公开(公告)号：US07885079B2

公开(公告)日：2011-02-08

申请号：US11536691

申请日：2006-09-29

Applicant: Chun-Jung Chen ,  Jian-Chiun Liou ,  Yu-Hung Chuang

Inventor： Chun-Jung Chen ,  Jian-Chiun Liou ,  Yu-Hung Chuang

IPC: H05K1/00

CPC classification number: H05K1/189 ,  H05K2201/09018

Abstract: A flexible electronic assembly including a flexible circuit board and at least one electronic component is provided. The flexible circuit board includes at least one dielectric film layer and at least one patterned conductive layer disposed on the dielectric film layer. The electronic component is disposed on the flexible circuit board and electrically connected to the flexible circuit board. The flexible angle of the flexible electronic assembly is greater than 5 degrees.

Abstract translation: 提供了一种包括柔性电路板和至少一个电子部件的柔性电子组件。 柔性电路板包括至少一个电介质膜层和设置在电介质膜层上的至少一个图案化导电层。 电子部件设置在柔性电路板上并电连接到柔性电路板。 柔性电子组件的柔性角度大于5度。

公开(公告)号：US07845954B2

公开(公告)日：2010-12-07

申请号：US11995339

申请日：2006-04-17

Applicant: Yoshihiro Tomura ,  Yasushi Nakagiri ,  Kunio Hibino ,  Yoshihiko Yagi ,  Akihiro Miyashita ,  Masahiro Ono ,  Masato Mori

Inventor： Yoshihiro Tomura ,  Yasushi Nakagiri ,  Kunio Hibino ,  Yoshihiko Yagi ,  Akihiro Miyashita ,  Masahiro Ono ,  Masato Mori

IPC: H01R12/00

CPC classification number: H01R12/00 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/1627 ,  H01L2924/19105 ,  H01L2924/19106 ,  H05K1/0284 ,  H05K1/144 ,  H05K1/145 ,  H05K3/28 ,  H05K3/284 ,  H05K3/368 ,  H05K3/403 ,  H05K2201/09018 ,  H05K2201/09845 ,  H05K2201/09909 ,  H05K2201/10378 ,  H05K2201/2018 ,  Y10T29/49117 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A first circuit board (1) mounted with an electronic component (16) and a second circuit board (2) are vertically connected three-dimensionally through an interconnecting board (3) wherein the terminal portion (6) of the land electrode (5) on the interconnecting board (3) is buried in the termination material (9) of the interconnecting board (3). Consequently, the chance of peeling or cracking due to peeling stress or shearing stress acting between the upper/lower circuit boards and the land electrode by high density mounting, thermal shock or falling impact can be suppressed or buffered resulting in high reliability.

Abstract translation: 安装有电子部件（16）和第二电路板（2）的第一电路板（1）通过互连板（3）垂直连接，其中焊盘电极（5）的端子部分（6） 在互连板（3）上的埋设在互连板（3）的端接材料（9）中。 因此，可以抑制或缓冲由于高密度安装，热冲击或落下冲击而在上下电路板和焊盘电极之间作用的剥离应力或剪切应力的剥离或破裂的机会，从而导致高可靠性。

公开(公告)号：US20100215843A1

公开(公告)日：2010-08-26

申请号：US12770489

申请日：2010-04-29

Applicant: Donald C. Sedberry ,  Derek S. Rollins ,  David S. Metzger

Inventor： Donald C. Sedberry ,  Derek S. Rollins ,  David S. Metzger

IPC: H05K3/00

CPC classification number: H05K3/1216 ,  H01Q1/42 ,  H05K1/0284 ,  H05K3/0091 ,  H05K3/4664 ,  H05K2201/09018 ,  H05K2203/1366 ,  H05K2203/1476 ,  H05K2203/1554

Abstract: An electric circuit is applied to an object having a curved surface. The curved surface of the object is divided into sections, and the circuit is applied one section at a time. The circuit is formed between layers of dielectric material. The dielectric is applied by a computer-controlled device, which controls the position of a spray head and the rotation of the object, such that the spray head is held substantially perpendicular to the surface of the object at all times, and such that a controlled thickness of dielectric material can be deposited. The fine-featured circuits formed by the invention are rugged, and can be used on objects intended to be exposed to harsh environments.

公开(公告)号：US07728231B2

公开(公告)日：2010-06-01

申请号：US11577584

申请日：2005-10-24

Applicant: Nobuyuki Matsui ,  Hideo Nagai ,  Keiji Nishimoto ,  Toshifumi Ogata

Inventor： Nobuyuki Matsui ,  Hideo Nagai ,  Keiji Nishimoto ,  Toshifumi Ogata

IPC: H01L33/00

CPC classification number: F21V29/004 ,  F21V19/0055 ,  F21V29/763 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L2224/48091 ,  H01L2224/73265 ,  H05K1/0203 ,  H05K3/0061 ,  H05K2201/09018 ,  H05K2201/10106 ,  Y10S362/80 ,  H01L2924/00014

Abstract: A lighting device includes a heatsink 70, a socket 10 and an LED module 60. The LED module 60 has a light emitting unit 62 in a central part of a top side of a metal base substrate 63 composed of an insulating plate and a metal plate. The LED module 60 is warped such that the central part protrudes on a heatsink 70 side, which is the side opposite to the light emitting unit 62 side. The LED module 60 is mounted on the heatsink 70 in a state of the surrounds of the light emitting unit 62 being pressed according to pressing units 14T, 14L, and 14D of the socket 10. Pressing the surrounds of the light emitting unit 62 against the heatsink 70 ensures that a central part of the warping of the LED module 60 contacts the heatsink 70.

Abstract translation: 照明装置包括散热器70，插座10和LED模块60. LED模块60具有在由绝缘板和金属板构成的金属基底63的顶侧的中心部分中的发光单元62 。 LED模块60翘曲，使得中心部分在与发光单元62侧相反的一侧的散热器70侧突出。 LED模块60在发光单元62的围绕根据插座10的按压单元14T，14L和14D被按压的状态下安装在散热器70上。将发光单元62的环绕压在 散热器70确保LED模块60的翘曲的中心部分接触散热器70。

公开(公告)号：US07726015B2

公开(公告)日：2010-06-01

申请号：US11815528

申请日：2006-02-20

Applicant: Christian Desagulier ,  Alain Lacombe ,  Bruno Esmiller

Inventor： Christian Desagulier ,  Alain Lacombe ,  Bruno Esmiller

IPC: H05K3/02

CPC classification number: H05K3/061 ,  H01Q1/38 ,  H05K1/0284 ,  H05K2201/09018 ,  H05K2203/013 ,  Y10T29/49117 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: The invention concerns a method which consists in coating uniformly the non-developable surface (6) with an electrically conductive material (9), which is in turn coated, by spraying, with a pattern (10) of polymerizable protective material, said pattern being polymerized as it is being formed, and then selectively eliminating, through the openings (10.8) of said pattern (10), the portions of said electrically conductive material (9) which do not over said electrically conductive patterns.

Abstract translation: 本发明涉及一种方法，该方法包括用导电材料（9）均匀地涂覆不可显影表面（9），该导电材料（9）又通过喷涂具有可聚合保护材料的图案（10），所述图案是 然后通过所述图案（10）的开口（10.8）选择性地去除所述导电材料（9）的不超过所述导电图案的部分。

公开(公告)号：US20090226656A1

公开(公告)日：2009-09-10

申请号：US12043424

申请日：2008-03-06

Applicant: Wm. Todd Crandell ,  Anthony Mitchell Johnson ,  Tony Stephen Schweitzer ,  H. Vic Holec

Inventor： Wm. Todd Crandell ,  Anthony Mitchell Johnson ,  Tony Stephen Schweitzer ,  H. Vic Holec

IPC: B32B33/00 ,  B32B37/00

CPC classification number: F21V21/14 ,  B32B33/00 ,  B32B2307/206 ,  B32B2307/302 ,  B32B2311/12 ,  B32B2315/085 ,  F21K9/20 ,  F21V29/70 ,  H05K1/0366 ,  H05K1/189 ,  H05K3/0061 ,  H05K3/0097 ,  H05K2201/09018 ,  H05K2201/10106 ,  H05K2203/1545 ,  Y10T156/10 ,  Y10T428/14 ,  Y10T428/26

Abstract: A layered structure for use with a high power light emitting diode system comprises an electrically insulating intermediate layer interconnecting a top layer and a bottom layer. The top layer, the intermediate layer, and the bottom layer form an at least semi-flexible elongate member having a longitudinal axis and a plurality of positions spaced along the longitudinal axis. The at least semi-flexible elongate member is bendable laterally proximate the plurality of positions spaced along the longitudinal axis to a radius of at least 6 inches, twistable relative to its longitudinal axis up to 10 degrees per inch, and bendable to conform to localized heat sink surface flatness variations having a radius of at least 1 inch. The top layer is pre-populated with electrical components for high wattage, the electrical components including at least one high wattage light emitting diode at least 1.0 Watt per 0.8 inch squared.

Abstract translation: 用于大功率发光二极管系统的分层结构包括互连顶层和底层的电绝缘中间层。 顶层，中间层和底层形成至少半柔性细长构件，其具有纵向轴线和沿着纵向轴线间隔开的多个位置。 所述至少半柔性细长构件在靠近沿着纵向轴线间隔开的多个位置处横向弯曲，至少为6英寸的半径，相对于其纵向轴线可扭转至多达10度/英寸，并且可弯曲以符合局部热 具有至少1英寸半径的凹槽表面平坦度变化。 顶层预先安装有用于高瓦数的电气部件，电气部件包括至少一个高功率发光二极管，每0.8平方英寸至少为1.0瓦特。

公开(公告)号：US20090137085A1

公开(公告)日：2009-05-28

申请号：US12340267

申请日：2008-12-19

Applicant: Jun TSUKANO ,  Kenta Ogawa ,  Takehiko Maeda ,  Shintaro Yamamichi ,  Katsumi Kikuchi

Inventor： Jun TSUKANO ,  Kenta Ogawa ,  Takehiko Maeda ,  Shintaro Yamamichi ,  Katsumi Kikuchi

IPC: H01L21/58

CPC classification number: H05K1/0271 ,  H01L21/4846 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/13 ,  H01L23/49816 ,  H01L23/49827 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/15311 ,  H05K3/205 ,  H05K3/4644 ,  H05K2201/09018 ,  H05K2201/09481 ,  H05K2201/09781 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A wiring substrate includes a base insulating film, a first interconnection formed on a top surface side of the base insulating film, a via conductor provided in a via hole formed in the base insulating film, and a second interconnection provided on a bottom surface side of the base insulating film, the second interconnection being connected to the first interconnection via the via conductor. The wiring substrate includes divided-substrate-unit regions, in each of which the first interconnection, the via conductor, and the second interconnection are formed. The wiring substrate includes a warpage-controlling pattern on the base insulating film, and has a warped shape such that when the wiring substrate is left at rest on a horizontal plate, at least a central part of each side of a plane surface of the substrate contacts the horizontal plate, with both ends of the side raised, where each of the sides extends along a second direction perpendicular to a first direction in the plane surface of the substrate.

Abstract translation: 布线基板包括基底绝缘膜，形成在基底绝缘膜的上表面侧上的第一互连，设置在形成在基底绝缘膜中的通孔中的通孔导体，以及设置在基底绝缘膜的底面侧的第二互连 基底绝缘膜，第二互连件经由通孔导体连接到第一互连件。 布线基板包括分割的基板单元区域，其中形成有第一互连，通孔导体和第二互连。 布线基板包括在基底绝缘膜上的翘曲控制图案，并且具有翘曲形状，使得当布线基板静止在水平板上时，基板的平面的每一侧的至少中心部分 接触水平板，其侧面的两端被凸起，其中每个侧面沿着垂直于基板的平面表面中的第一方向的第二方向延伸。

公开(公告)号：US20090045510A1

公开(公告)日：2009-02-19

申请号：US12187878

申请日：2008-08-07

Applicant: Akihiko NAYA

Inventor： Akihiko NAYA

IPC: H01L23/13 ,  H01L21/58

CPC classification number: H01L24/12 ,  H01L23/49816 ,  H01L24/11 ,  H01L24/16 ,  H01L24/81 ,  H01L27/14618 ,  H01L27/14683 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2224/13147 ,  H01L2224/1403 ,  H01L2224/141 ,  H01L2224/81194 ,  H01L2224/81208 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12043 ,  H01L2924/3511 ,  H05K3/3436 ,  H05K2201/09018 ,  H05K2201/094 ,  Y02P70/613 ,  H01L2924/00

Abstract: A semiconductor device includes a rigid substrate, a flexible solid-state image sensor and bumps. The bumps are aligned along a pair of opposing edges of the rigid substrate, and the diameter of the bumps gradually increases from the center to the ends of the edges. Owing to the difference in diameter of the bumps, the solid-state image sensor is curved convexly to the rigid substrate.

Abstract translation: 半导体器件包括刚性衬底，柔性固态图像传感器和凸块。 凸块沿着刚性基板的一对相对边缘排列，并且凸块的直径从边缘的中心到端部逐渐增加。 由于凸块的直径不同，固态图像传感器凸形地弯曲到刚性基板。

公开(公告)号：US20080043473A1

公开(公告)日：2008-02-21

申请号：US11577584

申请日：2005-10-24

Applicant: Nobuyuki Matsui

Inventor： Nobuyuki Matsui

IPC: F21V29/00 ,  B60Q1/06

CPC classification number: F21V29/004 ,  F21V19/0055 ,  F21V29/763 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L2224/48091 ,  H01L2224/73265 ,  H05K1/0203 ,  H05K3/0061 ,  H05K2201/09018 ,  H05K2201/10106 ,  Y10S362/80 ,  H01L2924/00014

Abstract: A lighting device includes a heatsink 70, a socket 10 and an LED module 60. The LED module 60 has a light emitting unit 62 in a central part of a top side of a metal base substrate 63 composed of an insulating plate and a metal plate. The LED module 60 is warped such that the central part protrudes on a heatsink 70 side, which is the side opposite to the light emitting unit 62 side. The LED module 60 is mounted on the heatsink 70 in a state of the surrounds of the light emitting unit 62 being pressed according to pressing units 14T, 14L, and 14D of the socket 10. Pressing the surrounds of the light emitting unit 62 against the heatsink 70 ensures that a central part of the warping of the LED module 60 contacts the heatsink 70.

Abstract translation: 照明装置包括散热器70，插座10和LED模块60。 LED模块60在由绝缘板和金属板构成的金属基底63的上侧的中央部分具有发光单元62。 LED模块60翘曲，使得中心部分在与发光单元62侧相反的一侧的散热器70侧突出。 LED模块60在发光单元62的周围被按压插座10的按压单元14T，14L和14D的状态下安装在散热器70上。 将发光单元62的周围压靠散热器70确保LED模块60的翘曲的中心部分接触散热器70。

公开(公告)号：US06998222B2

公开(公告)日：2006-02-14

申请号：US10380293

申请日：2001-08-17

Applicant: Florian Wiest ,  Ignaz Eisele

Inventor： Florian Wiest ,  Ignaz Eisele

IPC: G03F7/00 ,  G03F7/20

CPC classification number: H01F41/041 ,  G03F7/164 ,  H05K1/0284 ,  H05K3/0082 ,  H05K3/108 ,  H05K3/403 ,  H05K2201/09018 ,  H05K2203/135

Abstract: A method for producing an electrically conductive structure on a non-planar surface includes depositing a photosensitive resist coating onto the non-planar surface, exposing the photosensitive resist coating, removing a portion of the photosensitive resist coating, and depositing an electrically-conductive material onto portions of the non-planar surface that is substantially free of the photosensitive resist coating.

Abstract translation: 用于在非平面表面上制造导电结构的方法包括在非平面表面上沉积光敏抗蚀剂涂层，暴露光敏抗蚀剂涂层，去除一部分光敏抗蚀剂涂层，以及将导电材料沉积到 基本上不含光敏抗蚀剂涂层的非平面表面的部分。