Abstract:
There has been a trade-off between the rigidity and the mass of a movable section of a microactuator, and also between the rigidity of the movable section and the electrostatic force. A microactuator 100 includes: a base 1; a first comb electrode 2 supported by the base 1; a movable section 6 having a second comb electrode 8 opposing the first comb electrode 2, and at least one reinforcement rib 9 protruding toward the base 1; and an elastic supporting member 3 for supporting the movable section 6 so as to allow the movable section 6 to be displaced with respect to the base 1. The height of the second comb electrode 8 is different from the height of the at least one reinforcement rib 9.
Abstract:
A vertical comb electro-static actuator for rotating a micro-electro-mechanical micro-mirror device about a tilt axis or rotation. The rotor comb fingers of the comb drive extend from a sub-frame of the micro-mirror, which includes a prestressed layer for bending the rotor comb fingers at an angle to the substrate and mirrored platform, enabling the platform, the hinges, the rotor comb fingers and the stator comb fingers to be formed in the same layer, i.e. the same etching step.
Abstract:
A micro-electro-mechanical system (MEMS) micro mirror and a method of making the same. The micro mirror includes a body having a mirror support, opposed anchor s and flexible hinges which connect the mirror support to the anchor s. The mirror support has opposed comb edges with comb fingers. Electrodes, which have comb fingers to interact with the comb fingers of the mirror support, are spaced from the comb edges. The comb fingers along each of the comb edges of the mirror support surface are positioned on different horizontal planes from and the comb fingers on the electrodes so as to maximize electrostatic actuation.
Abstract:
A micro oscillating device includes a frame, an oscillating part including a first drive electrode for application of a reference electric potential, and a connecting part for connecting the frame and the oscillating part to each other, where the connecting part defines an axis of an oscillating motion of the oscillating part. A second drive electrode is fixed to the frame to cooperate with the first drive electrode for generation of a driving force for the oscillating movement. The first drive electrode includes a first end extension and a second end extension separated from each other and extending in a direction crossing the axis. The second drive electrode is within a separation distance between the first and the second end extensions.
Abstract:
A process for fabricating a micro-electro-mechanical system (MEMS) composed of fixed components fixedly supported on a lower substrate and movable components movably supported on the lower substrate. The process utilizes an upper substrate separate from the lower substrate. The upper substrate is selectively etched in its top layer to form therein a plurality of posts which project commonly from a bottom layer of the upper substrate. The posts include the fixed components to be fixed to the lower substrate and the movable components which are resiliently supported only to one or more of the fixed components to be movable relative to the fixed components. The lower substrate is formed in its top surface with at least one recess. The upper substrate is then bonded to the top of the lower substrate upside down in such a manner as to place the fixed components directly on the lower substrate and to place the movable components upwardly of the recess. Finally, the bottom layer of the upper substrate is removed to release the movable components from the bottom layer for floating the movable components above the recess and allowing them to move relative to the lower substrate, while keeping the fixed components fixed to the top of the lower substrate.
Abstract:
A method for manufacturing a micro-electro-mechanical device, which has supporting parts and operative parts, includes providing a first semiconductor wafer, having a first layer of semiconductor material and a second layer of semiconductor material arranged on top of the first layer, forming first supporting parts and first operative parts of the device in the second layer, forming temporary anchors in the first layer, and bonding the first wafer to a second wafer, with the second layer facing the second wafer. After bonding the first wafer and the second wafer together, second supporting parts and second operative parts of said device are formed in the first layer. The temporary anchors are removed from the first layer to free the operative parts formed therein.
Abstract:
A microelectromechanical system (MEMS) device with a mechanism layer having a first part and a second part, and at least one cover for sealing the mechanism layer. The inner surface of at least one of the covers is structured such that a protruding structure is present on the inner surface of the cover and wherein the protruding structure mechanically causes the first part to be deflected out of a plane associated with the second part.
Abstract:
A double-sided etching method using an embedded alignment mark includes: preparing a substrate having first and second alignment marks embedded in an intermediate portion thereof; etching an upper portion of the substrate so as to expose the first alignment mark from a first surface of the substrate; etching the upper portion of the substrate using the exposed first alignment mark; etching a lower portion of the substrate so as to expose the second alignment mark from a second surface of the substrate; and etching the lower portion of the substrate using the exposed second alignment mark.
Abstract:
A support structure extends upwards from a substrate and supports a tiltable platform, the upper surface of which can be a mirror, by means of spaced flexible couplings that enable the platform to tilt relative to the support structure. Respective electrodes associated with the substrate and platform control the platform tilt in response to applied signals. The platform electrodes are preferably spaced below and tilt with the platform, with the platform extending laterally from the support structure further than the platform electrodes. The platform is preferably bulk micromachined, and the support structure surface micromachined.
Abstract:
A micro-oscillating element includes a frame, a movable functional portion, and a torsional joint for joining the frame and the functional portion. The micro-oscillating element also includes first and second comb-tooth electrodes for generation of the driving force for the oscillating motion of the movable functional portion about the torsional joint. The first comb-tooth electrode includes a plurality of first electrode teeth each having a first conductor, an insulator and a second conductor laminated in the direction of the oscillating motion, where the first conductor and the second conductor are electrically connected with each other. The second comb-tooth electrode includes a plurality of second electrode teeth caused not to face the second conductor but to face the first conductor of the first electrode teeth during non-operation. The second electrode teeth are longer than the first conductor in the direction of the oscillating motion.