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公开(公告)号：US09814137B2
公开(公告)日：2017-11-07
申请号：US15135638
申请日：2016-04-22
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Ryota Asai
CPC classification number: H05K1/115 , H05K1/0298 , H05K1/0306 , H05K1/038 , H05K1/09 , H05K3/108 , H05K3/244 , H05K3/28 , H05K2201/0145 , H05K2201/0195 , H05K2201/0338 , H05K2201/0391 , H05K2201/099 , H05K2201/09909
Abstract: A wiring board is provided with: an insulating layer; a base electrode layer layered on one primary surface of the insulating layer in predetermined regions; an insulating covering layer layered on one primary surface of the insulating layer in a state covering parts of edges of the base electrode layer; and a surface electrode layer plated on exposed portions of the base electrode layer not covered by the insulating covering layer, the thickness of covered portions of the base electrode layer covered by the insulating covering layer being less than the thickness of the exposed portions. The surface electrode layer is formed only on the exposed portions of the base electrode layer.
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公开(公告)号：US09795035B2
公开(公告)日：2017-10-17
申请号：US15356852
申请日：2016-11-21
Inventor： Jonathan Douglas Hatch , Stephen McGarry Hatch
CPC classification number: H05K1/0306 , H05K1/02 , H05K1/028 , H05K1/0393 , H05K1/115 , H05K1/144 , H05K3/0023 , H05K3/0064 , H05K3/007 , H05K3/048 , H05K3/103 , H05K3/125 , H05K3/386 , H05K3/389 , H05K3/4611 , H05K3/4644 , H05K2201/0145 , H05K2201/0154 , H05K2201/05 , H05K2201/09009 , H05K2203/0152
Abstract: A PCB page blank includes a flexible substrate, a curable adhesive, a conductive layer, and a conductive layer support. The flexible substrate receives an opaque negative circuit pattern thereon. Portions of the curable adhesive not obscured by the circuit pattern may bond to portions of the conductive layer when exposed to light. The bonded portions of the conductive layer shear or tear from non-bonded portions of the conductive layer such that the bonded portions remain with the flexible substrate and the non-bonded portions remain with the conductive layer support when the flexible substrate and the conductive layer support are separated. The flexible substrate and the bonded portions of the conductive layer thus form a PCB prototype with the bonded portions of the conductive layer forming circuit traces of the circuit pattern.
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公开(公告)号：US20170267824A1
公开(公告)日：2017-09-21
申请号：US15430611
申请日：2017-02-13
Applicant: Ticona LLC
Inventor： Young Shin Kim
CPC classification number: C08J5/24 , C08J5/043 , C08J2367/02 , C08J2367/04 , H05K1/0366 , H05K1/0373 , H05K3/4676 , H05K2201/0145 , H05K2201/0209 , H05K2203/125
Abstract: A prepreg composite that comprises a fibrous substrate and polymer composition impregnated within the substrate is provided. The substrate has a thickness of from about 5 to about 500 micrometers and contains glass fibers. The polymer composition includes a crosslinked thermoset aromatic polyester. The aromatic polyester includes repeating units derived from an aromatic hydroxycarboxylic acid, aromatic dicarboxycarboxylic acid, aromatic diol, aromatic amide, aromatic amine, or a combination thereof.
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公开(公告)号：US09757049B2
公开(公告)日：2017-09-12
申请号：US14458736
申请日：2014-08-13
Applicant: Samsung Electronics Co., Ltd.
Inventor： Sang Yun Park , Byung Hoon Ko
IPC: A61B5/0408 , A61B5/0478 , A61B5/0492 , A61B5/04 , H05K1/11 , A61B5/00
CPC classification number: A61B5/04087 , A61B5/04 , A61B5/0478 , A61B5/0492 , A61B5/6832 , H05K1/115 , H05K1/118 , H05K2201/0145 , H05K2201/0329
Abstract: An electrode, a biosignal detecting device and a method of measuring a biosignal are provided. The electrode includes an ion conductive member configured to be attached to a body surface, a nonconductive member including a through hole and disposed on the ion conductive member, a conductive member disposed on the nonconductive member, and a nonpolarizable conductive member configured to electrically couple the ion conductive member to the conductive member.
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公开(公告)号：US20170209093A1
公开(公告)日：2017-07-27
申请号：US15225845
申请日：2016-08-02
Applicant: Far Eastern New Century Corporation
Inventor： Min-Si YAN , Wei-Che HUNG , Yueh-Hsien LIN , Chih-Ting LI
CPC classification number: A61B5/6804 , A41D1/002 , A41D31/00 , A61B5/11 , A61B5/1114 , A61B5/1116 , A61B5/1118 , A61B5/1121 , A63B24/0062 , G06F1/163 , H05K1/038 , H05K1/092 , H05K2201/0145 , H05K2201/0162
Abstract: A wearable action-aware device is disclosed. The wearable action-aware device includes a clothing body, a signal receiving and computing element, and a conductive line made of conductive fabric. Two ends of the conductive line are electrically connected to the signal receiving and computing element, respectively, to form a circuit, and both the signal receiving and computing element and the conductive line are disposed on the clothing body. An exposed side of the conductive line has electrical conductivity, and the circuit is disposed on a part of the clothing body corresponding to a part of a body that needs to be measured. Action information of a user can be measured when the user wears the present invention wearable action-aware device.
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Patent Agency Ranking
公开(公告)号：US20170200694A1
公开(公告)日：2017-07-13
申请号：US15427875
申请日：2017-02-08
Applicant: AUTOMATED ASSEMBLY CORPORATION
Inventor： Robert Neuman
IPC: H01L23/00 , H01L21/56 , H01L21/48 , H01L23/498 , H01L23/31
CPC classification number: H05K3/32 , H01L21/4846 , H01L21/4853 , H01L21/56 , H01L21/563 , H01L23/3135 , H01L23/3157 , H01L23/4985 , H01L23/49883 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L24/85 , H01L24/92 , H01L33/486 , H01L33/54 , H01L33/62 , H01L2224/32225 , H01L2224/45147 , H01L2224/48106 , H01L2224/48225 , H01L2224/48227 , H01L2224/73265 , H01L2224/8385 , H01L2224/85201 , H01L2224/85423 , H01L2224/85447 , H01L2224/85801 , H01L2224/92147 , H01L2224/92247 , H01L2924/00014 , H01L2924/12041 , H01L2924/1205 , H01L2924/1207 , H01L2924/1421 , H01L2933/005 , H01L2933/0066 , H05K1/189 , H05K3/284 , H05K3/321 , H05K3/3426 , H05K2201/0145 , H05K2201/0154 , H05K2201/10098 , H05K2201/10106 , H05K2203/049 , Y02P70/613 , H01L2924/00 , H01L2224/05599 , H01L2224/32245 , H01L2224/48247
Abstract: A disclosed circuit arrangement includes a flexible substrate. A layer of pressure sensitive adhesive (PSA) is directly adhered to a first major surface of the substrate. One or more metal foil pads and electrically conductive wire are attached directly on a surface of the PSA layer. The wire has a round cross-section and one or more portions directly connected to the one or more metal foil pads with one or more weld joints, respectively. An electronic device is attached directly on the surface of the layer of PSA and is electrically connected to the one or more portions of the round wire by one or more bond wires, respectively.
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公开(公告)号：US09686866B2
公开(公告)日：2017-06-20
申请号：US14833129
申请日：2015-08-23
Applicant: Unimicron Technology Corp.
Inventor： Hung-Lin Chang , Ta-Han Lin
CPC classification number: H05K1/186 , H01L23/3121 , H01L2224/04105 , H01L2224/19 , H01L2224/73259 , H01L2224/92224 , H01L2924/15153 , H01L2924/19105 , H05K1/0298 , H05K1/0326 , H05K1/0333 , H05K1/0346 , H05K1/111 , H05K1/115 , H05K3/4644 , H05K3/4697 , H05K2201/0129 , H05K2201/0145 , H05K2201/09081 , H05K2201/09545
Abstract: A package structure includes a circuit substrate, at least one electronic component, and a connecting slot. The circuit substrate includes at least one core layer, a build-up structure including at least three patterned circuit layers, at least two dielectric layers and conductive through holes, and circuit pads. The electronic component is embedded in at least one of the dielectric layers and located in a disposition area. The electronic component is electrically connected to one of the patterned circuit layers through a portion of the conductive through holes. The connecting slot has a bottom portion, a plurality of sidewall portions connecting the bottom portion, and a plurality of connecting pads located on the sidewall portions. The circuit substrate is assembled to the bottom portion, and the circuit pads are electrically connected to the connecting pads through a bent area of the core layer that is bent relative to the disposition area.
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公开(公告)号：US20170164463A1
公开(公告)日：2017-06-08
申请号：US15356852
申请日：2016-11-21
Inventor： JONATHAN DOUGLAS HATCH , STEPHEN MCGARRY HATCH
CPC classification number: H05K1/0306 , H05K1/02 , H05K1/028 , H05K1/0393 , H05K1/115 , H05K1/144 , H05K3/0023 , H05K3/0064 , H05K3/007 , H05K3/048 , H05K3/103 , H05K3/125 , H05K3/386 , H05K3/389 , H05K3/4611 , H05K3/4644 , H05K2201/0145 , H05K2201/0154 , H05K2201/05 , H05K2201/09009 , H05K2203/0152
Abstract: A PCB page blank includes a flexible substrate, a curable adhesive, a conductive layer, and a conductive layer support. The flexible substrate receives an opaque negative circuit pattern thereon. Portions of the curable adhesive not obscured by the circuit pattern may bond to portions of the conductive layer when exposed to light. The bonded portions of the conductive layer shear or tear from non-bonded portions of the conductive layer such that the bonded portions remain with the flexible substrate and the non-bonded portions remain with the conductive layer support when the flexible substrate and the conductive layer support are separated. The flexible substrate and the bonded portions of the conductive layer thus form a PCB prototype with the bonded portions of the conductive layer forming circuit traces of the circuit pattern.
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公开(公告)号：US09661744B2
公开(公告)日：2017-05-23
申请号：US14746984
申请日：2015-06-23
Applicant: LG INNOTEK CO., LTD.
Inventor： Soo Keun Kim , Ji Chang Ryu , Jae Hak Her
CPC classification number: H05K1/0271 , G06F3/03545 , G06F3/0412 , G06F3/044 , G06F3/047 , G06F2203/04101 , G06F2203/04107 , G06F2203/04111 , G06F2203/04112 , G06F2203/04808 , G06F2203/04809 , H05K1/0274 , H05K2201/0145
Abstract: Provided is a touch panel including a cover substrate including an active area and an unactive area, and a printing layer on the unactive area. The printing layer has surface roughness in a range of 0.4 μm to 0.6 μm. The printing layer has straightness in a range of ±0.1 μm to ±10 μm.
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公开(公告)号：US09648753B2
公开(公告)日：2017-05-09
申请号：US14758753
申请日：2013-12-31
Applicant: AMOGREENTECH CO., LTD.
Inventor： Jong-Soo Kim , Kyung-Hoon Lee , Jeong-Sang Yu , O-Chung Kwon
CPC classification number: H05K3/207 , H05K1/028 , H05K1/0287 , H05K1/0326 , H05K1/0346 , H05K1/092 , H05K1/118 , H05K3/12 , H05K2201/0145 , H05K2201/0154
Abstract: The present invention relates to a method for manufacturing a flexible printed circuit board and a flexible printed circuit board manufactured by using the same. A circuit pattern is formed with a conductive paste on one surface of a base material, and the circuit pattern is sintered at a temperature of 290° C. to 420° C. to manufacture the flexible printed circuit board. As such, manufacturing costs can be reduced and productivity can be improved through a simple yet convenient process. Also, the circuit pattern is formed without a plating process, such that the problem of circuit pattern separation occurring during the plating process can be addressed and product reliability can be improved.
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