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    Interval timer
    221.
    发明授权
    Interval timer 失效
    间隔定时器

    公开(公告)号：US5253228A

    公开(公告)日：1993-10-12

    申请号：US833554

    申请日：1992-02-10

    Applicant: Brett B. Truett

    Inventor： Brett B. Truett

    IPC: G04F1/00 ,  G04G9/04 ,  G04G17/00 ,  H05K1/18 ,  G04C19/00 ,  G04F8/00

    CPC classification number: H05K1/189 ,  G04F1/005 ,  G04G17/00 ,  G04G9/04 ,  H05K2201/09018 ,  H05K2201/10106 ,  H05K2201/10689

    Abstract: An electronic interval timer in which a cylindrical shell having five rows of LEDs mounted at spaced intervals from top to bottom, formed every 72.degree. about the circumference simulates an hourglass timer. Timer and control circuits are connected to select a desired time interval and to illuminate the LEDs and turn off successive rings in proportion to the time remaining in the selected interval at any given time after actuation. An audible buzzer is also provided as are interrupt and reset capabilities.

    Abstract translation: 一个电子间隔定时器，其中具有五排LED的圆柱形壳体以从顶部到底部间隔开的间隔围绕圆周形成72度，模拟沙漏计时器。 连接定时器和控制电路以选择期望的时间间隔并照亮LED并且在致动之后的任何给定时间与所选间隔中的剩余时间成比例地关闭连续的环。 还提供可听见的蜂鸣器作为中断和复位功能。

    Portable computer with display unit connected to system unit through conducting hinge
    222.
    发明授权
    Portable computer with display unit connected to system unit through conducting hinge 失效
    便携式计算机，显示单元通过导向铰链连接到系统单元

    公开(公告)号：US5237488A

    公开(公告)日：1993-08-17

    申请号：US881431

    申请日：1992-05-11

    Applicant: Gregory T. Moser ,  Jane M. Shewchuck

    Inventor： Gregory T. Moser ,  Jane M. Shewchuck

    IPC: E05D11/00 ,  G06F1/16 ,  H01R35/04 ,  H05K1/00 ,  H05K3/36

    CPC classification number: G06F1/1683 ,  G06F1/1616 ,  G06F1/1681 ,  H01R35/04 ,  H05K1/0284 ,  E05D11/0081 ,  E05Y2900/606 ,  H05K2201/09018 ,  H05K3/36 ,  Y10T16/522 ,  Y10T16/557

    Abstract: An electrically conductive hinge provides for the transmission of electrical power and signals between a pivotally connected display unit and system unit of a portable computer and eliminates cable connections between the display unit and the system unit. Either the system unit, the display unit, or both units have a set of wipers which contact the conductive lines in the electrical track. The conductive lines are long enough to allow the display unit to be pivoted to and from its open and shut positions while the wipers remain in contact therewith. In one arrangement, the electrical track is manufactured on the hinge pin. In another arrangement, the electrical track is manufactured on a disk positioned at or near one end of the hinge pin.

    Abstract translation: 导电铰链提供在枢转连接的显示单元和便携式计算机的系统单元之间传输电力和信号，并消除显示单元和系统单元之间的电缆连接。 系统单元，显示单元或两个单元都具有与电气轨道中的导线接触的一组擦拭器。 导线长度足以允许显示单元在擦拭器保持与其接触的同时从其打开和关闭位置枢转。 在一种布置中，电导轨在铰链销上制造。 在另一种布置中，电轨被制造在位于铰链销的一端或附近的盘上。

    Arcuate profiled heatsink apparatus and method
    223.
    发明授权
    Arcuate profiled heatsink apparatus and method 失效
    弧形异型散热装置及方法

    公开(公告)号：US5172755A

    公开(公告)日：1992-12-22

    申请号：US861724

    申请日：1992-04-01

    Applicant: Victor M. Samarov

    Inventor： Victor M. Samarov

    IPC: H01L23/40 ,  H05K1/03 ,  H05K3/00

    CPC classification number: H05K3/0061 ,  H01L23/4006 ,  H01L2023/4062 ,  H01L2023/4087 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K2201/09018 ,  H05K2201/10598

    Abstract: An arcuate profiled heatsink is disclosed, over which is flexed and attached a substrate on which are mounted heat producing, temperature sensitive electronic devices. Flexing the substrate to conform with the arcuate surface of the heatsink minimizes air pockets between the two, which would ordinarily result due to warpage resulting from the fabrication of the substrate. The interface between heatsink and substrate, therefore, has lower thermal resistance, thus, increasing thermal conductivity between heatsink and substrate, and increasing the amount of heat dissipated by the heatsink. Because no hard joining of the two parts is required, they may be separated for repair, and stress resulting from thermal expansion mismatch will not be transferred to the substrate.

    Abstract translation: 公开了一种弧形异型散热器，在其上弯曲并附着一个基板，其上安装有发热的温度敏感的电子设备。 使衬底弯曲以符合散热器的弧形表面，从而最小化两者之间的气穴，这通常是由于基板制造引起的翘曲而导致的。 因此，散热器和基板之间的接口具有较低的热阻，因此，增加了散热器和基板之间的导热性，并增加了散热器散发的热量。 因为不需要两个部分的硬连接，所以可以将其分开以进行修复，并且由热膨胀失配引起的应力不会转移到基板。

    Process for producing conductor patterns on three dimensional articles
    225.
    发明授权
    Process for producing conductor patterns on three dimensional articles 失效
    用于在三维制品上生产导体图案的方法

    公开(公告)号：US4837129A

    公开(公告)日：1989-06-06

    申请号：US928673

    申请日：1986-11-07

    Applicant: David C. Frisch ,  Louis T. Manzione ,  Gerhard W. Poelzing ,  Wilhelm Weber

    Inventor： David C. Frisch ,  Louis T. Manzione ,  Gerhard W. Poelzing ,  Wilhelm Weber

    IPC: G03F1/00 ,  H05K1/00 ,  H05K3/00 ,  H05K3/18

    CPC classification number: H05K3/0082 ,  G03F1/50 ,  H05K3/185 ,  H05K1/0284 ,  H05K2201/09018 ,  H05K2203/056 ,  H05K3/0002 ,  Y10S430/143 ,  Y10S430/168

    Abstract: An article comprised of a body having a conductor pattern on at least one non-planar and non-flexible surface thereof. The article is prepared by using a three-dimensional mask having an interior surface which is a mirror image replica of the surface of the body on which the conductors are to be formed. The surface of the body is provided with material which is capable of initiating conductor formation. The interior surface of the mask then is placed over the body and in substantial registry therewith. The mask and the body then are exposed to radiation or moving material to delineate the conductor pattern. Subsequently, the mask is removed and conductors are formed.

    Abstract translation: 一种由在其至少一个非平面和非柔性表面上具有导体图案的主体构成的物品。 通过使用具有内表面的三维掩模来制备制品，所述内表面是要在其上形成导体的主体的表面的镜像复制品。 身体的表面设置有能够启动导体形成的材料。 然后将面罩的内表面放置在身体上并与其大体对准。 然后将掩模和身体暴露于辐射或移动材料以描绘导体图案。 随后，去除掩模并形成导体。

    Method of forming metallic patterns on curved surfaces
    227.
    发明授权
    Method of forming metallic patterns on curved surfaces 失效
    在曲面上形成金属图案的方法

    公开(公告)号：US4388388A

    公开(公告)日：1983-06-14

    申请号：US270338

    申请日：1981-06-04

    Applicant: Thomas W. Kornbau ,  Robert A. Sievers

    Inventor： Thomas W. Kornbau ,  Robert A. Sievers

    IPC: G03F7/00 ,  H05K1/00 ,  H05K3/00 ,  G03C5/00 ,  H01Q1/28 ,  H01Q1/40

    CPC classification number: G03F7/00 ,  H05K3/0082 ,  H05K1/0284 ,  H05K2201/09018 ,  H05K2203/056 ,  H05K3/0002

    Abstract: A method of forming metallic patterns on a dielectric surface such as a radome surface that has a compound curve which includes the steps of coating the radome with a metal and then with a photoresist. An electrical pattern is formed on the photographic emulsion of a thin membrane that is used as a photo mask. A water soluble adhesive, which is non degradable to the exposure and development of the photoresist and the etching of the conductive surface is applied to the metallic surface and the photo mask is pressed into position on the adhesive to conform to the curvature of the radome. The photo mask is removed and the electrical pattern is provided on the surface by conventional developing and etching techniques to provide a clear, well defined pattern even in arrays wherein the pattern segments are of small dimension.

    Abstract translation: 在诸如雷达罩表面的电介质表面上形成金属图案的方法，该方法具有复合曲线，该方法包括以下步骤：用金属涂覆天线罩，然后用光致抗蚀剂。 在用作光掩模的薄膜的照相乳剂上形成电图案。 对光致抗蚀剂的曝光和显影不可降解的水溶性粘合剂和导电表面的蚀刻被施加到金属表面，并且光掩模被压入粘合剂上的位置以符合天线罩的曲率。 去除光掩模，并且通过常规的显影和蚀刻技术在表面上提供电图案，以提供即使在其中图案片段具有小尺寸的阵列中的清晰，明确定义的图案。

    Process for manufacturing domed spiral antennas
    228.
    发明授权
    Process for manufacturing domed spiral antennas 失效
    制造圆顶螺旋天线的工艺

    公开(公告)号：US3907565A

    公开(公告)日：1975-09-23

    申请号：US42774873

    申请日：1973-12-26

    Applicant: BENDIX CORP

    Inventor： BURTON BERNARD LEE ,  TAKAKI MINORU ,  HALL ROGER D

    IPC: H01Q11/04 ,  G03F7/00 ,  H01Q9/27 ,  H05K1/00 ,  H05K3/00 ,  H05K3/06 ,  H05K3/38 ,  G03C5/00

    CPC classification number: G03F7/00 ,  H01Q9/27 ,  H05K1/0284 ,  H05K3/0082 ,  H05K3/064 ,  H05K3/386 ,  H05K2201/09018 ,  H05K2203/056 ,  H05K2203/0759

    Abstract: An antenna and method of manufacture are described in which a spiral microwave antenna is formed over a domed substrate of epoxy glass resin. A copper foil member is formed over a die by spinning or burnishing to a domed configuration matching that of the substrate. The copper member is then given a coating of primer and clamped over the substrate which has been coated with an epoxy cement, and the assembly subjected to heat and pressure sufficient to bond the foil to the substrate. The assembled antenna blank is then coated with photo-resist material and illuminated from a source of collimated light through a photo negative which is carefully centered to expose the desired spiral pattern on the photo-resist material. The photo-resist is then developed and rinsed, and the blank is baked to harden the exposed photo-resist. The blank is then etched to remove the unwanted copper, leaving the desired antenna pattern. The copper pattern is then preferably plated with tin and the assembly trimmed and drilled as desired.

    Abstract translation: 描述了一种天线和制造方法，其中螺旋式微波天线形成在环氧树脂玻璃树脂的圆顶基底上。 通过旋转或抛光在模具上形成铜箔部件至与基板相匹配的圆顶形结构。 然后将铜构件涂覆底漆并夹在已经涂覆有环氧胶泥的基材上，并且该组件受到足以将箔结合到基材上的加热和压力。 然后将组装的天线坯料涂覆有光致抗蚀剂材料，并从准直光源通过光负极照射，该光负极小心居中以暴露光刻胶材料上所需的螺旋图案。 然后显影和冲洗光致抗蚀剂，并烘烤该坯料以硬化曝光的光致抗蚀剂。 然后蚀刻该坯料以除去不想要的铜，留下所需的天线图案。 铜图案然后优选地镀锡，并且根据需要修整和钻孔组件。

    Three dimensional circuit modules for thick-film circuits and the like and methods for making same
    229.
    发明授权
    Three dimensional circuit modules for thick-film circuits and the like and methods for making same 失效
    用于薄膜电路的三维电路模块及其制造方法

    公开(公告)号：US3755891A

    公开(公告)日：1973-09-04

    申请号：US3755891D

    申请日：1971-06-03

    Applicant: HAWKINS S ,  MUCKELROY W

    Inventor： MUCKELROY W ,  HAWKINS S

    IPC: H01R12/55 ,  H05K1/00 ,  H05K1/09 ,  H05K1/16 ,  H05K1/18 ,  H05K1/04

    CPC classification number: H05K1/189 ,  H05K1/0284 ,  H05K1/095 ,  H05K1/16 ,  H05K2201/09018 ,  H05K2201/09181 ,  H05K2201/0999 ,  H05K2201/10363 ,  H05K2201/10386 ,  H05K2201/10446 ,  H05K2201/10651 ,  Y10T29/49155

    Abstract: Three Dimensional Circuit Modules For Thick-Film Circuits And The Like And Methods For Making Same are provided in which such circuits are printed in selected portions on both the internal and external walls of a hollow cylindrical substrate to remove the crossovers normally present in an equivalent planar circuit configuration. The circuit sections are disposed on the substrate such that common connections therebetween are effected by conductive clips straddling the end faces of the substrate in notches or declivities formed therein to receive the clips. Like declivities are utilized to both physically and electrically interconnect a plurality of substrates and/or external circuit components and the like. These substrates also comprise a housing for self-contained functional circuit modules of the foregoing type.

    Abstract translation: 提供用于厚膜电路等的三维电路模块及其制造方法相同的方法，其中这些电路以中空圆柱形基板的内壁和外壁的选定部分印刷，以去除通常存在于等效平面中的交叉 电路配置。 电路部分设置在基板上，使得它们之间的公共连接通过以形成在其中的凹口或倾斜度跨接在基板的端面上的导电夹来实现，以接收夹子。 类似的表现被用于物理和电互连多个基板和/或外部电路部件等。 这些基板还包括用于上述类型的独立功能电路模块的壳体。

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