公开(公告)号：US08345895B2

公开(公告)日：2013-01-01

申请号：US12179871

申请日：2008-07-25

Applicant: Li-Che Chen

Inventor： Li-Che Chen

IPC: H04R25/00

CPC classification number: B81B3/0078 ,  B81B2201/0257 ,  B81B2203/0127 ,  H04R7/06 ,  H04R19/005 ,  H04R19/04

Abstract: A diaphragm of an MEMS electroacoustic transducer including a first axis-symmetrical pattern layer is provided. Because the layout of the first axis-symmetrical pattern layer can match the pattern of the sound wave, the vibration uniformity of the diaphragm can be improved.

公开(公告)号：US20120319217A1

公开(公告)日：2012-12-20

申请号：US13162088

申请日：2011-06-16

Applicant: Alfons Dehe ,  Stefan Barzen ,  Wolfgang Friza ,  Wolfgang Klein

Inventor： Alfons Dehe ,  Stefan Barzen ,  Wolfgang Friza ,  Wolfgang Klein

IPC: H01L29/84 ,  H01L21/20

CPC classification number: H04R31/003 ,  B81B3/001 ,  B81B3/0072 ,  B81B2201/0257 ,  H04R7/14 ,  H04R19/005 ,  H04R19/04

Abstract: In one embodiment, a method of manufacturing a semiconductor device includes oxidizing a substrate to form local oxide regions that extend above a top surface of the substrate. A membrane layer is formed over the local oxide regions and the top surface of the substrate. A portion of the substrate under the membrane layer is removed. The local oxide regions under the membrane layer is removed.

Abstract translation: 在一个实施例中，制造半导体器件的方法包括氧化衬底以形成在衬底的顶表面上方延伸的局部氧化物区域。 在局部氧化物区域和衬底的顶表面上形成膜层。 去除膜层下面的一部分基底。 去除膜层下面的局部氧化物区域。

公开(公告)号：US08330239B2

公开(公告)日：2012-12-11

申请号：US12432289

申请日：2009-04-29

Applicant: Jinbang Tang ,  Lianjun Liu

Inventor： Jinbang Tang ,  Lianjun Liu

IPC: G01L9/00

CPC classification number: B81B7/0064 ,  B81B2201/0257 ,  B81B2207/017 ,  H01L24/12 ,  H01L24/16 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/3025 ,  H04R19/005 ,  H04R19/04 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A device comprises a conductive substrate, a micro electromechanical systems (MEMS) structure, and a plurality of bond pads. The conductive substrate has a first side and a second side, the second side opposite the first side. The MEMS structure is formed over the first side of the conductive substrate. The plurality of bond pads are formed over the first side of the conductive substrate and electrically coupled to the first side of the conductive substrate. The conductive substrate and plurality of bond pads function to provide electrostatic shielding to the MEMS structure.

Abstract translation: 一种器件包括导电衬底，微机电系统（MEMS）结构和多个接合焊盘。 导电基板具有第一侧和第二侧，第二侧与第一侧相对。 MEMS结构形成在导电衬底的第一侧上。 多个接合焊盘形成在导电衬底的第一侧上并电耦合到导电衬底的第一侧。 导电衬底和多个接合焊盘用于向MEMS结构提供静电屏蔽。

公开(公告)号：US20120299131A1

公开(公告)日：2012-11-29

申请号：US13472980

申请日：2012-05-16

Applicant: Gudrun Henn

Inventor： Gudrun Henn

IPC: H01L29/84 ,  H01L21/56

CPC classification number: B81C1/00293 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2201/0271 ,  B81B2207/096 ,  B81C2203/0136 ,  H01L2224/73204 ,  H01L2924/1461 ,  H01L2924/00

Abstract: An arrangement and a production method for the arrangement with at least one MEMS device, which comprises a package that closely encloses the MEMS device and seals it from ambient influences. The package comprises as sealing a PFPE layer of a perfluoropolyether polymerized with the aid of functional groups.

Abstract translation: 一种用于与至少一个MEMS器件的布置的布置和制造方法，其包括紧密包围MEMS器件并将其与环境影响密封的封装。 封装包括密封一个借助于官能团聚合的全氟聚醚的PFPE层。

公开(公告)号：US08309386B2

公开(公告)日：2012-11-13

申请号：US12244840

申请日：2008-10-03

Applicant: Jason W. Weigold

Inventor： Jason W. Weigold

IPC: H01L21/00

CPC classification number: B81C1/00944 ,  B81B2201/0257 ,  H04R19/005

Abstract: A method of forming a microphone forms a backplate, and a flexible diaphragm on at least a portion of a wet etch removable sacrificial layer. The method adds a wet etch resistant material, where a portion of the wet etch resistant material is positioned between the diaphragm and the backplate to support the diaphragm. Some of the wet etch resistant material is not positioned between the diaphragm and backplate. The method then removes the sacrificial material before removing any of the wet etch resistant material added during the prior noted act of adding. The wet etch resistant material then is removed substantially in its entirety after removing at least part of the sacrificial material.

Abstract translation: 形成麦克风的方法在湿蚀刻可移除牺牲层的至少一部分上形成背板和柔性隔膜。 该方法添加了耐湿蚀刻材料，其中一部分耐湿蚀刻材料位于隔膜和背板之间以支撑隔膜。 一些耐湿蚀刻材料不位于隔膜和背板之间。 然后，该方法在去除在先前提及的添加作用之前添加的任何耐湿蚀蚀材料之前，去除牺牲材料。 然后在去除至少部分牺牲材料之后基本上全部除去耐湿蚀刻材料。

公开(公告)号：US08295514B2

公开(公告)日：2012-10-23

申请号：US12249343

申请日：2008-10-10

Applicant: Chung Dam Song

Inventor： Chung Dam Song

IPC: H04R25/00 ,  H04R9/08

CPC classification number: H04R19/04 ,  B81B7/0064 ,  B81B2201/0257 ,  H04R19/005

Abstract: Provided is a MEMS microphone package having a sound hole in a PCB, which can ground-connect a metal case to a main board using an assembly process including bending and clamping an end of the case. The MEMS microphone package includes a tetragonal container-shaped metal case having an open-side to insert components into an inner space, and a chamfered end on the open-side to easily perform a curling operation, a printed circuit board (PCB) substrate to which a MEMS microphone chip and an application specific integrated circuit (ASIC) chip are mounted, the PCB substrate being inserted into the metal case and having a sound hole for introducing an external sound, and a support configured to support the PCB substrate in the curling operation and define a space between the metal case and the PCB substrate.

Abstract translation: 提供了一种MEMS麦克风封装，其在PCB中具有声孔，其可以使用包括弯曲和夹紧外壳的端部的组装工艺将金属外壳与主板接地连接。 MEMS麦克风封装包括具有开口侧的四边形容器状金属壳体，以将部件插入内部空间，并且在开口侧上的倒角端容易地进行卷曲操作，印刷电路板（PCB）基板 其中安装了MEMS麦克风芯片和专用集成电路（ASIC）芯片，PCB基板插入金属外壳并具有用于引入外部声音的声孔，以及被配置为将PCB基板支撑在卷曲中的支撑 操作并限定金属外壳和PCB基板之间的空间。

公开(公告)号：US20120189144A1

公开(公告)日：2012-07-26

申请号：US13357158

申请日：2012-01-24

Applicant: Michael D. Delaus ,  Kathleen O'Donnell

Inventor： Michael D. Delaus ,  Kathleen O'Donnell

IPC: H04R1/00 ,  H05K3/32

CPC classification number: B81C1/0023 ,  B81B2201/0257 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/73265 ,  H01L2924/10253 ,  H01L2924/1461 ,  H01L2924/3025 ,  Y10T29/4913 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A packaged microphone has a base with a top face, a lid coupled to the base and forming an interior, and a MEMS microphone (i.e., a die or chip) secured to the top face of the base within the interior. The packaged microphone also includes a circuit chip secured to the top face of the base within the interior. The circuit chip has a top surface with a top pad, a bottom surface with a bottom pad, and a via. The bottom pad is electrically connected to the base, and the via electrically connects the top pad with the bottom pad. A wire bond is connected between the MEMS microphone and the top pad on the circuit chip. The MEMS microphone is electrically connected to the bottom pad and the base through the via.

Abstract translation: 封装的麦克风具有底部，其具有顶面，连接到基座并形成内部的盖，以及固定到内部的基部的顶面的MEMS麦克风（即，模具或芯片）。 封装的麦克风还包括固定到内部的基座顶面的电路芯片。 电路芯片具有顶表面，其具有顶部焊盘，底部表面具有底部焊盘和通孔。 底部焊盘电连接到基座，并且通孔将顶部焊盘与底部焊盘电连接。 引线键连接在MEMS麦克风和电路芯片上的顶部焊盘之间。 MEMS麦克风通过通孔电连接到底垫和底座。

公开(公告)号：US08208671B2

公开(公告)日：2012-06-26

申请号：US12355432

申请日：2009-01-16

Applicant: Thomas Chen ,  Michael Judy

Inventor： Thomas Chen ,  Michael Judy

IPC: H04R19/04 ,  G01L9/00

CPC classification number: B81C1/00539 ,  B81B3/0078 ,  B81B2201/0257

Abstract: A MEMS microphone has a backplate, a diaphragm movable relative to the backplate, and a backside cavity adjacent to the backplate or the diaphragm. The backside cavity has sidewalls with at least one rib protruding inward toward a center of the backside cavity.

Abstract translation: MEMS麦克风具有背板，相对于背板可移动的隔膜以及与背板或隔膜相邻的背侧空腔。 背侧空腔具有侧壁，至少一个肋朝着背侧空腔的中心向内突出。

公开(公告)号：US08203190B2

公开(公告)日：2012-06-19

申请号：US12825131

申请日：2010-06-28

Applicant: Jason P. Goodelle ,  Kaigham J. Gabriel

Inventor： Jason P. Goodelle ,  Kaigham J. Gabriel

IPC: H01L23/06 ,  H01L29/84

CPC classification number: B81C1/00333 ,  B81B2201/0257 ,  B81B2207/096 ,  B81C2203/0109 ,  H01L2224/48091 ,  H01L2924/10253 ,  H01L2924/1461 ,  H04R1/04 ,  H04R19/016 ,  H04R31/006 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A MEMS device includes a chip carrier having an acoustic port extending from a first surface to a second surface of the chip carrier, a MEMS die disposed on the chip carrier to cover the acoustic port at the first surface of the chip carrier, and an enclosure bonded to the chip carrier and encapsulating the MEMS die.

Abstract translation: MEMS器件包括具有从芯片载体的第一表面延伸到第二表面的声学端口的芯片载体，设置在芯片载体上以覆盖芯片载体的第一表面处的声学端口的MEMS管芯，以及壳体 结合到芯片载体并封装MEMS管芯。

公开(公告)号：US20120146163A1

公开(公告)日：2012-06-14

申请号：US13206466

申请日：2011-08-09

Applicant: Tzong-Che Ho ,  Chin-Fu Kuo ,  Hsin-Li Lee ,  Yao-Jung Lee ,  Li-Chi Pan

Inventor： Tzong-Che Ho ,  Chin-Fu Kuo ,  Hsin-Li Lee ,  Yao-Jung Lee ,  Li-Chi Pan

IPC: H01L29/84 ,  H01L21/30

CPC classification number: B81C1/00309 ,  B81B2201/0257 ,  B81C1/0023 ,  H01L2224/11 ,  H04R19/005 ,  H04R19/04 ,  H04R31/00

Abstract: A microphone package structure is provided, including an integrated circuit (IC) structure and a microphone structure disposed thereover and electrically connected therewith. The IC structure includes a first semiconductor substrate with opposite first and second surfaces, and a first through hole disposed in and through the first semiconductor substrate. The microphone structure includes: a second semiconductor substrate with opposite third and fourth surfaces, wherein the third surface faces to the second surface of the first semiconductor substrate; a second through hole disposed in and through the second semiconductor substrate; an acoustic sensing device embedded in the second through hole and adjacent to the third surface; and a sealing layer disposed over the fourth surface of the second semiconductor substrate, defining a back chamber with the sealing layer, wherein the first through hole allows acoustic pressure waves to penetrate and pass therethrough to the acoustic sensing device.

Abstract translation: 提供了麦克风封装结构，包括集成电路（IC）结构和设置在其上并与之电连接的麦克风结构。 IC结构包括具有相对的第一和第二表面的第一半导体衬底和设置在第一半导体衬底中并穿过第一半导体衬底的第一通孔。 麦克风结构包括：具有相对的第三和第四表面的第二半导体衬底，其中第三表面面对第一半导体衬底的第二表面; 设置在所述第二半导体衬底中并穿过所述第二半导体衬底的第二通孔; 声学传感装置，其嵌入在所述第二通孔中并与所述第三表面相邻; 以及密封层，其设置在所述第二半导体衬底的所述第四表面上，限定具有所述密封层的后室，其中所述第一通孔允许声压波穿透并穿过所述声学感测装置。