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公开(公告)号：US20110299044A1
公开(公告)日：2011-12-08
申请号：US13212212
申请日：2011-08-18
Applicant: Wen-Yung Yeh , Chia-Hsin Chao , Yu-Hung Chuang , Chia-Ling Li , Chun-Feng Lai , Hsi-Hsuan Yen , Sheng-Chieh Tai , Kuang-Yu Tai , Tse-Peng Chen
Inventor： Wen-Yung Yeh , Chia-Hsin Chao , Yu-Hung Chuang , Chia-Ling Li , Chun-Feng Lai , Hsi-Hsuan Yen , Sheng-Chieh Tai , Kuang-Yu Tai , Tse-Peng Chen
CPC classification number: H04N9/315 , G03B21/005 , H01L27/156 , H01L33/504 , H01L33/60 , H01L2933/0083
Abstract: A projection apparatus is provided. The projection apparatus includes a light-emitting unit array, an optical sensor, and a control unit. The light-emitting unit array is for emitting an image beam. The optical sensor is for detecting electromagnetic waves so as to generate a signal. The control unit is electrically coupled to the light-emitting unit array and the optical sensor for controlling emission of the light-emitting unit array according to the signal from the optical sensor.
Abstract translation: 提供投影装置。 投影装置包括发光单元阵列，光学传感器和控制单元。 发光单元阵列用于发射图像束。 光学传感器用于检测电磁波以产生信号。 控制单元电耦合到发光单元阵列和光学传感器，用于根据来自光学传感器的信号控制发光单元阵列的发射。
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公开(公告)号：US20100321640A1
公开(公告)日：2010-12-23
申请号：US12781419
申请日：2010-05-17
Applicant: Wen Yung YEH , Yu Hung Chuang , Chia Hsin Chao , Chia Ling Li , Tse Peng Chen
Inventor： Wen Yung YEH , Yu Hung Chuang , Chia Hsin Chao , Chia Ling Li , Tse Peng Chen
IPC: G03B21/00
CPC classification number: G03B21/005
Abstract: A projection display chip comprises a micro light emitting array comprising a plurality of micro LEDs, a micro collimation array comprising a plurality of micro collimation devices, and a projection micro lens array comprising a plurality of micro lenses. Each micro LED has a corresponding driving circuit device. The plurality of micro lenses has different optical axes to enlarge projected images.
Abstract translation: 投影显示芯片包括包括多个微型LED的微发光阵列，包括多个微准直装置的微准直阵列和包括多个微透镜的投影微透镜阵列。 每个微型LED都具有相应的驱动电路装置。 多个微透镜具有不同的光轴以放大投影图像。
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公开(公告)号：US08573784B2
公开(公告)日：2013-11-05
申请号：US13212212
申请日：2011-08-18
Applicant: Wen-Yung Yeh , Chia-Hsin Chao , Yu-Hung Chuang , Chia-Ling Li , Chun-Feng Lai , Hsi-Hsuan Yen , Sheng-Chieh Tai , Kuang-Yu Tai , Tse-Peng Chen
Inventor： Wen-Yung Yeh , Chia-Hsin Chao , Yu-Hung Chuang , Chia-Ling Li , Chun-Feng Lai , Hsi-Hsuan Yen , Sheng-Chieh Tai , Kuang-Yu Tai , Tse-Peng Chen
IPC: G03B21/16
CPC classification number: H04N9/315 , G03B21/005 , H01L27/156 , H01L33/504 , H01L33/60 , H01L2933/0083
Abstract: A projection apparatus is provided. The projection apparatus includes a light-emitting unit array, an optical sensor, and a control unit. The light-emitting unit array is for emitting an image beam. The optical sensor is for detecting electromagnetic waves so as to generate a signal. The control unit is electrically coupled to the light-emitting unit array and the optical sensor for controlling emission of the light-emitting unit array according to the signal from the optical sensor.
Abstract translation: 提供投影装置。 投影装置包括发光单元阵列，光学传感器和控制单元。 发光单元阵列用于发射图像束。 光学传感器用于检测电磁波以产生信号。 控制单元电耦合到发光单元阵列和光学传感器，用于根据来自光学传感器的信号控制发光单元阵列的发射。
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Patent Agency Ranking
公开(公告)号：US20080041617A1
公开(公告)日：2008-02-21
申请号：US11536691
申请日：2006-09-29
Applicant: Chun-Jung Chen , Jian-Chiun Liou , Yu-Hung Chuang
Inventor： Chun-Jung Chen , Jian-Chiun Liou , Yu-Hung Chuang
IPC: H05K1/16
CPC classification number: H05K1/189 , H05K2201/09018
Abstract: A flexible electronic assembly including a flexible circuit board and at least one electronic component is provided. The flexible circuit board includes at least one dielectric film layer and at least one patterned conductive layer disposed on the dielectric film layer. The electronic component is disposed on the flexible circuit board and electrically connected to the flexible circuit board. The flexible angle of the flexible electronic assembly is greater than 5 degrees.
Abstract translation: 提供了一种包括柔性电路板和至少一个电子部件的柔性电子组件。 柔性电路板包括至少一个电介质膜层和设置在电介质膜层上的至少一个图案化导电层。 电子部件设置在柔性电路板上并电连接到柔性电路板。 柔性电子组件的柔性角度大于5度。
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公开(公告)号：US20110297975A1
公开(公告)日：2011-12-08
申请号：US13212208
申请日：2011-08-18
Applicant: Wen-Yung Yeh , Chia-Hsin Chao , Yu-Hung Chuang , Chia-Ling Li , Chun-Feng Lai , Hsi-Hsuan Yen , Sheng-Chieh Tai , Kuang-Yu Tai , Tse-Peng Chen
Inventor： Wen-Yung Yeh , Chia-Hsin Chao , Yu-Hung Chuang , Chia-Ling Li , Chun-Feng Lai , Hsi-Hsuan Yen , Sheng-Chieh Tai , Kuang-Yu Tai , Tse-Peng Chen
IPC: H01L27/15
CPC classification number: H04N9/315 , G03B21/005 , H01L27/156 , H01L33/504 , H01L33/60 , H01L2933/0083
Abstract: A light-emitting unit array includes a plurality of light-emitting units arranged and integrated monolithically in an array, and each of the light-emitting units includes a first doped type layer, a second doped type layer, a light-emission layer, and a photonic crystal structure. The light emission layer is disposed between the first doped type layer and the second doped type layer, wherein the second doped type layer has a surface facing away from the light emission layer. The photonic crystal structure is disposed on the surface of the second doped type layer.
Abstract translation: 发光单元阵列包括以阵列的方式排列并集成的多个发光单元，并且每个发光单元包括第一掺杂型层，第二掺杂型层，发光层和 光子晶体结构。 发光层设置在第一掺杂型层和第二掺杂型层之间，其中第二掺杂型层具有背离发光层的表面。 光子晶体结构设置在第二掺杂型层的表面上。
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公开(公告)号：US07108961B2
公开(公告)日：2006-09-19
申请号：US10702555
申请日：2003-11-07
Applicant: Chi-Ming Huang , Chia-Tai Chen , Yu-Hung Chuang , Jian-Chiun Lion , Chien-Hung Liu , Chun-Jung Chen
Inventor： Chi-Ming Huang , Chia-Tai Chen , Yu-Hung Chuang , Jian-Chiun Lion , Chien-Hung Liu , Chun-Jung Chen
IPC: B41J2/16
CPC classification number: B41J2/16 , B41J2/1625 , B41J2/1626 , B41J2/1631 , B41J2/1639 , H05K3/0023 , H05K3/205 , H05K2201/09063 , H05K2201/0969
Abstract: A component for the inkjet print head and the manufacturing method thereof are disclosed where photosensitive polymer is used as the substrate. Orifices and ink chambers are made on the substrate by photolithography. Conductive traces for interconnection to a print head chip are integrated to the substrate by combining photolithography and electroforming procedures.
Abstract translation: 公开了一种用于喷墨打印头的部件及其制造方法，其中使用光敏聚合物作为基底。 通过光刻在基板上制造孔和墨室。 用于与打印头芯片互连的导电迹线通过组合光刻和电铸工艺而集成到衬底中。
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公开(公告)号：US07885079B2
公开(公告)日：2011-02-08
申请号：US11536691
申请日：2006-09-29
Applicant: Chun-Jung Chen , Jian-Chiun Liou , Yu-Hung Chuang
Inventor： Chun-Jung Chen , Jian-Chiun Liou , Yu-Hung Chuang
IPC: H05K1/00
CPC classification number: H05K1/189 , H05K2201/09018
Abstract: A flexible electronic assembly including a flexible circuit board and at least one electronic component is provided. The flexible circuit board includes at least one dielectric film layer and at least one patterned conductive layer disposed on the dielectric film layer. The electronic component is disposed on the flexible circuit board and electrically connected to the flexible circuit board. The flexible angle of the flexible electronic assembly is greater than 5 degrees.
Abstract translation: 提供了一种包括柔性电路板和至少一个电子部件的柔性电子组件。 柔性电路板包括至少一个电介质膜层和设置在电介质膜层上的至少一个图案化导电层。 电子部件设置在柔性电路板上并电连接到柔性电路板。 柔性电子组件的柔性角度大于5度。
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公开(公告)号：US20050045582A1
公开(公告)日：2005-03-03
申请号：US10702555
申请日：2003-11-07
Applicant: Chi-Ming Huang , Chia-Tai Chen , Yu-Hung Chuang , Jian-Chiun Lion , Chien-Hung Liu , Chun-Jung Chen
Inventor： Chi-Ming Huang , Chia-Tai Chen , Yu-Hung Chuang , Jian-Chiun Lion , Chien-Hung Liu , Chun-Jung Chen
CPC classification number: B41J2/16 , B41J2/1625 , B41J2/1626 , B41J2/1631 , B41J2/1639 , H05K3/0023 , H05K3/205 , H05K2201/09063 , H05K2201/0969
Abstract: A component for the inkjet print head and the manufacturing method thereof are disclosed where photosensitive polymer is used as the substrate. Orifices and ink chambers are made on the substrate by photolithography. Conductive traces for interconnection to a print head chip are integrated to the substrate by combining photolithography and electroforming procedures.
Abstract translation: 公开了一种用于喷墨打印头的部件及其制造方法，其中使用光敏聚合物作为基底。 通过光刻在基板上制造孔和墨室。 用于与打印头芯片互连的导电迹线通过组合光刻和电铸工艺而集成到衬底中。
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