Abstract:
Disclosed is a micro-electro-mechanical switch, including a substrate having a gate connection, a source connection, a drain connection and a switch structure, coupled to the substrate. The switch structure includes a beam member, an anchor, an anchor beam interface and a hinge. The beam member having a length sufficient to overhang both the gate connection and the drain connection. The anchor coupling the switch structure to the substrate. The anchor beam interface coupling the anchor to the hinge. The hinge coupling the beam member to the anchor at a respective position along the anchor's length, the hinge to flex in response to a voltage differential established between the gate and the beam member. The switch structure having gaps between the substrate and the anchor in regions proximate to the hinges.
Abstract:
The present disclosure provides a system and method for controlling positioning of a movable member of a MEMS microactuator to reduce bouncing and ringing. The system includes control circuitry in communication with the MEMS microactuator. The control circuitry is adapted to linearly increase an actuation signal from a first state to a second state to urge the movable member from a first position to a second position and hold the movable member in the second position. The control circuitry is further adapted to linearly decrease the actuation signal from the second state to the first state to release the movable member to the first position. A transition time is not less than the inverse of one quarter of a natural frequency of the movable member as the movable member moves to the first position.
Abstract:
A MEMS device comprises first and second opposing electrode arrangements (22,28), wherein the second electrode arrangement (28) is electrically movable to vary the electrode spacing between facing sides of the first and second electrode arrangements. At least one of the facing sides has a non-flat surface with at least one peak and at least one trough. The height of the peak and depth of the trough is between 0.01t and 0.1t where t is the thickness of the movable electrode.
Abstract:
Planar cavity Micro-Electro-Mechanical System (MEMS) structures, methods of manufacture and design structure are provided. The method includes forming at least one Micro-Electro-Mechanical System (MEMS) cavity having a planar surface using a reverse damascene process.
Abstract:
A method of forming at least one Micro-Electro-Mechanical System (MEMS) includes patterning a wiring layer to form at least one fixed plate and forming a sacrificial material on the wiring layer. The method further includes forming an insulator layer of one or more films over the at least one fixed plate and exposed portions of an underlying substrate to prevent formation of a reaction product between the wiring layer and a sacrificial material. The method further includes forming at least one MEMS beam that is movable over the at least one fixed plate. The method further includes venting or stripping of the sacrificial material to form at least a first cavity.
Abstract:
Disclosed is a micro-electro-mechanical switch, including a substrate having a gate connection, a source connection, a drain connection and a switch structure, coupled to the substrate. The switch structure includes a beam member, an anchor and a hinge. The beam member having a length sufficient to overhang both the gate connection and the drain connection. The anchor coupling the switch structure to the substrate, the anchor having a width. The hinge coupling the beam member to the anchor at a respective position along the anchor's length, the hinge to flex in response to a charge differential established between the gate and the beam member. The switch structure having gaps between the substrate and the anchor in regions proximate to the hinges.
Abstract:
An active matrix organic LED display having a matrix of multiple light emitting pixels and electronic drive circuitry for selectively addressing the pixels, each pixel containing an organic LED. The electronic drive circuitry includes row scan electrodes and column data electrodes that interconnect the matrix of pixels. The circuitry also includes a MEMS switching device and a memory capacitor for each pixel, the MEMS switching device connecting the memory capacitor to a column data electrode during addressing of a pixel and connecting the memory capacitor to the organic LED of each pixel during light emission.
Abstract:
A device and a method are described which hermetically seals at least one microstructure within a cavity. Electrical access to the at least one microstructure is provided by through wafer vias formed through a via substrate which supports the at least one microstructure on its front side. The via substrate and a lid wafer may form a hermetic cavity which encloses the at least one microstructure. The through wafer vias are connected to bond pads located outside the cavity by an interconnect structure formed on the back side of the via substrate. Because they are outside the cavity, the bond pads may be placed inside the perimeter of the bond line forming the cavity, thereby greatly reducing the area occupied by the device. The through wafer vias also shorten the circuit length between the microstructure and the interconnect, thus improving heat transfer and signal loss in the device.
Abstract:
Mechanical springs and sliders as used in microfabricated actuators to provide an asymmetric spring constant are described. The asymmetric spring constant provides a propensity for deflection towards one direction, and a propensity for separation (i.e. restoration) towards the other direction. The asymmetry and slider system provides a passive mechanical means to achieve faster switching times and higher switch restoring forces.
Abstract:
High-frequency circuit components are disclosed in which parasitic capacitance between a high-frequency circuit element and a substrate is reduced and mechanical strength is improved. An exemplary component has a conductive substrate, a coil as the high-frequency circuit-element, a mounting board including a thin dielectric film on which the coil is mounted, and a support board that couples the mounting board to the substrate. The mounting board is coupled so that it floats relative to the substrate as a result of deliberate warping of the support board.