公开(公告)号：US20100222477A1

公开(公告)日：2010-09-02

申请号：US11993350

申请日：2006-06-21

Applicant: Nami Tsukamoto ,  Toshifumi Hashiba ,  Mayumi Mizushiri

Inventor： Nami Tsukamoto ,  Toshifumi Hashiba ,  Mayumi Mizushiri

IPC: C08K5/29 ,  C07C267/00

CPC classification number: C08K9/04 ,  H05K1/0373 ,  H05K2201/0209 ,  H05K2201/0224

Abstract: A filler for substrates which comprises an inorganic substance and a carbodiimide-group-containing organic layer chemically bonded to the surface of the inorganic substance. Examples of the carbodiimide-group-containing organic layer include a layer comprising a carbodiimide-group-containing compound represented by either of the following formulae. Due to the constitution, the filler for substrates can be highly dispersed in a resin for substrates even when added in a high proportion and can give a substrate inhibited from deteriorating in electrical properties, mechanical properties, etc. (X1)m—Z-[A-(R1—N═C═N)n—R1—NCO]1   (1) (X1)m—Z-[A-(R1—N═C═N)n—R1-A-Z—(X2)3]1   (2) [R1 represents a residue of an isocyanate compound; X′ and X2 each independently represents hydrogen, halogeno, etc.; Z′s each independently represents silicon or titanium; A represents an organic group having a valence of 2 or higher containing a bond derived from an isocyanate group; m and 1 each is an integer of 1-3, provided that m+1=4; and n is an integer of 1-100.]

Abstract translation: 一种用于基材的填料，其包含无机物质和与无机物质的表面化学键合的含碳二亚胺基的有机层。 含有碳二亚胺基的有机层的实例包括由下式表示的含碳二亚胺基化合物的层。 由于该结构，即使以高比例添加，基板用填料也可以高分散在基板用树脂中，能够抑制电性，机械性能等劣化的基板（X1）m-Z- [ A-（R1-N = C = N）n-R1-NCO] 1（1）（X1）m-Z- [A-（R1-N = C = N）n-R1-AZ-（X2）3 ] 1（2）[R1表示异氰酸酯化合物的残基] X'和X2各自独立地表示氢，卤素等; Z各自独立地表示硅或钛; A表示含有来自异氰酸酯基的键的化合价为2以上的有机基团; m和1各自为1-3的整数，条件是m + 1 = 4; n为1-100的整数。]

公开(公告)号：US20100219382A1

公开(公告)日：2010-09-02

申请号：US12738017

申请日：2008-10-21

Applicant: Shinji Abe

Inventor： Shinji Abe

IPC: H01B1/16

CPC classification number: H05K3/323 ,  C08K3/017 ,  C08K9/02 ,  C09J9/02 ,  C09J11/04 ,  H01B1/22 ,  H01R4/04 ,  H05K2201/0209 ,  H05K2201/0221 ,  H05K2201/0224 ,  Y10T428/2991

Abstract: The present invention provides a coated conductive powder in which the aggregation of conductive particles is suppressed and which is also excellent in electrical reliability, and a conductive adhesive using the same that can provide connection with high electrical reliability even for the connection of the electrodes of miniaturized electronic parts, such as IC chips, and circuit boards. The coated conductive powder of the present invention is a coated conductive powder obtained by coating the surfaces of conductive particles with insulating inorganic fine particles, wherein the volume resistivity value of the coated conductive powder is 1 Ω·cm or less, the specific gravity of the insulating inorganic fine particles is 5.0 g/ml or less, the particle diameter ratio of the insulating inorganic fine particles to the conductive particles (the insulating inorganic fine particles/the conductive particles) is 1/100 or less, and the insulating inorganic fine particles adhere to the surfaces of the conductive particles.

Abstract translation: 本发明提供了一种涂覆的导电粉末，其中导电颗粒的聚集被抑制并且电可靠性也优异，并且使用该导电粘合剂可以提供甚至连接小型化的电极的高电气可靠性 电子部件，如IC芯片和电路板。 本发明的涂覆导电粉末是通过用绝缘无机细颗粒涂覆导电颗粒的表面而获得的涂覆导电粉末，其中涂覆的导电粉末的体积电阻率值为1＆OHgr·cm以下，比重为 绝缘性无机微粒为5.0g / ml以下，绝缘性无机微粒与导电性粒子（绝缘性无机微粒/导电性粒子）的粒径比为1/100以下，绝缘性无机质 颗粒附着在导电颗粒的表面上。

公开(公告)号：US07786219B2

公开(公告)日：2010-08-31

申请号：US12588884

申请日：2009-10-30

Applicant: Kenji Ishii ,  Yasumasa Norisue ,  Kiyonari Hiramatsu ,  Makoto Miyamoto ,  Katsutoshi Yamazaki

Inventor： Kenji Ishii ,  Yasumasa Norisue ,  Kiyonari Hiramatsu ,  Makoto Miyamoto ,  Katsutoshi Yamazaki

IPC: B32B27/04 ,  C08L63/00 ,  C08L71/12 ,  H05K1/03

CPC classification number: C08L63/00 ,  C08F283/08 ,  C08G59/00 ,  C08G59/06 ,  C08G59/40 ,  C08G65/485 ,  C08G2650/34 ,  C08L71/12 ,  C08L71/126 ,  C08L79/04 ,  H05K1/0326 ,  H05K3/285 ,  H05K3/4676 ,  H05K2201/0209 ,  Y10T428/24994 ,  Y10T428/31511 ,  Y10T428/31529 ,  C08L2666/02 ,  C08L2666/22

Abstract: The present invention provides a bifunctional phenylene ether oligomer compound having a thermosetting functional group at each terminal, an epoxy resin containing the above oligomer compound and a use thereof. That is, it provides a sealing epoxy resin composition for sealing an electric part, an epoxy resin composition for laminates, a laminate, a printed wiring board, a curable resin composition and a photosensitive resin composition. The resins and resin compositions of the present invention are used in electronics fields in which a low dielectric constant, a low dielectric loss tangent and high toughness are required and also used for various uses such as coating, bonding and molding.

Abstract translation: 本发明提供了在每个末端具有热固性官能团的双官能亚苯基醚低聚物化合物，含有上述低聚物化合物的环氧树脂及其用途。 也就是说，提供了用于密封电气部件的密封型环氧树脂组合物，层压体用环氧树脂组合物，层压体，印刷线路板，固化性树脂组合物和感光性树脂组合物。 本发明的树脂和树脂组合物用于需要低介电常数，低介电损耗角正切和高韧性的电子领域中，并且还用于各种用途如涂布，粘合和模塑。

公开(公告)号：US20100200815A1

公开(公告)日：2010-08-12

申请号：US12760861

申请日：2010-04-15

Applicant: Akira Inaba

Inventor： Akira Inaba

IPC: H01B1/00 ,  B05D5/12

CPC classification number: H01B1/22 ,  H05K1/092 ,  H05K3/1216 ,  H05K3/4061 ,  H05K3/4611 ,  H05K2201/0209

Abstract: The present invention relates to an electrically conductive composition for filling via-holes formed in an electronic circuit substrate containing an electrically conductive metal and a vehicle, wherein the content of the electrically conductive metal is 57 vol % or more, and the composition is a plastic fluid for which fluidity increases when external pressure is applied to the composition.

Abstract translation: 本发明涉及用于填充形成在含有导电金属和载体的电子电路基板中的通孔的导电组合物，其中导电金属的含量为57体积％以上，组成为塑料 当向组合物施加外部压力时流动性增加的流体。

公开(公告)号：US07754803B2

公开(公告)日：2010-07-13

申请号：US10503491

申请日：2003-02-04

Applicant: Akihiko Fujiwara ,  Koichi Shibayama ,  Hidenobu Deguchi

Inventor： Akihiko Fujiwara ,  Koichi Shibayama ,  Hidenobu Deguchi

IPC: C08K3/34 ,  C08K5/98 ,  C08L67/02 ,  C08J5/18 ,  C08K5/50 ,  H05K1/03

CPC classification number: H05K1/0373 ,  C08K3/01 ,  H05K1/0393 ,  H05K3/4626 ,  H05K3/4635 ,  H05K2201/0129 ,  H05K2201/0209 ,  H05K2201/0358 ,  H05K2201/068

Abstract: A resin composition, substrate material, sheet, laminated board, resin-bearing copper foil, copper-clad laminate, TAB tape, printed circuit board, prepreg and adhesive sheet are provided which exhibit improved physical properties, dimensional stability, heat resistance and flame retardance, particularly high-temperature physical properties. A resin composition containing 100 parts by weight of a thermoplastic resin and 0.1-65 parts by weight of an inorganic compound, the resin composition having a mean linear expansion coefficient (α2) of 1.0×10−3 [° C.−1] or below over the temperature range from a temperature 10° C. higher than a glass transition temperature of the resin composition to a temperature 50° C. higher than the glass transition temperature of the resin composition.

Abstract translation: 提供了具有改进的物理性能，尺寸稳定性，耐热性和阻燃性的树脂组合物，基材，片，层压板，含树脂铜箔，覆铜层压板，TAB带，印刷电路板，预浸料和粘合片 ，特别是高温物理性能。 含有100重量份热塑性树脂和0.1-65重量份无机化合物的树脂组合物，该树脂组合物的平均线膨胀系数（α2）为1.0×10-3 [℃-1]或 在比树脂组合物的玻璃化转变温度高10℃的温度范围内，比在树脂组合物的玻璃化转变温度高50℃的温度范围内。

公开(公告)号：US20100163783A1

公开(公告)日：2010-07-01

申请号：US12588940

申请日：2009-11-03

Applicant: Dein-Run Fung ,  Te-Chao Liao ,  Hao-Sheng Chen

Inventor： Dein-Run Fung ,  Te-Chao Liao ,  Hao-Sheng Chen

IPC: C09K5/00

CPC classification number: C09K21/14 ,  C08G59/304 ,  C08G59/38 ,  C08L63/00 ,  H05K1/0373 ,  H05K2201/012 ,  H05K2201/0209 ,  C08L2666/22

Abstract: A high thermal-conductive, halogen-free and flame-retardant resin composition used as a dielectric layer of a printed circuit board comprises 5% to 70% of phosphorus-containing epoxy resin, at most 50% of multifunctional or bifunctional epoxy resin, 1% to 20% of curing agent, 0.01% to 10% of accelerant, at most 20% of inorganic powder, 5% to 85% of high thermal conductivity powder and 0.01% to 10% of processing aids, which resin composition has excellent thermal conductivity, heat resistance and flame retardancy as well as being environmentally friendly for free of halogen flame retardant and no toxic or corrosive gases when burning; the resin composition is used to form as a high thermal-conductive prepreg by impregnation or form as a high thermal-conductive coating by coating and then further used as a dielectric layer on a printed circuit board for demonstrating if electronic components formed thereon the printed circuit board has high thermal-conductivity and efficient heat dissipation capable of improving long service life and enhanced stability of electronic components.

Abstract translation: 用作印刷电路板的电介质层的高导热，无卤阻燃树脂组合物包含5％至70％的含磷环氧树脂，至多50％的多官能或双官能环氧树脂，1 固化剂的百分比至20％，促进剂的0.01％至10％，无机粉末的至多20％，高导热性粉末的5％至85％和加工助剂的0.01％至10％，该树脂组合物具有优异的热 导电性，耐热性和阻燃性，以及环保无卤素阻燃剂，燃烧时无毒性或腐蚀性气体; 树脂组合物用于通过浸渍形成高导热性预浸料，或通过涂布形成高导热涂层，然后进一步用作印刷电路板上的电介质层，以证明其上形成印刷电路的电子部件 板材具有高导热性和高效率的散热能力，可以延长电池寿命，延长电子元器件的稳定性。

公开(公告)号：US20100160512A1

公开(公告)日：2010-06-24

申请号：US11993333

申请日：2006-06-21

Applicant: Nami Tsukamoto ,  Toshifumi Hashiba ,  Mayumi Mizushiri

Inventor： Nami Tsukamoto ,  Toshifumi Hashiba ,  Mayumi Mizushiri

IPC: C08K5/29 ,  C07C267/00 ,  C09K21/10 ,  C07F7/28 ,  C07F7/02 ,  B32B5/00

CPC classification number: H05K1/0373 ,  C08K9/04 ,  H05K2201/012 ,  H05K2201/0209 ,  H05K2201/0224 ,  Y10T428/2982

Abstract: A flame retardant which comprises an inorganic hydroxide and a carbodiimide-group-containing organic layer chemically bonded to the surface of the inorganic hydroxide. Examples of the carbodiimide-group-containing organic layer include a layer comprising a carbodiimide-group-containing compound represented by either of the following formulae. Due to the constitution, the flame retardant can be highly dispersed in a resin even when added in a high proportion and can give a molding inhibited from deteriorating in electrical properties, mechanical properties, etc. (X1)m-Z-[A-(R1—N═C═N)n—R1—NCO]1  (1) (X1)m-Z-[A-(R1—N═C═N)n—R1-A-Z-(X2)3])3  (2) [R1 represents a residue of an isocyanate compound; X1 and X2 each independently represents hydrogen, halogeno, etc.; Z's each independently represents silicon or titanium; A represents an organic group having a valence of 2 or higher containing a bond derived from an isocyanate group; m and l each is an integer of 1-3, provided that m+1=4; and n is an integer of 1-100.]

Abstract translation: 一种阻燃剂，其包含无机氢氧化物和与无机氢氧化物的表面化学键合的含碳二亚胺基的有机层。 含有碳二亚胺基的有机层的实例包括由下式表示的含碳二亚胺基化合物的层。 由于该结构，即使以高比例添加，阻燃剂也可以高度分散在树脂中，并且可以使模制品不受电性能，机械性能等的恶化。（X1）mZ- [A-（R1- N = C-N）n-R1-NCO] 1（1）（X1）mZ- [A-（R1-N = C = N）n-R1-AZ-（X2）3]）3（2）[ R1表示异氰酸酯化合物的残基; X1和X2各自独立地表示氢，卤素等; Z各自独立地表示硅或钛; A表示含有来自异氰酸酯基的键的化合价为2以上的有机基团; m和l各自为1-3的整数，条件是m + 1 = 4; n为1-100的整数。]

公开(公告)号：US07741396B2

公开(公告)日：2010-06-22

申请号：US11285901

申请日：2005-11-23

Applicant: Qi Tan ,  Patricia Chapman Irwin

Inventor： Qi Tan ,  Patricia Chapman Irwin

IPC: C08K3/10 ,  C04B35/00 ,  C01F17/00 ,  C01C1/00 ,  C01G23/00

CPC classification number: H01B3/006 ,  H01G4/206 ,  H01G7/06 ,  H05K1/162 ,  H05K2201/0209 ,  H05K2203/105 ,  H05K2203/171

Abstract: Disclosed herein is a composition comprising a polymeric material; and non-linear dielectric ceramic fillers; wherein the non-linear dielectric ceramic fillers have a dielectric constant that is greater than or equal to about 100 and wherein the dielectric constant of the composition is tunable. Disclosed herein too is a composition comprising a polymeric material; and perovskites; wherein the dielectric constant of a composition is tunable and further wherein the composition has a dielectric constant of about 2 to about 100. Disclosed herein too is a method comprising blending a polymeric resin with non-linear dielectric ceramic fillers to form a composition; wherein the non-linear dielectric ceramic fillers have a dielectric constant of greater than or equal to about 100 and wherein the dielectric constant of the composition is tunable.

Abstract translation: 本文公开了包含聚合物材料的组合物; 和非线性介电陶瓷填料; 其中所述非线性介电陶瓷填料具有大于或等于约100的介电常数，并且其中所述组合物的介电常数是可调谐的。 本文也公开了包含聚合物材料的组合物; 和钙钛矿; 其中组合物的介电常数是可调谐的，并且进一步地其中组合物具有约2至约100的介电常数。本文还公开了一种方法，其包括将聚合物树脂与非线性介电陶瓷填料共混以形成组合物; 其中所述非线性介电陶瓷填料具有大于或等于约100的介电常数，并且其中所述组合物的介电常数是可调谐的。

公开(公告)号：US20100118243A1

公开(公告)日：2010-05-13

申请号：US12269260

申请日：2008-11-12

Applicant: Debasis Majumdar ,  Glen C. Irvin, JR. ,  Lee W. Tutt ,  Gary S. Freedman

Inventor： Debasis Majumdar ,  Glen C. Irvin, JR. ,  Lee W. Tutt ,  Gary S. Freedman

IPC: G02F1/1333 ,  B32B5/16 ,  B32B37/02 ,  G02B1/04

CPC classification number: H05K3/046 ,  H01G11/48 ,  H01L51/0021 ,  H01L51/003 ,  H01L51/0037 ,  H05K2201/0209 ,  H05K2201/0329 ,  H05K2203/0528 ,  H05K2203/107 ,  Y02E60/13 ,  Y10T428/1055 ,  Y10T428/25 ,  Y10T428/259

Abstract: A donor laminate for transfer of a conductive layer has a transparent substrate and a conductive layer comprising at least one electronically conductive polymer that is present in an amount of at least 40 weight %, a polyanion, and inorganic particles having an average particle size of less than 100 nanometers (nanoparticles). This donor laminate can be used to transfer the conductive layer to a suitable receiver element to prepare various electronic devices.

Abstract translation: 用于转移导电层的供体层压板具有透明基底和导电层，该导电层包含至少一种以至少40重量％的量存在的电子导电聚合物，聚阴离子和平均粒径较小的无机颗粒 超过100纳米（纳米颗粒）。 该供体层压板可用于将导电层转移到合适的接收元件以制备各种电子器件。

公开(公告)号：US20100104839A1

公开(公告)日：2010-04-29

申请号：US12594569

申请日：2008-04-04

Applicant: Michael Dunleavy ,  Sajad Haq ,  Joseph Maurice Davies ,  Jason Karl Rew

Inventor： Michael Dunleavy ,  Sajad Haq ,  Joseph Maurice Davies ,  Jason Karl Rew

IPC: B32B7/02 ,  B32B5/00 ,  B29C39/02 ,  B29C65/70

CPC classification number: B29C39/10 ,  H01B3/006 ,  H01G4/206 ,  H05K1/024 ,  H05K1/0373 ,  H05K1/162 ,  H05K2201/0116 ,  H05K2201/0209 ,  H05K2201/0218 ,  H05K2201/0254 ,  Y10T428/24967

Abstract: A bulk dielectric material can include a solid composite material having a solid matrix material and a plurality of filler elements distributed within the matrix material. The bulk dielectric material can have, at a frequency of greater than 1 MHz, (i) a permittivity with a real part of magnitude greater than 10 and an imaginary part of magnitude less than 3, and (ii) an electrical breakdown strength greater than 5 kV/mm and can have a minimum dimension greater than 2 mm.

Abstract translation: 体电介质材料可以包括具有固体基质材料和分布在基质材料内的多个填料元素的固体复合材料。 大体积电介质材料可以具有大于1MHz的频率，（i）具有大于10的实际部分幅度的电容率和小于3的虚数部分，以及（ii）电击穿强度大于 5 kV / mm，最小尺寸可以大于2 mm。