公开(公告)号：US20160264399A1

公开(公告)日：2016-09-15

申请号：US14657429

申请日：2015-03-13

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

Inventor： Chun-Ren CHENG ,  Richard YEN ,  Yi-Hsien CHANG ,  Wei-Cheng SHEN

IPC: B81B3/00 ,  B81C3/00

CPC classification number: B81B3/0021 ,  B81B3/007 ,  B81B2201/0257 ,  B81B2203/0127 ,  B81C3/001 ,  H04R1/06 ,  H04R17/00 ,  H04R17/02 ,  H04R2201/003

Abstract: A MEMS transducer includes a first substrate and a second substrate facing the first substrate. The first substrate includes a piezoelectric diaphragm and a conductive contact structure. The conductive contact structure is electrically connected to the piezoelectric diaphragm, and protrudes beyond a principal surface of the first substrate. The second substrate includes a conductive receiving feature and an active device. The conductive receiving feature is aligned with and further bonded to the conductive contact structure. The active device is electrically connected to the piezoelectric diaphragm through the conductive receiving feature and the conductive contact structure.

Abstract translation: MEMS换能器包括面向第一基板的第一基板和第二基板。 第一基板包括压电隔膜和导电接触结构。 导电接触结构电连接到压电振膜，并突出超过第一基板的主表面。 第二基板包括导电接收特征和有源器件。 导电接收特征与导电接触结构对准并进一步结合。 有源器件通过导电接收特征和导电接触结构电连接到压电振动膜。

公开(公告)号：US09445198B2

公开(公告)日：2016-09-13

申请号：US14944425

申请日：2015-11-18

Applicant: MH Acoustics, LLC

Inventor： Gary W. Elko ,  Jens M. Meyer

IPC: H04R5/027 ,  H04R3/00 ,  H04S3/02

CPC classification number: H04R5/027 ,  H04R3/005 ,  H04R2201/003 ,  H04S3/02 ,  H04S2400/15 ,  H04S2420/11

Abstract: A microphone array-based audio system that supports representations of auditory scenes using second-order (or higher) harmonic expansions based on the audio signals generated by the microphone array. In one embodiment, a plurality of audio sensors are mounted on the surface of an acoustically rigid polyhedron that approximates a sphere. The number and location of the audio sensors on the polyhedron are designed to enable the audio signals generated by those sensors to be decomposed into a set of eigenbeams having at least one eigenbeam of order two (or higher). Beamforming (e.g., steering, weighting, and summing) can then be applied to the resulting eigenbeam outputs to generate one or more channels of audio signals that can be utilized to accurately render an auditory scene.

公开(公告)号：US09439017B2

公开(公告)日：2016-09-06

申请号：US14176182

申请日：2014-02-10

Applicant: Infineon Technologies AG

Inventor： Ursula Hedenig ,  Daniel Maurer ,  Thomas Grille ,  Peter Irsigler ,  Soenke Pirk ,  Andre Brockmeier

IPC: H04R31/00 ,  H04R23/00 ,  H04R19/00

CPC classification number: H04R31/00 ,  H04R19/005 ,  H04R23/00 ,  H04R2201/003 ,  Y10T29/49

Abstract: In various embodiments, a method for manufacturing microphone structures is provided. The method may include: Providing a substrate having a front side and a back side, the backside facing away from the front side, and having an inner area and an outer area laterally surrounding the inner area, with the inner area comprising a plurality of microphone areas each microphone are being provided for one microphone of the plurality of microphones; Forming a plurality of layers for the plurality of microphones in the microphone areas on the front side of the substrate; Forming a recess from the backside of the substrate with the recess laterally overlapping the entire inner area; Forming a plurality of cavities into a bottom of the recess with each cavity of the plurality of cavities being formed in one of the microphone areas; Processing the layers to form the plurality of microphone structures, wherein each microphone structure comprises at least one layer of the plurality of layers and one cavity; and Separating the plurality of microphone structures from each other.

Abstract translation: 在各种实施例中，提供了一种用于制造麦克风结构的方法。 该方法可以包括：提供具有前侧和后侧的衬底，背面背离前侧，并且具有横向包围内部区域的内部区域和外部区域，其中内部区域包括多个麦克风 每个麦克风正在为多个麦克风中的一个麦克风提供的区域; 在基板正面的麦克风区域中形成多个麦克风层; 从基板的背面形成凹部，其中凹部横向重叠整个内部区域; 在所述多个空腔的每个空腔形成在所述麦克风区域中的一个中，形成多个空腔到所述凹部的底部; 处理层以形成多个麦克风结构，其中每个麦克风结构包括多层中的至少一层和一个空腔; 并且将多个麦克风结构彼此分离。

公开(公告)号：US20160241943A1

公开(公告)日：2016-08-18

申请号：US15139892

申请日：2016-04-27

Applicant: Infineon Technologies AG

Inventor： Wilfried Florian ,  Andreas Wiesbauer ,  Richard Gaggl

IPC: H04R1/04 ,  G06F3/16

CPC classification number: H04R1/04 ,  G06F3/162 ,  H04R3/00 ,  H04R25/00 ,  H04R2201/003 ,  H04R2410/00 ,  H04R2420/01

Abstract: According to an embodiment, an interface circuit includes a current replicator and a receiver. The current replicator includes a power terminal coupled to a first reference node, an output terminal configured to output a signal proportional to a signal received from a transducer, and an interface terminal coupled to the transducer. Using a single interface terminal, the current replicator may be configured to provide power to the transducer and receive output signals from the transducer. The receiver may include a first input terminal coupled to the output terminal, a second input terminal coupled to a second reference node, and a current converter circuit coupled to the first input terminal.

公开(公告)号：US20160241022A1

公开(公告)日：2016-08-18

申请号：US15138053

申请日：2016-04-25

Applicant: Knowles Electronics, LLC

Inventor： Svetoslav Radoslavov GUEORGUIEV ,  Claus Erdmann FURST ,  Tore Sejr JOERGENSEN

IPC: H02H9/04 ,  H04R1/04 ,  H02M3/07 ,  H01L27/02 ,  H01L29/78

CPC classification number: H02H9/04 ,  B81B3/0027 ,  B81B2201/0257 ,  H01L27/0248 ,  H01L27/0266 ,  H01L29/7816 ,  H02H9/046 ,  H02M3/07 ,  H04R1/04 ,  H04R2201/003

Abstract: An electronics chip includes a charge pump and at least one high voltage (HV) electro-static discharge (ESD) module. The charge pump is configured to provide a predetermined voltage across a microphone. The devices described herein are implemented in a standard low voltage CMOS process and has a circuit topology that provides an inherent ESD protection level (when it is powered down), which is higher than the operational (predetermined) DC level. At least one high voltage (HV) electro-static discharge (ESD) module is coupled to the output of the charge pump. The HV ESD module is configured to provide ESD protection for the charge pump and a microelectromechanical system (MEMS) microphone that is coupled to the chip. The at least one HV ESD module includes a plurality of PMOS or NMOS transistors having at least one high voltage NWELL/DNWELL region formed within selected ones of the PMOS or NMOS transistors. The at least one high voltage NWELL/DNWELL region has a breakdown voltage sufficient to allow a low voltage process to be used to construct the chip and still allow the HV ESD module to provide ESD protection for the chip.

Abstract translation: 电子芯片包括电荷泵和至少一个高压（HV）静电放电（ESD）模块。 电荷泵配置成提供麦克风上的预定电压。 本文描述的器件在标准低电压CMOS工艺中实现，并且具有提供固有ESD保护水平（当其断电时）的电路拓扑，其高于操作（预定）DC电平。 至少一个高压（HV）静电放电（ESD）模块耦合到电荷泵的输出端。 HV ESD模块被配置为为电荷泵提供ESD保护，以及耦合到芯片的微机电系统（MEMS）麦克风。 至少一个HV ESD模块包括多个PMOS或NMOS晶体管，其具有形成在所选择的PMOS或NMOS晶体管中的至少一个高电压NWELL / DNWELL区域。 至少一个高电压NWELL / DNWELL区域具有足以允许低电压工艺用于构建芯片的击穿电压，并且还允许HV ESD模块为芯片提供ESD保护。

公开(公告)号：US09420391B2

公开(公告)日：2016-08-16

申请号：US14557823

申请日：2014-12-02

Applicant: Infineon Technologies AG

Inventor： Andreas Wiesbauer ,  Christian Jenkner ,  Johannes Hohl ,  Ernesto Romani ,  Christian Ebner ,  Joseph Hufschmitt

IPC: G06F7/00 ,  H04R29/00

CPC classification number: H04R29/004 ,  H04R3/00 ,  H04R19/04 ,  H04R2201/003 ,  H04R2420/09

Abstract: A microphone or a microphone sensor system operates with a sensor interface that receives a supply voltage at a supply terminal. The sensor interface detects a command at the supply terminal based on a change in the supply voltage and communicates the command or data related to the command to a component of the sensor system. The supply terminal is a bidirectional terminal that further communicates data related to the sensor system via the supply terminal.

Abstract translation: 麦克风或麦克风传感器系统使用在电源端接收电源电压的传感器接口进行操作。 传感器接口根据电源电压的变化检测供电端子上的指令，并将与命令相关的命令或数据传送给传感器系统的一个部件。 供电端子是通过供电端子进一步传送与传感器系统相关的数据的双向端子。

公开(公告)号：US09420368B2

公开(公告)日：2016-08-16

申请号：US14494838

申请日：2014-09-24

Applicant: Analog Devices, Inc.

Inventor： Noah Stein ,  Johannes Traa ,  David Wingate

IPC: H04R1/32 ,  G10L21/0272 ,  H04R1/40 ,  G10L21/0216

CPC classification number: H04R1/326 ,  G10L21/0272 ,  G10L2021/02166 ,  H04R1/406 ,  H04R2201/003 ,  H04R2430/21

Abstract: An approach to processing of acoustic signals acquired at a user's device include one or both of acquisition of parallel signals from a set of closely spaced microphones, and use of a multi-tier computing approach in which some processing is performed at the user's device and further processing is performed at one or more server computers in communication with the user's device. The acquired signals are processed using time versus frequency estimates of both energy content as well as direction of arrival. In some examples, a non-negative matrix or tensor factorization approach is used to identify multiple sources each associated with a corresponding direction of arrival of a signal from that source. In some examples, data characterizing direction of arrival information is passed from the user's device to a server computer where direction-based processing is performed.

Abstract translation: 处理在用户设备处获取的声学信号的方法包括从一组紧密间隔的麦克风中获取并行信号的一个或两个，以及使用多层计算方法，其中在用户设备处进行一些处理 在与用户的设备通信的一个或多个服务器计算机上执行处理。 所获取的信号使用能量含量以及到达方向的时间与频率估计来处理。 在一些示例中，使用非负矩阵或张量因子分解方法来识别每个与来自该源的信号的相应到达方向相关联的多个源。 在一些示例中，表征到达信息方向的数据从用户设备传递到执行方向处理的服务器计算机。

公开(公告)号：US09414175B2

公开(公告)日：2016-08-09

申请号：US14258465

申请日：2014-04-22

Applicant: Robert Bosch GmbH

Inventor： Andrew J. Doller

IPC: H04R29/00 ,  H04R3/00 ,  H04R19/04 ,  H04R9/08 ,  H04R19/00 ,  H04R1/04

CPC classification number: H04R3/005 ,  H04R1/04 ,  H04R19/005 ,  H04R19/04 ,  H04R29/004 ,  H04R29/006 ,  H04R2201/003

Abstract: In one embodiment, the invention is a microphone system with an internal test circuit. The system includes a microphone having a housing with an acoustic port, a first transducer, a second transducer, a controller, and a current source. The system also includes an acoustic assembly with a cover and an acoustic pressure source positioned in the cover. When the acoustic assembly is positioned over the acoustic port, an acoustic chamber is formed, and a signal can be applied to the acoustic pressure source such that a first set of measurements can be taken. The acoustic assembly can be removed and replaced with an acoustic cover to take a second set of measurements. Based on the first and second measurements, sensitivities of the first and second transducers can be determined. In another embodiment, the invention provides a method for calibrating the sensitivity of a microphone.

Abstract translation: 在一个实施例中，本发明是具有内部测试电路的麦克风系统。 该系统包括麦克风，该麦克风具有带有声学口的壳体，第一换能器，第二换能器，控制器和电流源。 该系统还包括具有盖的声学组件和位于盖中的声压源。 当声学组件定位在声学端口上方时，形成声学室，并且可以将信号施加到声学压力源，使得可以进行第一组测量。 可以将声学组件移除并用声学覆盖物代替以进行第二组测量。 基于第一和第二测量，可以确定第一和第二换能器的灵敏度。 在另一个实施例中，本发明提供了一种用于校准麦克风的灵敏度的方法。

公开(公告)号：US09408009B1

公开(公告)日：2016-08-02

申请号：US14929059

申请日：2015-10-30

Applicant: Pebble Technology, Corp.

Inventor： Andrew James Witte ,  Sean Eugene Daley ,  Tien Ching Li ,  Zinovy Dolgonosov ,  Steven William Johns

IPC: H04R1/02 ,  H04R3/00 ,  H04R31/00 ,  H01H13/86

CPC classification number: H04R31/00 ,  H01H13/86 ,  H04R1/028 ,  H04R1/44 ,  H04R2201/003 ,  H04R2499/11

Abstract: A wearable electronic device is discussed. The device has a housing and a processor in the housing. The processor can enable the wearer of the device to select different operations from an onscreen display. The device also has a communication circuit in the housing to transmit wirelessly to another device cooperating with the electronic device. The device has a microphone hole penetrating the housing to a microphone, a microphone seal component, and a waterproof material in the housing. The microphone seal component has channels and when compressed against the waterproof material can i) allow sound waves in air to pass through to the microphone inside the housing behind the waterproof material and the microphone seal component, ii) form a water tight seal for the microphone hole penetrating the housing, and iii) provide an air pressure equalization mechanism between internal pressure inside the housing and atmospheric pressure external to the housing.

Abstract translation: 讨论了可穿戴电子设备。 该装置在壳体中具有壳体和处理器。 处理器可以使设备的佩戴者能够从屏幕显示器中选择不同的操作。 该设备还在外壳中具有通信电路，以无线方式传送到与电子设备协作的另一设备。 该装置具有穿过壳体到麦克风的麦克风孔，麦克风密封部件和壳体中的防水材料。 麦克风密封部件具有通道，并且当被防​​水材料压缩时，i）允许空气中的声波通过壳体内的防水材料和麦克风密封部件之外的麦克风，ii）形成麦克风的防水密封 穿过壳体的孔，以及iii）在壳体内部的内部压力和壳体外部的大气压之间提供气压均衡机构。

公开(公告)号：US09403670B2

公开(公告)日：2016-08-02

申请号：US14327180

申请日：2014-07-09

Applicant: Christoph Schelling ,  Stefan Singer ,  Jochen Zoellin

Inventor： Christoph Schelling ,  Stefan Singer ,  Jochen Zoellin

IPC: H01L29/84 ,  B81B3/00 ,  B81C1/00 ,  H04R19/00

CPC classification number: B81B3/0059 ,  B81B3/0072 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2203/0127 ,  B81C1/00158 ,  B81C1/00666 ,  H04R19/005 ,  H04R2201/003

Abstract: A microphone structure of an MEMS device has a layer construction including: a base substrate; a deflectable microphone diaphragm at least partly spanning a through-opening in the substrate; a deflectable electrode of a microphone condenser system; a stationary counter-element having ventilation openings situated in the layer construction over the microphone diaphragm and acting as a bearer for a stationary electrode of the microphone condenser system. The diaphragm is bonded into the layer construction on the substrate via a flexible beam. The otherwise free edge region of the diaphragm is curved in a pan shape, so that it extends both vertically and also in some regions laterally beyond the edge region of the through-opening, and the edge region of the through-opening forms a lower stop for the diaphragm movement.

Abstract translation: MEMS器件的麦克风结构具有层结构，包括：基底; 至少部分跨越所述基板中的通孔的可偏转传声器隔膜; 麦克风冷凝器系统的可偏转电极; 一个固定的相对元件，其具有位于麦克风隔膜上的层结构中的通气开口，并且用作麦克风电容器系统的固定电极的载体。 隔膜通过柔性梁结合到基板上的层结构中。 隔膜的另外的自由边缘区域以平盘形状弯曲，使得其在垂直方向上以及在一些区域中横向延伸超过通孔的边缘区域，并且通孔的边缘区域形成下部停止 用于隔膜运动。