公开(公告)号：US20160376144A1

公开(公告)日：2016-12-29

申请号：US14791955

申请日：2015-07-06

Applicant: W. L. Gore & Associates, Inc.

Inventor： Andrew J. Holliday

IPC: B81B7/00 ,  H04R1/08 ,  B81C1/00

CPC classification number: B81B7/0038 ,  B81B2201/0257 ,  B81B2201/0271 ,  B81C1/00285 ,  H04R1/023 ,  H04R1/086 ,  H04R19/005 ,  H04R2201/003

Abstract: A protective cover for a micro-electro-mechanical system that has a low mass/area, preferably

Abstract translation: 具有低质量/面积，优选<3gsm，最优选<1gsm的微机电系统的保护罩。

公开(公告)号：US20160322954A1

公开(公告)日：2016-11-03

申请号：US15206585

申请日：2016-07-11

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Hiroaki KAIDA ,  Eitaro KAMEDA ,  Keisuke TAKEYAMA ,  Daisuke NAKAMURA

IPC: H03H9/02

CPC classification number: H03H9/02448 ,  B81B3/0086 ,  B81B2201/0271 ,  B81B2203/0109 ,  B81B2203/0154 ,  B81B2203/058 ,  H03H9/2447 ,  H03H2009/02496 ,  H03H2009/155 ,  H03H2009/2421

Abstract: A MEMS device that suppresses variations in a resistance value caused by contracting vibrations in a direction in which a holding portion extends. The MEMS device includes a frame, a rectangular plate that receives an input of a driving signal, and holding portions that anchor the rectangular plate to the frame. The frame and the rectangular plate are both rectangular in shape. The holding portions are provided extending toward the frame from central areas of the opposing sides of the rectangular plate, and anchor the rectangular plate to the frame. A resistive film is formed in a region that follows a straight line connecting the holding portions that anchor the rectangular plate to the frame and that corresponds to no more than half a maximum displacement from a vibration distribution.

Abstract translation: 一种MEMS器件，其抑制由保持部延伸的方向上的收缩振动引起的电阻值的变化。 MEMS器件包括框架，接收驱动信号的输入的矩形板，以及将矩形板固定到框架的保持部分。 框架和矩形板的形状均为矩形。 保持部从矩形板的相对侧的中心区域向框架延伸设置，并将矩形板固定在框架上。 电阻膜形成在沿着连接将矩形板固定到框架的保持部分的直线的区域中，并且对应于不超过振动分布的最大位移的一半。

公开(公告)号：US20160290970A1

公开(公告)日：2016-10-06

申请号：US15178025

申请日：2016-06-09

Applicant: Butterfly Network, Inc.

Inventor： Jonathan M. Rothberg ,  Susan A. Alie ,  Keith G. Fife ,  Nevada J. Sanchez ,  Tyler S. Ralston

IPC: G01N29/24 ,  B81C1/00 ,  A61B8/00

CPC classification number: G01N29/2406 ,  A61B8/4483 ,  B06B1/0292 ,  B81B7/007 ,  B81B2201/0271 ,  B81C1/00238 ,  B81C1/00301 ,  B81C2201/019 ,  B81C2203/036 ,  B81C2203/0792 ,  H01L2224/4813 ,  H01L2924/0002 ,  H01L2924/146 ,  H01L2924/1461

Abstract: Micromachined ultrasonic transducers integrated with complementary metal oxide semiconductor (CMOS) substrates are described, as well as methods of fabricating such devices. Fabrication may involve two separate wafer bonding steps. Wafer bonding may be used to fabricate sealed cavities in a substrate. Wafer bonding may also be used to bond the substrate to another substrate, such as a CMOS wafer. At least the second wafer bonding may be performed at a low temperature.

公开(公告)号：US20160280538A1

公开(公告)日：2016-09-29

申请号：US15177977

申请日：2016-06-09

Applicant: Butterfly Network, Inc.

Inventor： Jonathan M. Rothberg ,  Susan A. Alie ,  Keith G. Fife ,  Nevada J. Sanchez ,  Tyler S. Ralston

IPC: B81C1/00 ,  B06B1/02

CPC classification number: G01N29/2406 ,  A61B8/4483 ,  B06B1/0292 ,  B81B7/007 ,  B81B2201/0271 ,  B81C1/00238 ,  B81C1/00301 ,  B81C2201/019 ,  B81C2203/036 ,  B81C2203/0792 ,  H01L2224/4813 ,  H01L2924/0002 ,  H01L2924/146 ,  H01L2924/1461

Abstract: Micromachined ultrasonic transducers integrated with complementary metal oxide semiconductor (CMOS) substrates are described, as well as methods of fabricating such devices. Fabrication may involve two separate wafer bonding steps. Wafer bonding may be used to fabricate sealed cavities in a substrate. Wafer bonding may also be used to bond the substrate to another substrate, such as a CMOS wafer. At least the second wafer bonding may be performed at a low temperature.

Abstract translation: 与互补金属氧化物半导体（CMOS）基板集成的微加工超声换能器以及制造这种装置的方法进行了描述。 制造可能涉及两个单独的晶片结合步骤。 可以使用晶片结合来制造衬底中的密封空腔。 晶片接合也可以用于将衬底粘合到另一衬底，例如CMOS晶片。 至少第二晶片接合可以在低温下进行。

公开(公告)号：US09434607B2

公开(公告)日：2016-09-06

申请号：US14660157

申请日：2015-03-17

Applicant: SEIKO EPSON CORPORATION

Inventor： Takahiko Yoshizawa

IPC: B81B7/00 ,  B81B7/02 ,  B81C1/00

CPC classification number: B81C1/00246 ,  B81B2201/0271 ,  B81C2203/0136 ,  B81C2203/0163 ,  B81C2203/0764

Abstract: A MEMS device includes a semiconductor substrate having a main surface with a first region in which a trench is formed and a second region in which an impurity diffusion region of a semiconductor circuit element is formed; a functional element provided, either directly or via an insulating film, on a bottom surface of the trench of the semiconductor substrate; a wall portion in the trench of the semiconductor substrate and forming a cavity surrounding the functional element; a lid portion that covers the cavity; and a pillar in the cavity and in contact with either the bottom surface of the trench of the semiconductor substrate or the insulating film, and with a back surface of the lid portion.

Abstract translation: MEMS器件包括具有主表面的半导体衬底，其中形成有沟槽的第一区域和形成有半导体电路元件的杂质扩散区域的第二区域; 在半导体衬底的沟槽的底表面上直接或经由绝缘膜提供的功能元件; 在所述半导体衬底的沟槽中的壁部分，并且形成围绕所述功能元件的空腔; 覆盖所述空腔的盖部; 以及与该半导体基板的沟槽的底面或绝缘膜接触的空腔内的支柱，以及盖部的背面。

公开(公告)号：US09429428B2

公开(公告)日：2016-08-30

申请号：US14843844

申请日：2015-09-02

Applicant: The Regents of the University of California

Inventor： Andrei Shkel ,  Doruk Senkal

IPC: G01C19/00 ,  G01C19/5691 ,  B81C1/00

CPC classification number: G01C19/5691 ,  B81B2201/0271 ,  B81C1/00238 ,  B81C1/00634

Abstract: A method for fabricating an environmentally robust micro-wineglass gyroscope includes the steps of stacking and bonding of at least an inner glass layer and an outer glass layer to a substrate wafer; plastically deforming the inner glass layer into a mushroom-shaped structure and deforming the outer glass layer into a shield capable of extending over the inner glass layer, while leaving the inner and outer glass layers connectable at a central post location; removing the substrate layer and a portion of the inner glass layer so that a perimeter of the inner glass layer is free; and bonding the deformed inner and outer glass layers to a handle wafer. The resulting structure is an environmentally robust micro-wineglass gyroscope which has a double ended supported central post location for the mushroom-shaped structure of the inner glass layer.

Abstract translation: 一种用于制造环境坚固的微型葡萄酒杯陀螺仪的方法包括将至少内玻璃层和外玻璃层堆叠和结合到基底晶片的步骤; 将内玻璃层塑性变形为蘑菇状结构，并将外玻璃层变形成能够在内玻璃层上延伸的屏蔽，同时使内玻璃层和外玻璃层可连接在中心柱位置; 去除衬底层和内玻璃层的一部分，使得内玻璃层的周边是自由的; 以及将变形的内玻璃层和外玻璃层接合到处理晶片。 所得到的结构是一种环保的微型葡萄酒杯陀螺仪，其具有用于内玻璃层的蘑菇形结构的双端支撑的中心柱位置。

公开(公告)号：US09388039B2

公开(公告)日：2016-07-12

申请号：US14643388

申请日：2015-03-10

Applicant: SEIKO EPSON CORPORATION

Inventor： Takahiko Yoshizawa

IPC: B81B7/00 ,  B81C1/00 ,  B81B3/00

CPC classification number: B81B7/0041 ,  B81B3/0078 ,  B81B2201/0271 ,  B81C1/00293 ,  B81C2203/0136 ,  B81C2203/0145 ,  B81C2203/0172

Abstract: A present MEMS device includes: a structural member that is provided on a surface of a substrate and forms a cavity surrounding a functional element; a first layer in which an opening is formed in a predetermined position, the first layer covering a part of the cavity in such a manner that a gap is present between the first layer and the functional element; a second layer in which an opening is formed in a position corresponding to the predetermined position, the second layer being provided on a surface of the first layer; and a sealing portion that is provided on a surface of the second layer across a range broader than the opening of the first layer and the opening of the second layer, and seals at least the opening of the second layer.

Abstract translation: 本MEMS装置包括：结构构件，其设置在基板的表面上并形成围绕功能元件的空腔; 第一层，其中开口形成在预定位置，第一层以这样的方式覆盖空腔的一部分，使得在第一层和功能元件之间存在间隙; 第二层，其中开口形成在与所述预定位置相对应的位置，所述第二层设置在所述第一层的表面上; 以及密封部分，其在比第一层的开口和第二层的开口宽的范围上设置在第二层的表面上，并且至少密封第二层的开口。

公开(公告)号：US20160118955A1

公开(公告)日：2016-04-28

申请号：US14883400

申请日：2015-10-14

Applicant: Micrel, Inc.

Inventor： Wan-Thai Hsu ,  John Ryan Clark

IPC: H03H9/24

CPC classification number: H03H9/2431 ,  B81B2201/0271 ,  H03H9/02244 ,  H03H9/02259 ,  H03H9/02338 ,  H03H9/2452 ,  H03H2009/02251 ,  H03H2009/02283 ,  H03H2009/02307 ,  H03H2009/0233 ,  H03H2009/02346 ,  H03H2009/02496

Abstract: A multiple coil spring MEMS resonator includes a center anchor and a resonator body including two or more coil springs extending in a spiral pattern from the center anchor to an outer closed ring. Each pair of coil springs originates from opposing points on the center anchor and extends in the spiral pattern to opposing points on the outer ring. The number of coil springs, the length and the width of the coil springs and the weight of the outer ring are selected to realize a desired resonant frequency

Abstract translation: 多重螺旋弹簧MEMS谐振器包括中心锚和谐振器主体，该谐振器本体包括从中心锚定件延伸到外部闭合环的螺旋形图案的两个或更多个螺旋弹簧。 每对螺旋弹簧起源于中心锚固件上的相对点，并以螺旋形图案延伸到外圈上的相对点。 螺旋弹簧的数量，螺旋弹簧的长度和宽度以及外圈的重量被选择以实现期望的共振频率

公开(公告)号：US20160093530A1

公开(公告)日：2016-03-31

申请号：US14499287

申请日：2014-09-29

Applicant: Innovative Micro Technology

Inventor： John C. HARLEY

IPC: H01L21/768 ,  B81C1/00

CPC classification number: H01L21/76898 ,  B81B7/0006 ,  B81B2201/018 ,  B81B2201/0271 ,  B81B2207/012 ,  B81B2207/015 ,  B81C1/00301 ,  B81C2203/0792 ,  H01L2224/02372 ,  H01L2224/05548

Abstract: A method for forming through silicon vias (TSVs) in a silicon substrate is disclosed. The method involves forming a silicon post as an annulus in a first side of a silicon substrate, removing material from an opposite side to the level of the annulus, removing the silicon post and replacing it with a metal material to form a metal via extending through the thickness of the substrate.

Abstract translation: 公开了一种在硅衬底中形成硅通孔（TSV）的方法。 该方法包括在硅衬底的第一侧中形成硅柱作为环状空间，从与环空的水平面相反的一侧去除材料，去除硅柱并用金属材料代替它，以通过延伸通过 基板的厚度。

公开(公告)号：US09296606B2

公开(公告)日：2016-03-29

申请号：US14172894

申请日：2014-02-04

Applicant: INVENSENSE, INC.

Inventor： Kirt Reed Williams ,  Matthew Julian Thompson ,  Joseph Seeger

IPC: G01P15/08 ,  B81B3/00 ,  G01N3/20 ,  G01P15/125 ,  B81C1/00 ,  G01K1/00

CPC classification number: B81B3/0051 ,  B81B2201/0221 ,  B81B2201/0235 ,  B81B2201/0271 ,  B81C1/00666 ,  G01K1/00 ,  G01N3/20 ,  G01P15/125 ,  G01P2015/0828

Abstract: A method and system for a MEMS device is disclosed. The MEMS device includes a free layer, with a first portion and a second portion. The MEMS device also includes a underlying substrate, the free layer movably positioned relative to the underlying substrate. The first portion and second portion of the free layer are coupled through at least one stem. A sense material is disposed over portions of the second portion of the free layer. Stress in the sense material and second portion of the free layer does not cause substantial deflection of the first portion.

Abstract translation: 公开了一种用于MEMS器件的方法和系统。 MEMS器件包括具有第一部分和第二部分的自由层。 MEMS器件还包括下面的衬底，自由层相对于下面的衬底可移动地定位。 自由层的第一部分和第二部分通过至少一个杆连接。 感测材料设置在自由层的第二部分的部分上。 感应材料和自由层的第二部分的应力不会引起第一部分的实质的偏转。