公开(公告)号：US07476965B2

公开(公告)日：2009-01-13

申请号：US11575751

申请日：2005-09-07

Applicant: Christian Val ,  Olivier Lignier ,  Regis Bocage

Inventor： Christian Val ,  Olivier Lignier ,  Regis Bocage

IPC: H01L23/48

CPC classification number: H01L23/3128 ,  H01L23/367 ,  H01L23/3677 ,  H01L23/49838 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/32145 ,  H01L2224/48227 ,  H01L2224/49113 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01087 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/0201 ,  H05K1/111 ,  H05K1/112 ,  H05K3/4641 ,  H05K2201/09718 ,  H05K2201/09745 ,  H05K2201/09781 ,  H05K2203/165 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: The present invention relates to an electronic device incorporating a heat distributor. It applies more particularly to devices of the plastic package type, with one or more levels of components. According to the invention, the electronic device, for example of the package type, is provided for its external connection with pads distributed over a connection surface. It includes a thermally conducting plate lying parallel to said connection surface and having a nonuniform structure making it possible, when the device is exposed to a given external temperature, to supply a controlled amount of heat to each external connection pad according to its position on the connection surface. If the device is a package comprising a support of the printed circuit type, the conducting plate will advantageously form an internal layer of said support.

Abstract translation: 本发明涉及一种并入热分配器的电子设备。 它更具体地应用于塑料封装类型的器件，具有一个或多个级别的部件。 根据本发明，提供了例如封装类型的电子设备，用于其与分布在连接表面上的焊盘的外部连接。 它包括平行于所述连接表面并且具有不均匀结构的导热板，使得当设备暴露于给定的外部温度时，可以根据其在位置上的位置向每个外部连接垫提供受控量的热量 连接面。 如果设备是包括印刷电路类型的支撑体的封装，导电板将有利地形成所述支撑件的内层。

公开(公告)号：US20080289174A1

公开(公告)日：2008-11-27

申请号：US12158125

申请日：2006-12-19

Applicant: Christian Val

Inventor： Christian Val

IPC: H05K3/36

CPC classification number: H01L23/3107 ,  H01L25/105 ,  H01L2225/1023 ,  H01L2225/1064 ,  H01L2924/0002 ,  Y10T29/49126 ,  Y10T29/49146 ,  Y10T29/49165 ,  Y10T29/49169 ,  H01L2924/00

Abstract: The invention relates to the collective fabrication of n 3D modules. It comprises a step of fabricating a batch of n wafers I on one and the same plate, this step being repeated K times, then a step of stacking the K plates, a step of forming plated-through holes in the thickness of the stack, these holes being intended for connecting the slices together, and then a step of cutting the stack in order to obtain the n 3D modules.The plate 10, which comprises silicon, is covered on one face 11 with an electrically insulating layer forming the insulating substrate. This face has grooves 20 that define n geometrical features, which are provided with an electronic component 1 connected to electrical connection pads 2′ placed on said face.After the stacking operation, holes are drilled perpendicular to the faces of the plates vertically in line with the grooves. The size of the holes is smaller than that of the grooves so that the silicon of each wafer 10 is isolated from the wall of the hole by resin.

Abstract translation: 本发明涉及n个3D模块的集体制作。 它包括在同一板上制造一批n个晶片I的步骤，该步骤重复K次，然后是堆叠K板的步骤，形成厚度为叠层的电镀通孔的步骤， 这些孔旨在将切片连接在一起，然后切割堆叠以获得n个3D模块的步骤。 包含硅的板10被覆盖在一个表面11上，其中形成绝缘基板的电绝缘层。 该面具有限定n个几何特征的槽20，其具有连接到放置在所述面上的电连接焊盘2'的电子部件1。 在堆叠操作之后，垂直于板的表面垂直钻孔，与槽一致。 孔的尺寸小于槽的尺寸，使得每个晶片10的硅通过树脂与孔的壁隔离。

公开(公告)号：US20230130364A1

公开(公告)日：2023-04-27

申请号：US17970478

申请日：2022-10-20

Applicant: 3D PLUS

Inventor： Cédric COLONNA

IPC: H01F27/28 ,  H01F27/29

Abstract: An innovative planar transformer structure, the transformer includes a primary circuit comprising a primary winding of N1 turns; a secondary circuit comprising a secondary winding of N2 turns; a printed circuit board of layers superposed on one another, forming an aperture defining a perimeter; vias disposed at the centre of the primary and secondary windings on the perimeter of the aperture, the N1 and N2 turns being each disposed on a layer, according to any alternation between the N1 and N2 turns, each of the N1 and N2 turns being wound, partially around vias in forming a circular arc per layer; the circular arc of a layer being distinctly oriented with respect to the circular arcs of the other layers.

公开(公告)号：US11587911B2

公开(公告)日：2023-02-21

申请号：US17240789

申请日：2021-04-26

Applicant: 3D PLUS

Inventor： Christian Val

IPC: H01L25/065 ,  H01L23/48 ,  H01L25/00

Abstract: The field of the invention is that of producing 3D electronic modules, compatible with components operating beyond 1 GHz. The invention relates to a 3D electronic module featuring an interconnection between a horizontal conductor and a vertical conductor to which it is connected exhibits, in a vertical plane, a non-zero curvature. It also relates to the associated production process.

公开(公告)号：US20140349008A1

公开(公告)日：2014-11-27

申请号：US14115853

申请日：2012-05-04

Applicant: Christian Val

Inventor： Christian Val

IPC: H01G4/224

CPC classification number: H01G4/224 ,  B05D1/02 ,  B05D5/10 ,  C23C14/08 ,  C23C16/01 ,  C23C16/402 ,  H01L21/568 ,  H01L23/3121 ,  H01L24/18 ,  H01L24/82 ,  H01L24/96 ,  H01L24/97 ,  H01L2221/68368 ,  H01L2224/24227 ,  H01L2224/73267 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01079 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/181 ,  H05K1/115 ,  H05K1/181 ,  H05K3/284 ,  H01L2924/00 ,  H01L2224/83 ,  H01L2224/82

Abstract: A method for collectively fabricating a reconstituted wafer comprising chips exhibiting connection pads on a front face of the chip, comprises: positioning the chips on an initial adhesive support, front face on the support, vapor deposition at atmospheric pressure and ambient temperature, of an electrically insulating layer on the initial support and the chips, having a mechanical role of holding the chips, transfer of the chips covered with the mineral layer onto a provisional adhesive support, rear face of the chips toward this provisional adhesive support, removal of the initial adhesive support, overlaying the chips onto a support of “chuck” type, front faces of the chips toward this support, removal of the provisional adhesive support, deposition of a resin on the support of “chuck” type to encapsulate the chips, and then polymerization of the resin, removal of the support of “chuck” type, production of an RDL layer active face side.

Abstract translation: 一种用于共同制造重构的晶片的方法，其包括在芯片的前表面上显示连接焊盘的芯片，包括：将芯片定位在初始粘合剂支撑体上，支撑体上的正面，大气压和环境温度下的气相沉积 在初始支撑体上的绝缘层和芯片，具有保持芯片的机械作用，将由矿物层覆盖的芯片转移到临时粘合剂支撑体上，将芯片的后表面朝向该临时粘合剂支撑件移除，初始粘合剂的去除 支撑，将芯片叠加到“卡盘”型的支撑件上，朝向该支撑件的芯片的前表面，去除临时粘合剂支撑件，将树脂沉积在“卡盘”型支撑件上以封装芯片，然后聚合 的树脂，去除“卡盘”型的支撑，生产RDL层有源面。

公开(公告)号：US20130135321A1

公开(公告)日：2013-05-30

申请号：US13485728

申请日：2012-05-31

Applicant: Anjan Ghosh Hajra ,  Swapan Chakrabarti ,  Raju S. Dandu

Inventor： Anjan Ghosh Hajra ,  Swapan Chakrabarti ,  Raju S. Dandu

IPC: G06T15/00

CPC classification number: G06T15/00 ,  H04N13/393

Abstract: A three-dimensional display apparatus electromechanical system for displaying three-dimensional images without special viewing aids is disclosed. The electromechanical apparatus includes three flat surface screens, two rotating wheels or single screen not limited to other variations that will enable similar operation of the apparatus. The imaging system includes a CRT or similar device and control system to generate two-dimensional images to project the images at different depth locations through a focus system on to the moving projection screens.

Abstract translation: 公开了一种用于显示没有特殊观察辅助的三维图像的三维显示装置机电系统。 机电装置包括三个平面屏幕，两个旋转轮或单个屏幕，不限于可实现装置类似操作的其它变型。 成像系统包括CRT或类似的装置和控制系统，以产生二维图像，以便将不同深度位置处的图像通过焦点系统投射到移动的投影屏幕上。

公开(公告)号：US20080316727A1

公开(公告)日：2008-12-25

申请号：US12095157

申请日：2006-11-30

Applicant: Christian Val ,  Olivier Lignier

Inventor： Christian Val ,  Olivier Lignier

IPC: H05K1/14

CPC classification number: H05K1/144 ,  H01L24/19 ,  H01L24/24 ,  H01L24/82 ,  H01L24/96 ,  H01L25/0652 ,  H01L25/105 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/24195 ,  H01L2225/06513 ,  H01L2225/06524 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/19041 ,  H01L2924/3512 ,  H05K1/185

Abstract: The invention relates to a 3D electronic module comprising a stack (100) of at least a first slice (10) and a second slice (30), the first slice (10) having on a face (101) at least one set (4) of electrically conductive protrusions (41), and the second slice (30) comprising at least one zone (61) of electrically insulating material, traversing the thickness of the slice. The second slice (30) comprises at least one electrically conductive element (3) traversing said slice in a zone (61) of electrically insulating material, able to receive a set (4) of protrusions (41) of the first slice (10).

Abstract translation: 本发明涉及一种3D电子模块，其包括至少第一切片（10）和第二切片（30）的堆叠（100），所述第一切片（10）在面部（101）上具有至少一组 ），并且所述第二切片（30）包括穿过所述切片的厚度的至少一个电绝缘材料区（61）。 第二切片（30）包括穿过电绝缘材料区域（61）中的所述切片的至少一个导电元件（3），能够接收第一切片（10）的一组（4）突起（41） 。

公开(公告)号：US20070262443A1

公开(公告)日：2007-11-15

申请号：US11575751

申请日：2005-09-07

Applicant: Christian Val ,  Olivier Lignier ,  Regis Bocage

Inventor： Christian Val ,  Olivier Lignier ,  Regis Bocage

IPC: H01L23/34

CPC classification number: H01L23/3128 ,  H01L23/367 ,  H01L23/3677 ,  H01L23/49838 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/32145 ,  H01L2224/48227 ,  H01L2224/49113 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01087 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/0201 ,  H05K1/111 ,  H05K1/112 ,  H05K3/4641 ,  H05K2201/09718 ,  H05K2201/09745 ,  H05K2201/09781 ,  H05K2203/165 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: The present invention relates to an electronic device incorporating a heat distributor. It applies more particularly to devices of the plastic package type, with one or more levels of components. According to the invention, the electronic device, for example of the package type, is provided for its external connection with pads distributed over a connection surface. It includes a thermally conducting plate lying parallel to said connection surface and having a nonuniform structure making it possible, when the device is exposed to a given external temperature, to supply a controlled amount of heat to each external connection pad according to its position on the connection surface. If the device is a package comprising a support of the printed circuit type, the conducting plate will advantageously form an internal layer of said support.

Abstract translation: 本发明涉及一种并入热分配器的电子设备。 它更具体地应用于塑料封装类型的器件，具有一个或多个级别的部件。 根据本发明，提供了例如封装类型的电子设备，用于其与分布在连接表面上的焊盘的外部连接。 它包括平行于所述连接表面并且具有不均匀结构的导热板，使得当设备暴露于给定的外部温度时，可以根据其在位置上的位置向每个外部连接垫提供受控量的热量 连接面。 如果设备是包括印刷电路类型的支撑体的封装，导电板将有利地形成所述支撑件的内层。

公开(公告)号：US20070117369A1

公开(公告)日：2007-05-24

申请号：US10562685

申请日：2004-06-30

Applicant: Christian Val ,  Olivier Lignier

Inventor： Christian Val ,  Olivier Lignier

IPC: H01L21/00 ,  H01L29/82 ,  H01L21/4763

CPC classification number: H01L24/85 ,  H01G4/228 ,  H01G4/40 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/5389 ,  H01L24/48 ,  H01L24/73 ,  H01L24/96 ,  H01L24/97 ,  H01L25/16 ,  H01L25/50 ,  H01L2224/04105 ,  H01L2224/16225 ,  H01L2224/24137 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/85001 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01056 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2224/85 ,  H01L2924/00012 ,  H01L2224/45099

Abstract: The present invention relates to a method for the thin interconnection of active and passive components in two or three dimensions, and to the resulting thin heterogeneous components. According to the invention, the method comprises: positioning and fixing (11) at least one active component and one passive component on a flat support (23), the terminals being in contact with the support, depositing (12) a polymer layer (24) on all of the support and said components, removing the support (14), redistributing the terminals (15) between the components and/or toward the periphery by means of metal conductors (26) arranged in a predetermined layout, making it possible to obtain a heterogeneous reconstituted structure, heterogeneously thinning (16) said structure by nonselective surface treatment of the polymer layer and at least one passive component (22).

Abstract translation: 本发明涉及一种用于两个或三个维度的主动和被动部件的薄互连以及由此产生的薄异质部件的方法。 根据本发明，所述方法包括：在平坦支撑件（23）上定位和固定（11）至少一个有源部件和一个无源部件，所述端子与所述支撑件接触，沉积（12）聚合物层（24） ）在所有支撑件和所述部件上，通过以预定布置布置的金属导体（26）去除支撑件（14），将端子（15）重新分配在部件之间和/或朝向周边，使得可以 通过聚合物层和至少一个无源部件（22）的非选择性表面处理，获得非均匀重构的结构，使所述结构非均匀地稀化（16）。

公开(公告)号：US20210391801A1

公开(公告)日：2021-12-16

申请号：US17342487

申请日：2021-06-08

Applicant: 3D PLUS

Inventor： Cédric COLONNA

IPC: H02M3/335 ,  H02M1/00 ,  H02M3/337

Abstract: A power converter having a parallel resonant circuit, includes an inverter, a resonant circuit, a transformer comprising a primary circuit and a secondary circuit, control means for the inverter, the inverter being connected to the resonant circuit, which is intended to be connected to an output load via the transformer, the power converter wherein the inverter comprises a first half-bridge and a second half-bridge in parallel with the first half-bridge, a first inductor between the first half-bridge and the resonant circuit, a second inductor between the second half-bridge and the resonant circuit, and in that the first and second inductors have the same inductance and are coupled in the opposite direction to one another.