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    Method for the production of planar structures
    191.
    发明授权
    Method for the production of planar structures 有权
    平面结构生产方法

    公开(公告)号：US08003537B2

    公开(公告)日：2011-08-23

    申请号：US11779794

    申请日：2007-07-18

    Applicant: Xavier Rottenberg ,  Phillip Ekkels ,  Hendrikus Tilmans ,  Walter De Raedt

    Inventor： Xavier Rottenberg ,  Phillip Ekkels ,  Hendrikus Tilmans ,  Walter De Raedt

    IPC: H01L21/302

    CPC classification number: B81C1/00611 ,  B81B2201/0271 ,  B81C2201/0123

    Abstract: A method for the production of a planar structure is disclosed. The method comprises producing on a substrate a plurality of structures of substantially equal height, and there being a space in between the plurality of structures. The method further comprises providing a fill layer of electromagnetic radiation curable material substantially filling the space between the structures. The method further comprises illuminating a portion of the fill layer with electromagnetic radiation, hereby producing a exposed portion and an unexposed portion, the portions being separated by an interface substantially parallel with the first main surface of the substrate. The method further comprises removing the portion above the interface.

    Abstract translation: 公开了一种制造平面结构的方法。 该方法包括在基板上制造具有大致相同高度的多个结构，并且在多个结构之间存在空间。 该方法还包括提供基本上填充结构之间的空间的电磁辐射可固化材料的填充层。 该方法还包括用电磁辐射照射填充层的一部分，从而产生暴露部分和未曝光部分，该部分被基本平行于基底的第一主表面的界面分开。 该方法还包括去除界面上方的部分。

    Surface mounted crystal resonator
    192.
    发明申请
    Surface mounted crystal resonator 有权
    表面安装晶体谐振器

    公开(公告)号：US20110156529A1

    公开(公告)日：2011-06-30

    申请号：US12928775

    申请日：2010-12-17

    Applicant: Hiroki Iwai

    Inventor： Hiroki Iwai

    IPC: H02N11/00

    CPC classification number: H03H9/21 ,  B81B3/0072 ,  B81B2201/0271 ,  H03H9/0523 ,  H03H9/1035

    Abstract: An object of the invention is to provide a surface mounted resonator that improves impact resistance by the shape of a mounting terminal provided on an outside bottom face of a stacked resonator. A surface mounted crystal resonator is provided with a plurality of mounting terminals electrically connected to a hermetically sealed crystal piece at both ends of an outside bottom face having a rectangular shape long in the lengthwise direction, the mounting terminals having the same external dimensions with a total dimension of the mounting terminals in a lengthwise direction of the outside bottom face being 70% or more [but less than 100%] of a dimension in the lengthwise direction of the outside bottom face. Respective facing sides of the mounting terminals facing each other in a central area of the outside bottom face are formed curved in a convex shape such that a curvature thereof decreases gradually.

    Abstract translation: 本发明的目的是提供一种表面安装的谐振器，其通过设置在层叠谐振器的外底面上的安装端子的形状来改善耐冲击性。 表面安装的晶体谐振器设置有多个安装端子，其电连接到在长度方向上具有长方形的外部底面的两端处的气密密封的水晶片，所述安装端子具有相同的外部尺寸，总共具有 安装端子在外底面的长度方向上的尺寸在外底面的长度方向上的尺寸为70％以上（但小于100％）。 安装端子在外底面的中心区域彼此面对的相对侧形成为弯曲成凸起的形状，使得其曲率逐渐减小。

    LOW TEMPERATURE CERAMIC MICROELECTROMECHANICAL STRUCTURES
    193.
    发明申请
    LOW TEMPERATURE CERAMIC MICROELECTROMECHANICAL STRUCTURES 有权
    低温陶瓷微电子结构

    公开(公告)号：US20110111545A1

    公开(公告)日：2011-05-12

    申请号：US13003328

    申请日：2009-07-08

    Applicant: Mourad El-Gamal

    Inventor： Mourad El-Gamal

    IPC: H01L21/02

    CPC classification number: B81C1/00666 ,  B81B3/0021 ,  B81B7/008 ,  B81B2201/01 ,  B81B2201/0235 ,  B81B2201/0271 ,  B81B2201/03 ,  B81B2207/015 ,  B81B2207/03 ,  B81C1/00063 ,  B81C1/00246 ,  B81C1/00396 ,  B81C1/00587 ,  B81C2201/014 ,  B81C2201/0169 ,  B81C2201/0174 ,  B81C2203/0721 ,  B81C2203/0735

    Abstract: A method of providing microelectromechanical structures (MEMS) that are compatible with silicon CMOS electronics is provided. The method providing for processes and manufacturing sequences limiting the maximum exposure of an integrated circuit upon which the MEMS is manufactured to below 350° C., and potentially to below 250° C., thereby allowing direct manufacturing of the MEMS devices onto electronics, such as Si CMOS circuits. The method further providing for the provisioning of MEMS devices with multiple non-conductive structural layers such as silicon carbide separated with small lateral gaps. Such silicon carbide structures offering enhanced material properties, increased environmental and chemical resilience whilst also allowing novel designs to be implemented taking advantage of the non-conductive material of the structural layer. The use of silicon carbide being beneficial within the formation of MEMS elements such as motors, gears, rotors, translation drives, etc where increased hardness reduces wear of such elements during operation.

    Abstract translation: 提供了一种提供与硅CMOS电子器件兼容的微机电结构（MEMS）的方法。 该方法提供了将MEMS制造的集成电路的最大曝光限制在低于350℃并可能低于250℃的工艺和制造顺序，从而允许将MEMS器件直接制造到电子器件上，例如 作为Si CMOS电路。 该方法进一步提供具有多个非导电结构层的MEMS器件，例如用小的侧向间隙分离的碳化硅。 这种碳化硅结构提供增强的材料性能，增加环境和化学弹性，同时还允许利用结构层的非导电材料来实现新颖的设计。 在形成MEMS元件（例如马达，齿轮，转子，平移驱动器等）中使用碳化硅是有益的，其中增加的硬度降低了操作期间这些元件的磨损。

    Micro electro-mechanical system and method of manufacturing the same
    197.
    发明授权
    Micro electro-mechanical system and method of manufacturing the same 有权
    微机电系统及其制造方法

    公开(公告)号：US07829365B2

    公开(公告)日：2010-11-09

    申请号：US11976678

    申请日：2007-10-26

    Applicant: Makiko Nakamura

    Inventor： Makiko Nakamura

    IPC: H01L21/00

    CPC classification number: B81C1/00944 ,  B81B2201/0271 ,  B81B2203/0118 ,  B81B2203/04 ,  B81C2201/112 ,  H01L28/40 ,  H03H3/0077 ,  H03H9/2457 ,  H03H2009/02496

    Abstract: A micro electro-mechanical system, which can be stably formed so as to prevent sticking of a movable part and which has a narrow gap, and a method of manufacturing the same are provided. The micro electro-mechanical system includes at least one fixed electrode formed above a principal surface of a semiconductor substrate and at least one movable electrode formed on the principal surface. The at least one movable electrode includes the movable part separated from the principal surface and the at least one fixed electrode. The movable part is movable with respect to the principal surface and the at least one fixed electrode. The method of manufacturing the micro electro-mechanical system includes a sacrifical film formation step for forming a sacrifical film above the principal surface, an electrode layer formation step for forming an electrode layer above the principal surface so as to cover over the sacrifical film, an etching step for partially etching the electrode layer via a pattern so as to form the at least one electrode and the at least one fixed electrode, a sacrifical film removal step for removing the sacrifical film, and a conducting film formation step for forming a conducting film on surfaces of the at least one electrode and the at least one fixed electrode.

    Abstract translation: 提供一种可以稳定地形成以防止可动部分的粘附并且具有窄间隙的微机电系统及其制造方法。 微电子机械系统包括形成在半导体衬底的主表面上的至少一个固定电极和形成在主表面上的至少一个可移动电极。 所述至少一个可移动电极包括从所述主表面和所述至少一个固定电极分离的可移动部件。 可移动部分可相对于主表面和至少一个固定电极移动。 微机电系统的制造方法包括在主表面上形成牺牲膜的牺牲膜形成工序，在主表面上形成覆盖牺牲膜的电极层的电极层形成工序， 用于通过图案部分地蚀刻电极层以形成至少一个电极和至少一个固定电极的蚀刻步骤，用于去除牺牲膜的牺牲膜去除步骤以及用于形成导电膜的导电膜形成步骤 在所述至少一个电极和所述至少一个固定电极的表面上。

    MEMS resonator structure and method
    200.
    发明授权
    MEMS resonator structure and method 有权
    MEMS谐振器结构及方法

    公开(公告)号：US07777596B2

    公开(公告)日：2010-08-17

    申请号：US12002936

    申请日：2007-12-18

    Applicant: Markus Lutz ,  Zhiyu Pan ,  Aaron Partridge

    Inventor： Markus Lutz ,  Zhiyu Pan ,  Aaron Partridge

    IPC: H03H9/02 ,  H03H9/24

    CPC classification number: H03H9/02244 ,  B81B3/007 ,  B81B3/0072 ,  B81B2201/0271 ,  B81B2203/0109 ,  B81B2203/0163 ,  H03H3/0076 ,  H03H9/02338 ,  H03H2009/0233 ,  H03H2009/02496 ,  H03H2009/02503

    Abstract: A microelectromechanical resonator may include one or more resonator masses that oscillates in a bulk mode and that includes a first plurality of regions each having a density, and a second plurality of regions each having a density, the density of each of the second plurality of regions differing from the density of each of the first plurality of regions. The second plurality of regions may be disposed in a non-uniform arrangement. The oscillation may include a first state in which the resonator mass is contracted, at least in part, in a first and/or a second direction, and expanded, at least in part, in a third and/or a fourth direction, the second direction being opposite the first direction, the fourth direction being opposite the third direction.

    Abstract translation: 微机电谐振器可以包括以体模式振荡的一个或多个谐振器质量块，并且其包括每个具有密度的第一多个区域和每个具有密度的第二多个区域，第二多个区域中的每个第二多个区域的密度 不同于第一多个区域中的每一个的密度。 第二多个区域可以以非均匀的布置设置。 振荡可以包括其中谐振器质量至少部分地以第一和/或第二方向收缩并且至少部分地在第三和/或第四方向上膨胀的第一状态，第二状态 方向与第一方向相反，第四方向与第三方向相反。

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