ,  H01L2224/484 ,  H01L2224/49171 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/3025 ,  H05K2201/09645 ,  H05K2201/10689 ,  H05K2201/10704 ,  H05K2201/10893 ,  Y02P70/613 ,  Y10S439/931

Abstract: An improved electronic component or integrated circuit (IC) package characterized by an extraordinary small size for the number of input-output (I/O) leads which are available and capable of use on surface mounted, Flat Pack, hybrid, or through hole (DIP) printed circuit boards. The package has one or more cylindrical or shaped forms at the base, with a flange to provide a stop in order to limit the insertion travel in those circuit boards having through holes, and a top body which is used to house the electronic device. The forms, which protrude down from the upper body (housing), have one or more conductive lead segments, either pins or printed circuit types, running longitudinally and continuing through the housing to the upper body.Each lead segment is connected directly to the electronic device or attached via an additonal lead to a pad on the electronic device, mounted on the upper body. A cover to seal the device is provided. Grooves in the body or on the cover aid in handling the device, either manually or by automatic machinery, are provided. These grooves also provide gripping areas for top hat heat sinks.

Abstract translation: 一种改进的电子部件或集成电路（IC）封装，其特征在于具有非常小的尺寸，用于输入输出（I / O）引线的数量，其可用并且能够用于表面安装，平板封装，混合或通孔（ DIP）印刷电路板。 该包装在基座处具有一个或多个圆柱形或成形形状，具有凸缘以提供止挡件，以限制具有通孔的那些电路板中的插入行程，以及用于容纳电子装置的顶体。 从上体（壳体）向下突出的形式具有一个或多个导电引线段，即引脚或印刷电路类型，其纵向延伸并且通过外壳继续到上体。 每个引线段直接连接到电子设备，或者通过附加引线连接到安装在上部主体上的电子设备上的焊盘。 提供密封装置的盖子。 提供身体或护罩上的沟槽，手动或自动机械处理设备。 这些凹槽还为顶帽散热片提供抓握区域。

公开(公告)号：US20230380053A1

公开(公告)日：2023-11-23

申请号：US18134082

申请日：2023-04-13

Applicant: CHIPBOND TECHNOLOGY CORPORATION

Inventor： Chun-Te Lee ,  Chih-Ming Peng ,  Pi-Yu Peng ,  Hui-Yu Huang

IPC: H05K1/02 ,  H01L21/60 ,  H05K3/00 ,  H05K1/03

CPC classification number: H05K1/0266 ,  H01L21/60 ,  H05K3/0044 ,  H05K1/03 ,  H01L2021/60022 ,  H05K2201/10893

Abstract: A flip-chip bonding structure includes a chip and a circuit board, the chip is bonded to the circuit board by bumps. The circuit board includes a light-transmissive substrate, a first circuit group, a second circuit group, a boundary circuit and an identifying member. The boundary circuit is located between the first and second circuit groups and projects a boundary circuit shadow on light-transmissive substrate. The boundary circuit shadow can be recognized according to the identifying member and is provided to identify the boundary between the first and second circuit groups or identify the position of leads with the smallest pitch.

公开(公告)号：US20110233907A1

公开(公告)日：2011-09-29

申请号：US13120294

申请日：2009-07-29

Applicant: Michael Struchholz ,  Tristan Jobert ,  Klaus Offterdinger ,  Thomas Klaus ,  Dirk Dittmann

Inventor： Michael Struchholz ,  Tristan Jobert ,  Klaus Offterdinger ,  Thomas Klaus ,  Dirk Dittmann

IPC: B60R21/16 ,  H05K5/00

CPC classification number: H01L23/495 ,  G01L19/0084 ,  H01L23/49558 ,  H01L2924/0002 ,  H05K3/303 ,  H05K3/3426 ,  H05K2201/09781 ,  H05K2201/10151 ,  H05K2201/10689 ,  H05K2201/10893 ,  Y02P70/613 ,  H01L2924/00

Abstract: A housing for an electrical circuit, in particular for a sensor, pins projecting from the housing for the electrical contacting of the circuit, additional pins being provided which are not connected electrically to the circuit but instead are used as mechanical arrangement for fastening the housing to a printed circuit board in particular. The present invention further relates to a housing having an electrical circuit, in particular a sensor, pins projecting from the housing for the electrical contacting of the circuit, at least two pins being connected to one another mechanically via a connecting piece.

Abstract translation: 一种用于电路的壳体，特别是用于传感器的，用于电路接触的外壳突出的销，提供了未与电路电连接的另外的引脚，而是用作用于将壳体紧固到 特别是印刷电路板。 本发明还涉及一种具有电路的壳体，特别是传感器，用于电路的电接触从外壳突出的销，至少两个销通过连接件彼此机械连接。