公开(公告)号：US08932939B1

公开(公告)日：2015-01-13

申请号：US14252597

申请日：2014-04-14

Applicant: Wei-Sheng Lei ,  James S. Papanu ,  Brad Eaton ,  Ajay Kumar

Inventor： Wei-Sheng Lei ,  James S. Papanu ,  Brad Eaton ,  Ajay Kumar

IPC: H01L21/00 ,  H01L21/683 ,  H01L21/78

CPC classification number: H01L21/6836 ,  H01L21/3065 ,  H01L21/3086 ,  H01L21/561 ,  H01L21/563 ,  H01L21/67069 ,  H01L21/67115 ,  H01L21/67207 ,  H01L21/78 ,  H01L23/3114 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2221/6834 ,  H01L2224/13017 ,  H01L2224/13022 ,  H01L2224/131 ,  H01L2924/014

Abstract: Methods and systems for forming water soluble masks by dry film lamination are described. Also described are methods of wafer dicing, including formation of a water soluble mask by dry film lamination. In one embodiment, a method involves moisturizing an inner area of a water soluble dry film. The method involves stretching the water soluble dry film over a surface of the semiconductor wafer, and attaching the moistened inner area of the stretched film to the surface of the semiconductor wafer. A method of wafer dicing may further involve patterning the water soluble dry film, exposing regions of the semiconductor wafer between the ICs, and etching the semiconductor wafer through gaps in the patterned water soluble dry film.

Abstract translation: 描述了通过干膜层压形成水溶性掩模的方法和系统。 还描述了晶片切割的方法，包括通过干膜层压形成水溶性掩模。 在一个实施方案中，一种方法涉及保湿水溶性干膜的内部区域。 该方法包括在半导体晶片的表面上拉伸水溶性干膜，并将拉伸膜的湿润内部区域附着到半导体晶片的表面。 晶片切割的方法还可以包括图案化水溶性干膜，暴露半导体晶片在IC之间的区域，以及通过图案化的水溶性干膜中的间隙蚀刻半导体晶片。

公开(公告)号：US08912077B2

公开(公告)日：2014-12-16

申请号：US13161052

申请日：2011-06-15

Applicant: Saravjeet Singh ,  Brad Eaton ,  Ajay Kumar ,  Wei-Sheng Lei ,  James M. Holden ,  Madhava Rao Yalamanchili ,  Todd J. Egan

Inventor： Saravjeet Singh ,  Brad Eaton ,  Ajay Kumar ,  Wei-Sheng Lei ,  James M. Holden ,  Madhava Rao Yalamanchili ,  Todd J. Egan

IPC: H01L21/00

CPC classification number: H01L21/67069 ,  B23K26/0624 ,  B23K26/064 ,  B23K26/36 ,  B23K26/364 ,  B23K26/40 ,  B23K26/402 ,  B23K2103/172 ,  B23K2103/50 ,  H01L21/3065 ,  H01L21/3081 ,  H01L21/67092 ,  H01L21/67207 ,  H01L21/6836 ,  H01L21/68707 ,  H01L21/78 ,  H01L2221/68327 ,  H01L2221/68377

Abstract: Methods of dicing semiconductor wafers, each wafer having a plurality of integrated circuits, are described. A method includes forming a mask above the semiconductor wafer, the mask composed of a layer covering and protecting the integrated circuits. The semiconductor wafer is supported by a substrate carrier. The mask is then patterned with a laser scribing process to provide a patterned mask with gaps, exposing regions of the semiconductor wafer between the integrated circuits. The semiconductor wafer is then etched through the gaps in the patterned mask to singulate the integrated circuits while supported by the substrate carrier.

Abstract translation: 对具有多个集成电路的每个晶片进行切割的半导体晶片的方法进行了说明。 一种方法包括在半导体晶片上形成掩模，掩模由覆盖并保护集成电路的层组成。 半导体晶片由衬底载体支撑。 然后用激光划线工艺对掩模进行构图，以提供具有间隙的图案化掩模，暴露集成电路之间的半导体晶片的区域。 然后通过图案化掩模中的间隙蚀刻半导体晶片，以在由衬底载体支撑的同时对集成电路进行分离。

公开(公告)号：US20140363952A1

公开(公告)日：2014-12-11

申请号：US14466671

申请日：2014-08-22

Applicant: Wei-Sheng Lei ,  Brad Eaton ,  Madhava Rao Yalamanchili ,  Saravjeet Singh ,  Ajay Kumar

Inventor： Wei-Sheng Lei ,  Brad Eaton ,  Madhava Rao Yalamanchili ,  Saravjeet Singh ,  Ajay Kumar

IPC: H01L21/78 ,  H01L21/02 ,  H01L21/027

CPC classification number: H01L21/78 ,  H01L21/02013 ,  H01L21/02016 ,  H01L21/02019 ,  H01L21/027 ,  Y10T29/5124

Abstract: Front side laser scribing and plasma etch are performed followed by back side grind to singulate integrated circuit chips (ICs). A mask is formed covering ICs formed on the wafer, as well as any bumps providing an interface to the ICs. The mask is patterned by laser scribing to provide a patterned mask with gaps. The patterning exposes regions of the semiconductor wafer, below thin film layers from which the ICs are formed. The semiconductor wafer is then etched through the gaps in the patterned mask to advance a front of an etched trench partially through the semiconductor wafer thickness. The front side mask is removed, a backside grind tape applied to the front side, and a back side grind performed to reach the etched trench, thereby singulating the ICs.

Abstract translation: 执行前侧激光划线和等离子体蚀刻，然后进行背面研磨以分离集成电路芯片（IC）。 形成覆盖在晶片上形成的IC的掩模，以及提供与IC的接口的任何凸块。 通过激光划线将掩模图案化以提供具有间隙的图案化掩模。 图案化使得半导体晶片的区域在形成IC的薄膜层之下露出。 然后通过图案化掩模中的间隙蚀刻半导体晶片，以使蚀刻沟槽的前部部分地延伸穿过半导体晶片厚度。 去除前侧面罩，施加到前侧的背面研磨带，和进行到蚀刻沟槽的后侧研磨，由此分离IC。

公开(公告)号：US08856776B2

公开(公告)日：2014-10-07

申请号：US12366175

申请日：2009-02-05

Applicant: Ajay Kumar Mahajan ,  Atit D Patel

Inventor： Ajay Kumar Mahajan ,  Atit D Patel

IPC: G06F9/445 ,  G06F11/20

CPC classification number: G06F8/67 ,  G06F8/656 ,  G06F11/2023 ,  G06F11/2038

Abstract: A method, system, and computer usable program product for updating firmware without disrupting service are provided in the illustrative embodiments. An updated firmware code is sent to a first firmware component and a second firmware component. The first firmware component is a primary firmware component and the second firmware component is a backup firmware component in a redundant firmware configuration. The updated firmware code is installed in second firmware component. The updated firmware code is activated in a third firmware component. The third firmware component is in communication with the first firmware component. A fail-over from the first firmware component to the second firmware component is performed such that a user communicating with the data processing system and receiving a service using the first firmware component continues to receive the service using the second firmware component without a disruption in the service.

Abstract translation: 在说明性实施例中提供了用于在不中断服务的情况下更新固件的方法，系统和计算机可用程序产品。 更新的固件代码被发送到第一固件组件和第二固件组件。 第一个固件组件是主要固件组件，第二个固件组件是冗余固件配置中的备份固件组件。 更新的固件代码安装在第二固件组件中。 在第三固件组件中激活更新的固件代码。 第三固件组件与第一固件组件通信。 执行从第一固件组件到第二固件组件的故障转移，使得与数据处理系统通信并且使用第一固件组件接收服务的用户继续使用第二固件组件接收服务而不会中断 服务。

公开(公告)号：US20140284918A1

公开(公告)日：2014-09-25

申请号：US13804901

申请日：2013-03-14

Applicant: Ajay Kumar

Inventor： Ajay Kumar

IPC: F16L15/08

CPC classification number: F16L19/025 ,  Y10T29/49826

Abstract: A coupling assembly for coupling annular fittings includes first and second coupling elements. The first coupling element defines interior and exterior opposite surfaces, and first and second end opposite portions. The first coupling element includes a plurality of flexible tabs slantedly protruding from the exterior surface; and also includes threads configured along the interior surface at the first end portion. The second end portion is non-threaded. The second coupling element defines inner and outer opposite surfaces. The second coupling element includes a plurality of rigid tabs vertically protruding from the inner surface. The second coupling element coaxially engages the first coupling element such that the flexible tabs and rigid tabs interact with each other to tighten and loosen the coupling assembly against the annular fittings via torque application. While tightening, the non-threaded second end portion and the flexible tabs and rigid tabs combination preclude over-tightening.

Abstract translation: 用于联接环形配件的联接组件包括第一和第二联接元件。 第一联接元件限定内部和外部相对表面以及第一和第二端相对部分。 第一联接元件包括从外表面倾斜地突出的多个柔性突片; 并且还包括沿着第一端部处的内表面构造的螺纹。 第二端部是无螺纹的。 第二联接元件限定内和外相对表面。 第二联接元件包括从内表面垂直突出的多个刚性突片。 第二联接元件同轴地接合第一联接元件，使得柔性翼片和刚性翼片彼此相互作用，以通过扭矩施加紧固和松开联接组件抵靠环形配件。 在紧固的同时，无螺纹的第二端部以及柔性凸片和刚性凸片组合排除了过度紧固。

公开(公告)号：US08826367B2

公开(公告)日：2014-09-02

申请号：US13104184

申请日：2011-05-10

Applicant: Ajay Kumar Srivastava ,  Anil Kumar Goel

Inventor： Ajay Kumar Srivastava ,  Anil Kumar Goel

IPC: G06F9/50

CPC classification number: G06F9/5072

Abstract: System, method, computer program product embodiments and combinations and sub-combinations thereof for elastic resource provisioning are provided. An embodiment includes grouping physical resources in an asymmetric distributed cluster of data processing nodes logically into one or more provisions. Further included are configuring access to the physical resources with the one or more provisions, and managing adjustment of operations among the data processing nodes in correspondence with adjustment to the physical resources through the one or more provisions and transparently to an application utilizing the physical resources.

Abstract translation: 提供了用于弹性资源提供的系统，方法，计算机程序产品实施例及其组合和子组合。 一个实施例包括将数据处理节点的非对称分布式集群中的物理资源逻辑地分组成一个或多个规定。 进一步包括通过一个或多个规定配置对物理资源的访问，以及通过一个或多个规定来管理数据处理节点之间的操作的调整，并且透明地利用利用物理资源的应用。

公开(公告)号：US20140243383A1

公开(公告)日：2014-08-28

申请号：US14238777

申请日：2012-08-24

Applicant: Sunilendu Bhushan Roy ,  Sushrut Krishnaji Kulkarni ,  Ajay Kumar Handa ,  Doss Pothuvan Uma

Inventor： Sunilendu Bhushan Roy ,  Sushrut Krishnaji Kulkarni ,  Ajay Kumar Handa ,  Doss Pothuvan Uma

IPC: A61K31/404

CPC classification number: A61K31/404 ,  A61K9/1623 ,  A61K9/1635 ,  A61K9/1641 ,  A61K9/1652 ,  A61K9/4858 ,  A61K31/405

Abstract: The present invention discloses a stable pharmaceutical composition comprising: (a) plurality of granules comprising silodosin or salts thereof and one or more pharmaceutical excipients; and (b) an extragranular portion comprising one or more lubricants and optionally one or more surfactants, wherein the granules are free of partially pregelatinized starch.

Abstract translation: 本发明公开了一种稳定的药物组合物，其包含：（a）多种颗粒，其包含西洛多辛或其盐和一种或多种药物赋形剂; 和（b）包含一种或多种润滑剂和任选的一种或多种表面活性剂的颗粒外部分，其中所述颗粒不含部分预胶化淀粉。

公开(公告)号：US20140213041A1

公开(公告)日：2014-07-31

申请号：US14158529

申请日：2014-01-17

Applicant: Wei-Sheng LEI ,  Saravjeet SINGH ,  Jivko DINEV ,  Aparna IYER ,  Brad EATON ,  Ajay KUMAR

Inventor： Wei-Sheng LEI ,  Saravjeet SINGH ,  Jivko DINEV ,  Aparna IYER ,  Brad EATON ,  Ajay KUMAR

IPC: H01L21/78 ,  H01L21/3065 ,  H01L21/308 ,  H01L21/027

CPC classification number: H01L21/78 ,  B23K26/364 ,  B23K26/40 ,  B23K26/402 ,  B23K2103/172 ,  B23K2103/50 ,  H01J37/32009 ,  H01L21/0271 ,  H01L21/3065 ,  H01L21/31105 ,  H01L21/31127 ,  H01L21/6836 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/68381

Abstract: Laser and plasma etch wafer dicing where a mask is formed covering ICs formed on the wafer, as well as any bumps providing an interface to the ICs. The semiconductor wafer is coupled to a film frame by an adhesive film. The mask is patterned by laser scribing to provide a patterned mask with gaps. The laser scribing exposes regions of the semiconductor wafer, below thin film layers from which the ICs are formed. The semiconductor wafer is plasma etched through the gaps in the patterned mask while the film frame is maintained at an acceptably low temperature with a chamber shield ring configured to sit beyond the wafer edge and cover the frame. The shield ring may be raised and lowered, for example, on lifter pins to facilitate transfer of the wafer on frame.

Abstract translation: 激光和等离子体蚀刻晶片切割，其中形成掩模以覆盖形成在晶片上的IC，以及提供与IC的界面的任何凸块。 半导体晶片通过粘合膜耦合到胶片框架。 通过激光划线将掩模图案化以提供具有间隙的图案化掩模。 激光划线使半导体晶片的区域露出在形成有IC的薄膜层的下方。 半导体晶片通过图案化掩模中的间隙进行等离子体蚀刻，同时膜框架被保持在可接受的低温下，腔室屏蔽环被配置为超过晶片边缘并覆盖框架。 屏蔽环可以升高和降低，例如在升降器销上，以促进晶片在框架上的传送。

公开(公告)号：US08775882B2

公开(公告)日：2014-07-08

申请号：US13162784

申请日：2011-06-17

Applicant: Ajay Kumar Dimri

Inventor： Ajay Kumar Dimri

IPC: G01R31/28

CPC classification number: G01R31/318541

Abstract: A first circuit has a reset input. A second circuit is configured to be reset and provide an output. A test circuit is configured to test the first circuit and second circuit. The test circuit is configured such that a fault with the first circuit and said second circuit is determined in dependence on an output of the first circuit.

Abstract translation: 第一电路具有复位输入。 第二电路被配置为复位并提供输出。 测试电路被配置为测试第一电路和第二电路。 测试电路被配置为使得根据第一电路的输出来确定与第一电路和所述第二电路的故障。

公开(公告)号：US08769519B2

公开(公告)日：2014-07-01

申请号：US13315270

申请日：2011-12-08

Applicant: Robert K. Leitman ,  Kashif Mehmood ,  Amjad Hussain ,  Ido Miles Ben-Shachar ,  Sriram Sampath ,  Ajay Kumar

Inventor： Robert K. Leitman ,  Kashif Mehmood ,  Amjad Hussain ,  Ido Miles Ben-Shachar ,  Sriram Sampath ,  Ajay Kumar

IPC: G06F9/44 ,  G06F9/455 ,  G06F9/445

CPC classification number: G06F8/65 ,  G06F9/452 ,  G06F9/5027 ,  G06F2009/45562 ,  G06F2209/504 ,  Y02D10/22

Abstract: The updating of virtual machines. A task broker schedules update tasks for multiple virtual machines on the host machine. As each update task is to be performed, if the virtual machine is not currently running, as might be the case for a personal virtual machine, the virtual machine is caused to begin running to allow the update task to be performed on the virtual machine. Also, a pooled virtual machine is updated by copying information from the old virtual hard drive to a location to allow the information to be preserved as the master image is updated. After the update is completed, the virtual machine is formed, associated with the new virtual hard drive, and copied back to the virtual machine.

Abstract translation: 更新虚拟机。 任务代理程序为主机上的多个虚拟机安排更新任务。 在执行每个更新任务时，如果虚拟机当前没有运行，就像个人虚拟机的情况一样，使虚拟机开始运行，以允许在虚拟机上执行更新任务。 此外，通过将信息从旧的虚拟硬盘驱动器复制到一个位置来更新池虚拟机，以允许在更新主映像时保留信息。 更新完成后，形成虚拟机，与新的虚拟硬盘相关联，并复制回虚拟机。