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公开(公告)号：US20240262680A1
公开(公告)日：2024-08-08
申请号：US18562689
申请日：2022-05-20
Applicant: SILMACH , CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE (CNRS) , UNIVERSITE DE FRANCHE-COMTE
Inventor： Marc Sworowski , Cédric Vuillemin , Haythem AMEUR , Gilles BOURBON , Patrice LE MOAL
IPC: B81B7/00
CPC classification number: B81B7/008 , B81B2201/033 , B81B2203/0136 , B81B2203/0172 , B81B2203/056
Abstract: The invention relates to a method for controlling a microelectromechanical system by means of an electrical control signal alternating between a maximum voltage value (Vmax) and a minimum voltage value (Vmin), wherein, during the transition from the maximum voltage value (Vmax) to the minimum voltage value (Vmin), the value of the voltage of the electrical control signal monotonously decreases from the maximum voltage value (Vmax) to the minimum voltage value (Vmin), which signal comprising, in sequential order:
a first slope between the maximum voltage value (Vmax) and a first voltage threshold value (Vend),
a second slope, having a lower absolute value than the first slope, between the first voltage threshold value (Vend) and a second voltage threshold value (Vstart), and
a third slope, having a higher absolute value than the second slope, between the second voltage threshold value (Vstart) and the minimum voltage value (Vmin).-
公开(公告)号：US12054384B2
公开(公告)日：2024-08-06
申请号：US16950782
申请日：2020-11-17
Inventor： Peter Duerr , Andreas Neudert
CPC classification number: B81B3/0051 , G02B26/0841 , H02N1/008 , B81B2201/033 , B81B2201/042 , B81B2203/0163
Abstract: A MEMS includes a substrate with a substrate extension that rises above a substrate plane. The MEMS includes a movable structural element, a first spring element that mechanically connects the movable structural element to the substrate extension, and a second spring element that mechanically connects the movable structural element to the substrate extension. The first spring element and the second spring element form a parallelogram guide of the movable structural element in relation to the substrate extension.
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公开(公告)号：US12007555B2
公开(公告)日：2024-06-11
申请号：US16948051
申请日：2020-08-28
Applicant: Lumentum Operations LLC
Inventor： Wenlin Jin , Maziar Moradi , Gonzalo Wills , Stephen Bagnald
CPC classification number: G02B26/0841 , B81B3/0045 , G01S7/4817 , H02N1/008 , B81B2201/033 , B81B2201/042 , B81B2203/0154 , B81B2203/0307
Abstract: A micro-electro-mechanical system (MEMS) device may comprise a first layer that includes a stator comb actuator; a second layer that includes a rotor comb actuator; a mirror structure that includes a mirror; and a first set of hinges and a second set of hinges configured to tilt the mirror structure about a first axis of the MEMS device based on a driving torque caused by the stator comb actuator engaging with the rotor comb actuator. The first set of hinges may be configured to resist a lateral linear force on the mirror structure in a direction associated with the first axis caused by the stator comb actuator engaging with the rotor comb actuator. The second set of hinges may be configured to resist an in-plane torque on the mirror structure about a second axis of the MEMS device caused by the stator comb actuator engaging with the rotor comb actuator.
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公开(公告)号：US11993512B2
公开(公告)日：2024-05-28
申请号：US17694296
申请日：2022-03-14
Inventor： Yang-Che Chen , Victor Chiang Liang , Chen-Hua Lin , Chwen-Ming Liu , Huang-Wen Tseng , Yi-Chuan Teng
CPC classification number: B81B7/04 , B81C3/001 , B81B2201/033 , B81B2203/0136 , B81B2203/0307 , B81B2203/04 , B81C1/00357 , B81C1/00468 , B81C1/00476 , B81C1/00484 , B81C2201/0132 , B81C2203/038
Abstract: A micro electro mechanical system (MEMS) includes a circuit substrate, a first MEMS structure disposed over the circuit substrate, and a second MEMS structure disposed over the first MEMS structure.
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公开(公告)号：US20230358975A1
公开(公告)日：2023-11-09
申请号：US18004909
申请日：2021-07-09
Applicant: NIHARIKA KOHLI , MICHAEL MENARD , FREDERIC NABKI , SURAJ SHARMA
Inventor： NIHARIKA KOHLI , MICHAEL MENARD , FREDERIC NABKI , SURAJ SHARMA
CPC classification number: G02B6/421 , G02F1/0142 , G02B6/4213 , G02F1/212 , B81B3/0062 , B81B2201/047 , B81B2201/033 , B81B2203/055
Abstract: Silicon photonics provides an attractive platform for optoelectronic integrated circuits (OEICs) exploiting hybrid or monolithic integration with or without concurrent integration of microelectromechanical systems (MEMS) and/or CMOS electronic. Such OEICs offering optical component solutions across multiple applications from optical sensors through to optical networks operating upon one or more wavelengths. Accordingly, various silicon photonic building blocks are required in order to provide a toolkit for a circuit designer to exploit OEICs where these building blocks must address specific aspects of OEICs such as polarisation dependency of the optical waveguides. Accordingly, the inventors have established designs for:
polarisation rotators with MEMS based tuning to allow the dual polarisations from a polarisation splitter to be managed by an OEIC operating upon a single polarisation;
analog or digital phase shifts with MEMS actuation for switches, attenuators etc.; and
passband filters with MEMS tuning.-
Patent Agency Ranking
公开(公告)号：US11740452B2
公开(公告)日：2023-08-29
申请号：US16625702
申请日：2018-07-06
Applicant: HAMAMATSU PHOTONICS K.K.
Inventor： Tatsuya Sugimoto , Tomofumi Suzuki , Kyosuke Kotani
CPC classification number: G02B26/0841 , B81B3/0045 , G01J3/021 , G01J3/0202 , G01J3/45 , B81B2201/033 , B81B2201/042 , B81B2203/0136 , B81B2203/0154 , B81B2203/04
Abstract: An optical device includes: a base that includes a main surface; a movable unit that includes an optical function unit; and an elastic support unit that is connected between the base and the movable unit, and supports the movable unit so that the movable unit is movable along a first direction perpendicular to the main surface. The elastic support unit includes a lever, a first torsion support portion that extends along a second direction perpendicular to the first direction and is connected between the lever and the movable unit, and a second torsion support portion that extends along the second direction and is connected between the lever and the base. A torsional spring constant of the first torsion support portion is greater than a torsional spring constant of the second torsion support portion.
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227.发明公开公开(公告)号：US20230253895A1
公开(公告)日：2023-08-10
申请号：US18161740
申请日：2023-01-30
Applicant: STMICROELECTRONICS S.r.l.
Inventor： Andrea OPRENI , Valentina ZEGA , Attilio FRANGI , Gabriele GATTERE , Manuel RIANI
CPC classification number: H02N1/008 , B81B3/0021 , B81B2201/033 , B81B2203/053 , B81B2203/0136
Abstract: MEMS actuator including: a substrate; a first and a second semiconductive layer; a frame including transverse regions formed by the second semiconductive layer, elongated parallel to a first direction and offset along a second direction, the frame being movable parallel to the second direction. The MEMS actuator includes, for each transverse region: corresponding front rotor regions, which are fixed to the transverse region and are suspended above the substrate; a first and a second stator region, which are formed by the first semiconductive layer in such a way that, when the frame is in rest position, the transverse region is laterally offset with respect to the first and the second stator regions and a first front rotor region partially faces the first stator region, and in such a way that, during a translation of the frame along the second direction, the first and/or a second front rotor region at least partially face the second stator region, when the transverse region begins to superimpose on the first stator region.
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公开(公告)号：US11713240B2
公开(公告)日：2023-08-01
申请号：US17116677
申请日：2020-12-09
Inventor： Siavash Pourkamali , Amin Abbasalipour , Prithviraj Palit
CPC classification number: B81C1/00166 , B81B3/0021 , B81C1/00214 , H02N1/008 , H02N2/0075 , B81B2201/033 , B81B2203/0136 , B81B2203/053
Abstract: Illustrative embodiments provide an electrostatic actuator and methods of making and operating an electrostatic actuator. The electrostatic actuator comprises a framework and a plurality of electrodes. The framework comprises walls defining a plurality of cells forming an array of cells. The plurality of electrodes comprise an electrode in each cell in the plurality of cells. A gap separates the electrode in each cell from the walls of the cell. The framework is configured to contract in response to an electrical signal applied between the framework and the plurality of electrodes.
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公开(公告)号：US11677337B2
公开(公告)日：2023-06-13
申请号：US17401350
申请日：2021-08-13
Inventor： Anup Patel , Yannick Pierre Kervran , Euan James Boyd
CPC classification number: H02N1/008 , B81B3/0021 , B81B2201/033 , B81B2203/0136
Abstract: A comb drive for MEMS device includes a stator and a rotor displaceable relative to the stator in a first direction. The stator includes stator comb fingers and the rotor includes rotor comb fingers. The stator comb fingers are coupled to two high impedance nodes to form high impedance node domains arranged in the first direction. The rotor comb fingers are coupled to two oppositely biased electrodes to form oppositely biased domains. Pairs of capacitors with opposite acoustic polarity are respectively formed between the high impedance node domains and the oppositely biased domains. The comb drive of the present invention has increased electrostatic sensitivity for a given unit cell cross-sectional area whilst maintaining an acceptable capacitance and linearity of voltage signal vs displacement. Extra force shim unit cells may be used, which allows for the stiffness between the rotor and stator to be controlled and reduced to zero for a particular displacement range, without impacting sensitivity.
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公开(公告)号：US20180299622A1
公开(公告)日：2018-10-18
申请号：US15504149
申请日：2015-08-17
Applicant: AEPONYX INC. , UNIVERSITE DU QUEBEC A MONTREAL
Inventor： FRANCOIS MENARD , FRÉDERIC NABKI , MICHAËL MÉNARD , MARTIN BÉRARD
CPC classification number: G02B6/3518 , B81B5/00 , B81B2201/033 , B81B2201/042 , G02B6/00 , G02B6/12004 , G02B6/1228 , G02B6/124 , G02B6/357 , G02B6/3596 , G02B6/4214 , G02B2006/12061 , G02B2006/12078 , G02B2006/12085 , G02B2006/12104 , G02B2006/12107 , G02B2006/12121 , G02B2006/12145
Abstract: Hybrid optical integration places very strict manufacturing tolerances and performance requirements upon the multiple elements to exploit passive alignment techniques as well as having additional processing requirements. Alternatively, active alignment and soldering/fixing where feasible is also complex and time consuming with 3, 4, or 6-axis control of each element. However, microelectromechanical (MEMS) systems can sense, control, and activate mechanical processes on the micro scale. Beneficially, therefore the inventors combine silicon MEMS based micro-actuators with silicon CMOS control and drive circuits in order to provide alignment of elements within a silicon optical circuit either with respect to each other or with other optical elements hybridly integrated such as compound semiconductor elements. Such inventive MEMS based circuits may be either maintained as active during deployment or powered off once the alignment has been “locked” through an attachment/retention/latching process.
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