公开(公告)号：US20100084167A1

公开(公告)日：2010-04-08

申请号：US12573344

申请日：2009-10-05

Applicant: Changbo SHIM ,  Toyonari ITO ,  Satoshi OKAMOTO

Inventor： Changbo SHIM ,  Toyonari ITO ,  Satoshi OKAMOTO

IPC: H05K7/20 ,  B05D5/12

CPC classification number: H05K1/0326 ,  H01L33/483 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/12044 ,  H05K1/0366 ,  H05K2201/0141 ,  H05K2201/0145 ,  H05K2201/0209 ,  H05K2201/10106 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The present invention provides a substrate applicable in a chip LED package, the substrate having a conductive layer, an insulation layer and a heat-dissipation plate in this order, wherein the insulation layer comprises a liquid crystal polyester soluble in a solvent and a sheet comprising inorganic fibers and/or organic fibers. The substrate has a small linear expansion coefficient of the insulation layer in the surface direction and is extremely useful for production of a chip LED package while having a practical heat resistance.

Abstract translation: 本发明提供一种可应用于芯片LED封装的衬底，该衬底具有导电层，绝缘层和散热板，其中绝缘层包括可溶于溶剂的液晶聚酯和包含 无机纤维和/或有机纤维。 该基板在表面方向上具有小的绝缘层的线膨胀系数，并且对于制造芯片LED封装而言具有实用的耐热性非常有用。

公开(公告)号：US20100080981A1

公开(公告)日：2010-04-01

申请号：US12564467

申请日：2009-09-22

Applicant: Hisashi KOBUKE ,  Isao Kanada ,  Yusuke Takahashi

Inventor： Hisashi KOBUKE ,  Isao Kanada ,  Yusuke Takahashi

IPC: B32B5/16

CPC classification number: H05K1/0306 ,  C03C14/004 ,  C03C2214/04 ,  C03C2214/20 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2201/0209 ,  H05K2201/0245 ,  Y10T428/257

Abstract: The present invention provides glass ceramic substrates 11a to 11d each containing a glass component and a plate-like alumina filler dispersed in the glass component, wherein the plate-like alumina filler has an average plate diameter of 0.1 to 20 μm and an average aspect ratio of 50 to 80, and wherein the plate-like alumina filler has a content of 22 to 35% by volume based on a total amount of the glass component and plate-like alumina filler.

Abstract translation: 本发明提供了玻璃成分分散在玻璃成分中的玻璃成分和板状氧化铝填料的玻璃陶瓷基板11a〜11d，其中，板状氧化铝填料的平均板直径为0.1〜20μm，平均长径比 为50〜80，其中板状氧化铝填料的含量相对于玻璃成分和板状氧化铝填料的总量为22〜35体积％。

公开(公告)号：US20100065785A1

公开(公告)日：2010-03-18

申请号：US12561195

申请日：2009-09-16

Applicant: Lex Kosowsky ,  Robert Fleming

Inventor： Lex Kosowsky ,  Robert Fleming

IPC: C01B35/14 ,  H01B1/06

CPC classification number: H01B1/20 ,  H01B3/002 ,  H01C7/105 ,  H05K1/0254 ,  H05K2201/0209 ,  H05K2201/0738

Abstract: A composition of voltage switchable dielectric (VSD) material that comprises Boron. According to embodiments, VSD material is formulated that includes particle constituents that include one or more of Boron-nitride polymers, Boron nanotubes, and/or Boron nanoparticles.

Abstract translation: 包含硼的电压可切换电介质（VSD）材料的组成。 根据实施方案，配制VSD材料，其包括包括一种或多种硼氮化物聚合物，硼纳米管和/或硼纳米颗粒的颗粒组分。

公开(公告)号：US20100065315A1

公开(公告)日：2010-03-18

申请号：US12443822

申请日：2007-10-02

Applicant: Michio KIMURA

Inventor： Michio KIMURA

IPC: H05K1/00 ,  B32B27/38 ,  C08K3/36 ,  C08L101/10 ,  C08G67/00

CPC classification number: H05K3/4626 ,  B32B5/022 ,  B32B5/024 ,  B32B15/08 ,  B32B15/14 ,  B32B15/20 ,  B32B27/16 ,  B32B27/18 ,  B32B27/20 ,  B32B27/26 ,  B32B27/28 ,  B32B27/38 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/02 ,  B32B2262/0261 ,  B32B2262/0269 ,  B32B2262/0276 ,  B32B2262/0284 ,  B32B2262/10 ,  B32B2262/101 ,  B32B2264/102 ,  B32B2307/206 ,  B32B2307/306 ,  B32B2307/3065 ,  B32B2307/308 ,  B32B2307/50 ,  B32B2307/538 ,  B32B2307/72 ,  B32B2307/7265 ,  B32B2457/00 ,  B32B2457/08 ,  C08K5/5425 ,  C08K5/548 ,  C08L63/00 ,  H05K3/389 ,  H05K2201/0209 ,  Y10T428/24917 ,  Y10T428/24994 ,  Y10T428/249994 ,  Y10T428/252 ,  Y10T428/254 ,  Y10T428/287 ,  Y10T428/31511 ,  Y10T428/31663

Abstract: The present invention provides a resin composition which can produce a multilayer printed wiring board not causing peeling and crack in a thermal shock test such as a cooling/heating cycle, and having high heat resistance and low-thermal expansion characteristics, when the resin composition is used for an insulating layer of the multilayer printed wiring board; and also an insulating sheet provided on a base, a prepreg, a multilayer printed wiring board and a semiconductor device using thereof. The resin composition is used for forming an insulating layer of the multilayer printed wiring board, wherein a surface roughness parameter Rvk value of the insulating layer is from 0.1 μm to 0.8 μm, measured after the insulating layer being formed with the resin composition, and subject to roughening treatment.

Abstract translation: 本发明提供一种树脂组合物，其可以在树脂组合物为热塑性树脂组合物为热塑性树脂组合物时，能够制造在冷热循环等热冲击试验中不产生剥离和裂纹的多层印刷布线板，并且具有高耐热性和低热膨胀特性 用于多层印刷线路板的绝缘层; 以及设置在基底上的绝缘片，预浸料，多层印刷线路板和使用其的半导体器件。 树脂组合物用于形成多层印刷线路板的绝缘层，其中绝缘层的表面粗糙度参数Rvk值为0.1μm至0.8μm，在用树脂组合物形成绝缘层之后测量，并且对象 进行粗糙处理。

公开(公告)号：US20100051328A1

公开(公告)日：2010-03-04

申请号：US12258453

申请日：2008-10-27

Applicant: Ra-Min Tain ,  Ming-Ji Dai

Inventor： Ra-Min Tain ,  Ming-Ji Dai

IPC: H05K1/03 ,  B05D5/12 ,  H05K1/02 ,  H05K1/00

CPC classification number: H05K1/053 ,  B82Y10/00 ,  H05K2201/0179 ,  H05K2201/0209 ,  H05K2201/0251 ,  H05K2201/026 ,  H05K2201/0323 ,  H05K2203/025

Abstract: A circuit board structure and a manufacturing method thereof are provided. The circuit board structure includes a composite substrate, a dielectric layer, and a circuit layer. The composite substrate includes a metal substrate doped with non-metal powders and a metal buffer layer. A surface of the metal buffer layer opposite to the other surface of the metal buffer layer in contact with the metal substrate is treated by a polishing process. The dielectric layer is formed on the polished surface of the metal buffer layer, and the circuit layer is formed on the dielectric layer. Alternatively, a barrier layer is interposed between the dielectric layer and the metal buffer layer for preventing a diffusion effect of the metal buffer layer.

Abstract translation: 提供一种电路板结构及其制造方法。 电路板结构包括复合衬底，电介质层和电路层。 复合衬底包括掺杂有非金属粉末和金属缓冲层的金属衬底。 通过抛光处理处理与金属基板接触的金属缓冲层的另一表面相对的金属缓冲层的表面。 电介质层形成在金属缓冲层的抛光表面上，电介质层形成在电介质层上。 或者，在电介质层和金属缓冲层之间插入阻挡层，以防止金属缓冲层的扩散效应。

公开(公告)号：US20100048826A1

公开(公告)日：2010-02-25

申请号：US12588884

申请日：2009-10-30

Applicant: Kenji Ishii ,  Yasumasa Norisue ,  Kiyonari Hiramatsu ,  Makoto Miyamoto ,  Makoto Yamazaki ,  Daisuke Ohno

Inventor： Kenji Ishii ,  Yasumasa Norisue ,  Kiyonari Hiramatsu ,  Makoto Miyamoto ,  Makoto Yamazaki ,  Daisuke Ohno

IPC: C08L71/10 ,  C08G65/38

CPC classification number: C08L63/00 ,  C08F283/08 ,  C08G59/00 ,  C08G59/06 ,  C08G59/40 ,  C08G65/485 ,  C08G2650/34 ,  C08L71/12 ,  C08L71/126 ,  C08L79/04 ,  H05K1/0326 ,  H05K3/285 ,  H05K3/4676 ,  H05K2201/0209 ,  Y10T428/24994 ,  Y10T428/31511 ,  Y10T428/31529 ,  C08L2666/02 ,  C08L2666/22

Abstract: The present invention provides a bifunctional phenylene ether oligomer compound having a thermosetting functional group at each terminal, an epoxy resin containing the above oligomer compound and a use thereof. That is, it provides a sealing epoxy resin composition for sealing an electric part, an epoxy resin composition for laminates, a laminate, a printed wiring board, a curable resin composition and a photosensitive resin composition. The resins and resin compositions of the present invention are used in electronics fields in which a low dielectric constant, a low dielectric loss tangent and high toughness are required and also used for various uses such as coating, bonding and molding.

Abstract translation: 本发明提供了在每个末端具有热固性官能团的双官能亚苯基醚低聚物化合物，含有上述低聚物化合物的环氧树脂及其用途。 也就是说，提供了用于密封电气部件的密封型环氧树脂组合物，层压体用环氧树脂组合物，层压体，印刷线路板，固化性树脂组合物和感光性树脂组合物。 本发明的树脂和树脂组合物用于需要低介电常数，低介电损耗角正切和高韧性的电子领域中，并且还用于各种用途如涂布，粘合和模塑。

公开(公告)号：US20100044090A1

公开(公告)日：2010-02-25

申请号：US12594879

申请日：2008-04-07

Applicant: Tadasuke Endo

Inventor： Tadasuke Endo

IPC: H05K1/16 ,  C08L63/00 ,  C08K5/08 ,  C08K3/34 ,  C08K3/22 ,  H05K1/00

CPC classification number: H05K1/0373 ,  C08G59/08 ,  C08G59/4014 ,  C08G59/621 ,  C08J5/24 ,  C08J2363/00 ,  C08K3/013 ,  C08K5/0041 ,  H05K1/0269 ,  H05K2201/0209 ,  H05K2203/161 ,  Y10T428/24994 ,  Y10T428/31511

Abstract: Provided are a resin composition whose storability is not reduced, a prepreg which uses the resin composition and which is uniformly colored, a laminated board, a multilayer printed wiring board having excellent results in reliability tests such as a thermal shock test and the like, and a semiconductor device. The resin composition is a resin composition for a multilayer printed wiring board, comprising (A) a novolac type epoxy resin, (B) a curing agent, (C) an inorganic filler, and (D) a colorant, wherein the exothermic peak temperature of the resin composition, as measured by DSC, is within ±5° C. of the exothermic peak temperature of a resin composition composed of (A) a novolac type epoxy resin, (B) a curing agent, and (C) an inorganic filler.

Abstract translation: 提供了不降低保存性的树脂组合物，使用该树脂组合物且均匀着色的预浸料，层压板，在热冲击试验等可靠性试验中具有优异结果的多层印刷线路板，以及 半导体器件。 该树脂组合物是一种多层印刷线路板用树脂组合物，其包含（A）酚醛清漆型环氧树脂，（B）固化剂，（C）无机填料和（D）着色剂，其中放热峰温度 由（A）酚醛清漆型环氧树脂，（B）固化剂和（C）无机物形成的树脂组合物的放热峰温度在DSC±5℃以内的树脂组合物的±5℃以内， 填料。

公开(公告)号：US20100043942A1

公开(公告)日：2010-02-25

申请号：US12614576

申请日：2009-11-09

Applicant: Hironori Tanaka ,  Kazuhiro Yoshikawa ,  Naoaki Fujii ,  Atsunari Yamashita

Inventor： Hironori Tanaka ,  Kazuhiro Yoshikawa ,  Naoaki Fujii ,  Atsunari Yamashita

IPC: B32B38/00 ,  B32B38/10

CPC classification number: H05K1/185 ,  H01L24/19 ,  H01L24/82 ,  H01L2223/54426 ,  H01L2224/04105 ,  H01L2224/32225 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2224/92144 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30107 ,  H05K1/0231 ,  H05K1/188 ,  H05K3/382 ,  H05K3/427 ,  H05K3/4602 ,  H05K2201/0187 ,  H05K2201/0209 ,  H05K2201/0355 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/09781 ,  H05K2201/09918 ,  H05K2201/10636 ,  H05K2203/063 ,  Y02P70/611 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A printed wiring board is manufactured by a method in which a laminate body having a first insulation layer and a conductive film is provided. An alignment mark is formed in the laminate body by removing at least a portion of the conductive film. An electronic component is placed on an adhesive layer provided on the first insulation layer at a position determined based on the alignment mark. After the electronic component is enclosed inside an opening of the second insulation layer, a via hole exposing a terminal of the electronic component is formed at a position determined based on the alignment mark used to determine the position of the electronic component. A via conductor is formed in the via hole, and a conductive layer is formed on the conductive film and patterned to form a conductive circuit connected to the via conductor.

Abstract translation: 通过提供具有第一绝缘层和导电膜的层叠体的方法制造印刷线路板。 通过去除导电膜的至少一部分，在层压体中形成对准标记。 将电子部件放置在基于对准标记确定的位置上设置在第一绝缘层上的粘合剂层上。 在将电子部件封装在第二绝缘层的开口内之后，在基于用于确定电子部件的位置的对准标记确定的位置处形成暴露电子部件的端子的通孔。 通孔导体形成在通孔中，导电层形成在导电膜上并被图案化以形成连接到通孔导体的导电电路。

公开(公告)号：US20100028689A1

公开(公告)日：2010-02-04

申请号：US12183425

申请日：2008-07-31

Applicant: Kam-Chuen Yung ,  Tai-Man Yue

Inventor： Kam-Chuen Yung ,  Tai-Man Yue

IPC: B32B15/092

CPC classification number: B05D7/16 ,  B05D2504/00 ,  B05D2601/20 ,  C08G59/38 ,  C08L63/00 ,  C09D163/00 ,  H05K1/056 ,  H05K3/4655 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2201/0358 ,  Y10T428/31529 ,  C08L2666/22

Abstract: A thermal conductive dielectric coated metal-plate includes a metal carrier, and a partially cured dielectric layer coated to the metal carrier. The dielectric layer includes an epoxy resin, a filler, and a coupling agent.

Abstract translation: 导热电介质涂覆的金属板包括金属载体和涂覆到金属载体的部分固化的电介质层。 介电层包括环氧树脂，填料和偶联剂。

公开(公告)号：US20100020497A1

公开(公告)日：2010-01-28

申请号：US12065177

申请日：2006-02-20

Applicant: Haruo Hayakawa ,  Masahiro Ono ,  Seiji Yamaguchi ,  Yoshihiro Uda ,  Kazuhiro Shinchi ,  Satoru Tomekawa ,  Kiyoshi Nakanishi ,  Kosuke Kubota ,  Atsushi Katagiri ,  Motohisa Kotani ,  Kazuhiro Konishi ,  Eiji Nishimura ,  Takeo Matsuki

Inventor： Haruo Hayakawa ,  Masahiro Ono ,  Seiji Yamaguchi ,  Yoshihiro Uda ,  Kazuhiro Shinchi ,  Satoru Tomekawa ,  Kiyoshi Nakanishi ,  Kosuke Kubota ,  Atsushi Katagiri ,  Motohisa Kotani ,  Kazuhiro Konishi ,  Eiji Nishimura ,  Takeo Matsuki

IPC: H05K7/20 ,  H05K7/00

CPC classification number: H05K3/284 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H05K1/0203 ,  H05K1/0218 ,  H05K1/0274 ,  H05K7/20463 ,  H05K9/0047 ,  H05K9/0086 ,  H05K2201/0209 ,  H05K2201/0215 ,  H05K2201/10128 ,  H05K2201/10515 ,  H05K2201/2054 ,  H05K2203/1316 ,  H05K2203/1322 ,  H01L2224/0401

Abstract: It is intended to provide a substrate structure ensuring a shielding property and a heat discharge property of a resin part that collectively covers a plurality of electronic components and capable of downsizing, thinning, and a reduction in number of components. The substrate structure 20 of the first embodiment is provided with a substrate 21, a plurality of electronic components 22 mounted along the substrate 21, and a resin part 25 that covers the electronic components 22 and is in close contact with the substrate 21. In the substrate structure 20, the resin part 25 is provided with a reinforcing heat discharge layer 26 covering the electronic components 22 and having a heat conductivity and a reinforcing property and a shield layer 27 covering the reinforcing heat discharge layer 26, and a surface o28 of the shield layer 27 is formed into a predetermined shape corresponding to a surface structure of the display device 30 adjacent to the resin part 25.

Abstract translation: 旨在提供确保共同覆盖多个电子部件并能够减小，减薄和减少部件数量的树脂部件的屏蔽性和散热性的基板结构。 第一实施例的基板结构20设置有基板21，沿着基板21安装的多个电子部件22和覆盖电子部件22并与基板21紧密接触的树脂部25。 基板结构体20中，树脂部25设置有覆盖电子部件22并具有导热性和增强性的加强放热层26和覆盖加强放热层26的屏蔽层27以及覆盖加强放热层26的表面o28 屏蔽层27形成为与显示装置30的与树脂部25相邻的表面结构对应的规定形状。