公开(公告)号：US20170123310A1

公开(公告)日：2017-05-04

申请号：US15319733

申请日：2015-06-19

Applicant: FUNDACIÓ INSTITUT CATALÀ DE NANOCIÈNCIA I NANOTECNOLOGIA ,  INSTITUCIÓ CATALANA DE RECERCA I ESTUDIS AVANÇATS

Inventor： Carmen Clotilde MAYORGA MARTÍNEZ ,  Luis Miguel BAPTISTA PIRES ,  Arben MERKOÇI HYKA

IPC: G03F7/00 ,  B01D71/48 ,  B01D71/02 ,  H05K3/12 ,  B01D67/00 ,  H05K1/18 ,  H05K3/00 ,  B01D71/12 ,  B01D69/12

CPC classification number: G03F7/0002 ,  B01D67/0034 ,  B01D69/02 ,  B01D69/12 ,  B01D71/021 ,  B01D71/12 ,  B01D71/48 ,  H05K1/189 ,  H05K3/0076 ,  H05K3/1275 ,  H05K2201/0145 ,  H05K2203/0736

Abstract: A method of forming an electronic device on a flexible substrate without using acetone dissolvent, including the steps of: printing a hydrophobic mask on a porous membrane to form a pattern thereon which is complementary to a desired pattern; filtering an aqueous suspension of an electronic material through the non-printed region of the porous membrane, whereby some electronic material is deposited on said non-printed region following the desired pattern; pressing the flexible substrate against the printed face of the membrane in order to transfer the patterned electronic material deposited on the porous membrane to the flexible substrate to form the electronic device thereon.

公开(公告)号：US20170064839A1

公开(公告)日：2017-03-02

申请号：US15065488

申请日：2016-03-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jeongyub LEE ,  Yunsung Woo ,  Changseung LEE ,  Eunhyoung CHO

IPC: H05K3/02 ,  B23K26/384 ,  B23K26/0622 ,  H05K3/18

CPC classification number: B23K26/0622 ,  B23K26/0624 ,  B23K26/082 ,  B23K26/083 ,  B23K26/0853 ,  B23K26/0869 ,  B23K26/384 ,  B23K26/386 ,  B23K26/389 ,  H01L31/1884 ,  H05K3/0047 ,  H05K3/146 ,  H05K2201/0108 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/0323 ,  H05K2201/10128 ,  H05K2203/107

Abstract: A method of patterning holes includes placing a substrate on a stage of a laser system, the substrate having a graphene layer on a surface thereof, generating a pulse laser from the laser system, and forming a plurality of hole patterns spaced apart from each other on the graphene layer by irradiating the pulse laser while the graphene layer is in motion.

Abstract translation: 图案化孔的方法包括将基板放置在激光系统的台上，所述基板在其表面上具有石墨烯层，从激光系统产生脉冲激光，并且形成多个彼此间隔开的孔图案 石墨烯层通过在石墨烯层运动时照射脉冲激光器。

公开(公告)号：US20170042023A1

公开(公告)日：2017-02-09

申请号：US14828796

申请日：2015-08-18

Applicant: International Business Machines Corporation

Inventor： Matthew S. Doyle ,  Joseph Kuczynski ,  Kevin M. O'Connell ,  Chelsie M. Peterson ,  Mark D. Plucinski ,  Timothy J. Tofil

IPC: H05K1/02 ,  H05K3/14

CPC classification number: H05K1/0213 ,  H01L23/573 ,  H01L23/576 ,  H05K1/0274 ,  H05K1/0275 ,  H05K1/03 ,  H05K1/09 ,  H05K1/097 ,  H05K1/18 ,  H05K3/143 ,  H05K2201/0108 ,  H05K2201/0145 ,  H05K2201/0323 ,  H05K2201/0332

Abstract: In an example, a process includes forming a patterned layer on a polymer substrate. The process also includes depositing a graphene-containing material on the patterned layer to form a plurality of graphene traces of a tamper detection circuit.

Abstract translation: 在一个实例中，方法包括在聚合物基底上形成图案层。 该方法还包括在图案化层上沉积含石墨烯的材料以形成篡改检测电路的多个石墨烯迹线。

公开(公告)号：US09549471B2

公开(公告)日：2017-01-17

申请号：US13579073

申请日：2011-06-16

Applicant: Kazuki Kammuri

Inventor： Kazuki Kammuri

IPC: H05K1/03 ,  H05K3/02 ,  B32B15/08 ,  B32B15/085 ,  B32B15/09 ,  B32B15/20

CPC classification number: H05K3/022 ,  B32B15/08 ,  B32B15/085 ,  B32B15/09 ,  B32B15/20 ,  B32B2457/08 ,  H05K1/0393 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/0358 ,  Y10T428/31678

Abstract: A copper foil composite comprising a copper foil and a resin layer laminated thereon, wherein equation 1: (f3×t3)/(f2×t2)=>1 is satisfied when t2 (mm) is a thickness of the copper foil, f2 (MPa) is a stress of the copper foil under tensile strain of 4%, t3 (mm) is a thickness of the resin layer, f3 (MPa) is a stress of the resin layer under tensile strain of 4%, and equation 2: 1

Abstract translation: 包括铜箔和层压在其上的树脂层的铜箔复合体，其中当t2（mm）是铜箔的厚度，f2（mm）时，等式1：（f3×t3）/（f2×t2）=> 1 MPa）是拉伸应变为4％时的铜箔的应力，t3（mm）是树脂层的厚度，f3（MPa）是树脂层在拉伸应变下的应力为4％，式2： 当f1（N / mm）在铜箔和树脂层之间的剥离强度为180°时，满足1 <= 33f1 /（F×T），F（MPa）是拉伸应变下的铜箔复合材料的强度为30％ ，T（mm）为铜箔复合体的厚度。

公开(公告)号：US20160315044A1

公开(公告)日：2016-10-27

申请号：US15199913

申请日：2016-06-30

Applicant: Industrial Technology Research Institute

Inventor： Wei-Yuan Cheng ,  Chen-Chu Tsai ,  Yuh-Zheng Lee

IPC: H01L23/498 ,  H01L21/683 ,  H01L23/31

CPC classification number: H05K1/028 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/4985 ,  H01L2221/68318 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2221/68381 ,  H01L2224/16 ,  H01L2924/181 ,  H05K1/0281 ,  H05K1/115 ,  H05K3/0032 ,  H05K3/007 ,  H05K3/4038 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/10106 ,  H05K2201/10128 ,  H05K2201/2009 ,  H05K2203/1178 ,  H01L2924/00012

Abstract: According to embodiments of the disclosure, an electronic device package may include a wire layer and a rigid element. The wire layer includes a first surface and a second surface opposite to each other, and the second surface of the wire layer has at least one coarse structure. A portion of the second surface having the coarse structure has a greater roughness than another portion of the second surface. The rigid element is disposed on the first surface of the wire layer, wherein a stiffness of the rigid element is greater than a stiffness of the wire layer and a projection area of the coarse structure on the first surface of the wire layer overlaps an edge of the rigid element.

Abstract translation: 根据本公开的实施例，电子设备封装可以包括导线层和刚性元件。 线层包括彼此相对的第一表面和第二表面，并且线层的第二表面具有至少一个粗糙结构。 具有粗糙结构的第二表面的一部分具有比第二表面的另一部分更大的粗糙度。 刚性元件设置在线层的第一表面上，其中刚性元件的刚度大于金属丝层的刚度，并且粗糙结构在金属丝层的第一表面上的投影区域与 刚性元素。

公开(公告)号：US20160299609A1

公开(公告)日：2016-10-13

申请号：US14924020

申请日：2015-10-27

Applicant: Samsung Display Co., Ltd.

Inventor： Koichi SUGITANI ,  Hoon KANG ,  Chul Won PARK ,  Yang-Ho JUNG

IPC: G06F3/041 ,  H05K3/46 ,  H05K3/06 ,  G06F3/045

CPC classification number: H05K3/06 ,  G06F3/0416 ,  G06F2203/04103 ,  H05K3/007 ,  H05K3/064 ,  H05K2201/0145 ,  H05K2201/026 ,  H05K2201/0323 ,  H05K2201/0326 ,  H05K2201/0329 ,  H05K2201/10128 ,  H05K2203/016

Abstract: A touch panel includes: a uni-axially oriented base film; a transparent electrode pattern layer positioned on the uni-axially oriented base film; a first passivation layer formed in an edge region of the transparent electrode pattern layer and covering end portion side walls of the transparent electrode pattern layer; and a contact hole positioned on the first passivation layer and exposing the first passivation layer.

Abstract translation: 触摸面板包括：单向定向的基膜; 位于所述单轴取向基膜上的透明电极图案层; 形成在所述透明电极图案层的边缘区域中并且覆盖所述透明电极图案层的端部侧壁的第一钝化层; 以及位于所述第一钝化层上并暴露所述第一钝化层的接触孔。

公开(公告)号：US09351396B2

公开(公告)日：2016-05-24

申请号：US14485069

申请日：2014-09-12

Applicant: IBIDEN Co., Ltd.

Inventor： Tetsuo Amano ,  Toshio Nishiwaki

IPC: H05K1/03 ,  H05K1/09 ,  H05K1/11 ,  H05K1/02 ,  H05K3/42 ,  H05K3/46

CPC classification number: H05K1/0306 ,  H05K1/0219 ,  H05K1/024 ,  H05K1/0271 ,  H05K1/0373 ,  H05K1/09 ,  H05K1/115 ,  H05K3/427 ,  H05K3/4602 ,  H05K3/4655 ,  H05K2201/0145 ,  H05K2201/0209 ,  H05K2201/068 ,  H05K2201/096

Abstract: A printed wiring board includes a core insulation layer including a resin and having a via conductor through the core insulation layer, a first conductive layer formed on the core layer and including a copper foil and a plated film, an interlayer insulation layer formed on the first layer and including a resin, the interlayer layer having a via conductor through the interlayer layer, and a second conductive layer formed on the interlayer layer and including a copper foil and a plated film. The first layer includes a conductive circuit, the core and interlayer layers have dielectric constants of 4.0 or lower for signal transmission at frequency of 1 GHz and thermal expansion coefficient of 85 ppm/° C. or lower at or below Tg, and the foil of the first layer has thickness greater than thickness of the foil of the second layer.

Abstract translation: 印刷布线板包括：芯绝缘层，其包括树脂，并且具有通过芯绝缘层的通路导体，形成在芯层上并包括铜箔和镀膜的第一导电层，形成在第一层上的层间绝缘层 层，并且包括树脂，所述层间层具有穿过所述层间层的通孔导体，以及形成在所述中间层上并包括铜箔和镀膜的第二导电层。 第一层包括导电电路，核心层和层间介电常数为4.0或更低，信号传输频率为1GHz，热膨胀系数为85ppm /℃或更低，等于或低于Tg， 第一层的厚度大于第二层的箔的厚度。

公开(公告)号：US20160135285A1

公开(公告)日：2016-05-12

申请号：US14897214

申请日：2014-04-30

Applicant: AMOGREENTECH CO., LTD.

Inventor： Jongsoo Kim ,  Jeong-Sang Yu ,  O-Chung Kwon ,  Jae-Sic Kim

IPC: H05K1/02 ,  H05K3/10 ,  H05K3/46 ,  H05K3/00 ,  H05K1/11 ,  H05K1/09

CPC classification number: H05K3/361 ,  H05K1/028 ,  H05K1/0298 ,  H05K1/0393 ,  H05K1/092 ,  H05K1/115 ,  H05K3/0011 ,  H05K3/10 ,  H05K3/285 ,  H05K3/46 ,  H05K3/4664 ,  H05K3/4676 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/0209 ,  H05K2201/0317 ,  H05K2203/0759

Abstract: A flexible printed circuit board includes a substrate, a circuit pattern formed on the substrate, and a protective coating layer formed on the substrate by applying and curing a coating solution to cover and protect the circuit pattern. A method for manufacturing forming a circuit pattern on a substrate and forming a protective coating layer for covering and protecting the circuit pattern by applying a coating solution on the substrate. The circuit pattern may be securely attached to the substrate, and damage and deformation of the circuit pattern due to repeated bending or warping of the substrate may be prevented, ultimately improving operational reliability.

Abstract translation: 柔性印刷电路板包括基板，形成在基板上的电路图案，以及通过施加和固化涂覆溶液来覆盖和保护电路图案而在基板上形成的保护涂层。 一种在衬底上形成电路图案的方法，并且通过在衬底上施加涂布溶液形成用于覆盖和保护电路图案的保护涂层。 电路图案可以牢固地附接到基板，并且可以防止由于基板的反复弯曲或翘曲引起的电路图案的损坏和变形，最终提高了操作可靠性。

公开(公告)号：US20160085000A1

公开(公告)日：2016-03-24

申请号：US14492449

申请日：2014-09-22

Applicant: The Chinese University of Hong Kong

Inventor： Shih-Chi Chen ,  Ni Zhao ,  Huihua Xu ,  Xi Zhou

IPC: G02B5/18 ,  H05K1/02 ,  C23F1/00

CPC classification number: G02B5/1857 ,  B81C1/00031 ,  B81C1/00388 ,  C23C22/02 ,  C23F1/00 ,  C23F1/02 ,  C23F1/14 ,  C23F1/44 ,  H05K1/028 ,  H05K1/0296 ,  H05K1/118 ,  H05K3/061 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2203/122

Abstract: A process for positive microcontact printing, including inking a patterned mold with a thiol; contacting the mold with a metal surface of a substrate; backfilling the metal surface with a solution containing an aromatic amine to form a backfilling layer; etching the metal surface of the substrate; and rinsing the substrate to remove the backfilling layer.

Abstract translation: 一种用于正极微接触印刷的方法，包括用硫醇着墨图案化的模具; 使模具与衬底的金属表面接触; 用含有芳香胺的溶液回填金属表面以形成回填层; 蚀刻衬底的金属表面; 并冲洗底物以除去回填层。

公开(公告)号：US09288914B2

公开(公告)日：2016-03-15

申请号：US14082196

申请日：2013-11-18

Applicant: FuKui Precision Component (Shenzhen) Co., Ltd. ,  Zhen Ding Technology Co., Ltd.

Inventor： Ming-Jaan Ho ,  Xian-Qin Hu

IPC: H05K3/44 ,  H05K3/28 ,  H05K3/20 ,  H05K1/11

CPC classification number: H05K3/281 ,  H05K1/11 ,  H05K3/202 ,  H05K2201/0145 ,  H05K2203/063 ,  H05K2203/068 ,  Y10T29/302

Abstract: A printed circuit board with circuit visible includes a wiring layer, a first adhesive layer, a first dielectric layer, and a cover film, which are stacked in described order, the wiring layer comprising at least one electrical contact pad. The cover film has at least one opening corresponding to the electrical contact pad. The cover film includes a second dielectric layer and a second adhesive layer. A flow initiation temperature of the first adhesive layer is in a range from 85 degrees centigrade to 90 degrees centigrade, and a hardening temperature of the first adhesive being lower than 150 degrees centigrade.

Abstract translation: 具有电路可见的印刷电路板包括按照上述顺序堆叠的布线层，第一粘合剂层，第一介电层和覆盖膜，所述布线层包括至少一个电接触焊盘。 覆盖膜具有至少一个对应于电接触垫的开口。 覆盖膜包括第二介电层和第二粘合剂层。 第一粘合剂层的流动起始温度在85摄氏度到90摄氏度的范围内，第一粘合剂的硬化温度低于150摄氏度。